the item being non-metallic

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H01L2224/16225

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16225the item being non-metallic

Industries

Patents Grantslast 30 patents

Information Patent Grant
Platforms including microelectronic packages therein coupled to a c...
- Patent number 12,150,271
- Issue date Nov 19, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active bridge enabled co-packaged photonic transceiver
- Patent number 12,148,742
- Issue date Nov 19, 2024
- Intel Corporation
- Thomas Liljeberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,148,680
- Issue date Nov 19, 2024
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-packaging photonic integrated circuits and application specific...
- Patent number 12,147,073
- Issue date Nov 19, 2024
- Acacia Communications, Inc.
- Christopher Doerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride (GAN) three-dimensional integrated circuit technology
- Patent number 12,148,747
- Issue date Nov 19, 2024
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes, components and related methods
- Patent number 12,142,711
- Issue date Nov 12, 2024
- CreeLED, Inc.
- Peter Scott Andrews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in the packaging of integrated circuits
- Patent number 12,144,065
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,142,560
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 12,142,348
- Issue date Nov 12, 2024
- RAMBUS INC.
- Ian Shaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip with shared clock distribution network
- Patent number 12,142,528
- Issue date Nov 12, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and method of manufacturing the same, semiconducto...
- Patent number 12,144,120
- Issue date Nov 12, 2024
- Dai Nippon Printing Co., Ltd.
- Ryohei Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and fabrication method thereof
- Patent number 12,136,581
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Youngho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 12,136,565
- Issue date Nov 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interface bridge between integrated circuit die
- Patent number 12,135,667
- Issue date Nov 5, 2024
- Altera Corporation
- Jeffrey Erik Schulz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory bandwidth aggregation using simultaneous access of stacked s...
- Patent number 12,131,796
- Issue date Oct 29, 2024
- RAMBUS INC.
- Yohan Frans
- G11 - INFORMATION STORAGE
Information Patent Grant
Package embedded magnetic inductor structures and manufacturing tec...
- Patent number 12,132,015
- Issue date Oct 29, 2024
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 12,125,775
- Issue date Oct 22, 2024
- Nepes Co., Ltd.
- Byung Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,119,306
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 12,119,238
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and circuit board containing the same
- Patent number 12,112,891
- Issue date Oct 8, 2024
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit film having a power wiring set and display apparat...
- Patent number 12,113,007
- Issue date Oct 8, 2024
- Samsung Display Co., Ltd.
- BoYeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having an electronic component and an encapsulant encapsula...
- Patent number 12,112,992
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dual sides of metal routing
- Patent number 12,113,025
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized high density substrate routing
- Patent number 12,107,042
- Issue date Oct 1, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,100,668
- Issue date Sep 24, 2024
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,100,697
- Issue date Sep 24, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded resistor-capacitor film for fan out wafer level packaging
- Patent number 12,100,674
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Ernesto Gutierrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 12,094,729
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...
- Publication number 20240387317
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...
- Publication number 20240387324
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWE...
- Publication number 20240387345
- Publication date Nov 21, 2024
- QUALCOMM Incorporated
- Venkatesh Sadineni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387413
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Jaejun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...
- Publication number 20240387459
- Publication date Nov 21, 2024
- Microsoft Technology Licensing, LLC
- Haohua ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TRANSMISSIVE LAYER AND MANUFACTURING METH...
- Publication number 20240387785
- Publication date Nov 21, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387337
- Publication date Nov 21, 2024
- Innolux Corporation
- Ying-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CATHODE FOR A SOLID-STATE BATTERY
- Publication number 20240387863
- Publication date Nov 21, 2024
- Corning Incorporated
- Michael Edward Badding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387457
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20240387322
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...
- Publication number 20240387323
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS
- Publication number 20240388018
- Publication date Nov 21, 2024
- Intel Corporation
- Karumbu MEYYAPPAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Vertical Interconnect Architecture and Methods Fo...
- Publication number 20240387458
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Suketu PARIKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF MAKING
- Publication number 20240387500
- Publication date Nov 21, 2024
- Yibu Semiconductor Co., Ltd.
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING
- Publication number 20240379487
- Publication date Nov 14, 2024
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379609
- Publication date Nov 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Wei-Shen HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240379638
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATI...
- Publication number 20240379502
- Publication date Nov 14, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240379636
- Publication date Nov 14, 2024
- nD-HI Technologies Lab, Inc.
- HO-MING TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE HAVING A STIFFENER AND AN ELECTRONIC DEVICE HAVING THE...
- Publication number 20240379476
- Publication date Nov 14, 2024
- ADVANCED MICRO DEVICES, INC.
- Zean XIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE WITH WARPAGE CONTROL
- Publication number 20240379640
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Heh-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STACK AND A METHOD FOR FORMING THE SAME
- Publication number 20240379525
- Publication date Nov 14, 2024
- STATS ChipPAC Pte Ltd.
- YoungGeun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240379535
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH A GLASS INTERPOSER
- Publication number 20240371714
- Publication date Nov 7, 2024
- ADVANCED MICRO DEVICES, INC.
- Deepak Vasant KULKARNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND A PACKAGING METHOD
- Publication number 20240371812
- Publication date Nov 7, 2024
- STATS ChipPAC Pte Ltd.
- MyungHo JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIANT SUBSTRATE HEATING FOR THERMOCOMPRESSIVE BONDING AND APPARAT...
- Publication number 20240371816
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Hua Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240373545
- Publication date Nov 7, 2024
- Siliconware Precision Industries Co., Ltd.
- Hsiang-Hua HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371785
- Publication date Nov 7, 2024
- Powertech Technology Inc.
- Ching-Wei Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS USING BOTH SURFACES OF A WAFER AND MANUFACT...
- Publication number 20240371831
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Joonho Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240371808
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Won-Young KIM
- H01 - BASIC ELECTRIC ELEMENTS

the item being non-metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Platforms including microelectronic packages therein coupled to a c...

Active bridge enabled co-packaged photonic transceiver

Semiconductor device and method of manufacturing the same

Co-packaging photonic integrated circuits and application specific...

Gallium nitride (GAN) three-dimensional integrated circuit technology

Light emitting diodes, components and related methods

Warpage control in the packaging of integrated circuits

Semiconductor packages and methods of forming same

Memory device comprising programmable command-and-address and/or da...

3D chip with shared clock distribution network

Wiring structure and method of manufacturing the same, semiconducto...

Semiconductor package structure and fabrication method thereof

Semiconductor device package and manufacturing method thereof

Interface bridge between integrated circuit die

Memory bandwidth aggregation using simultaneous access of stacked s...

Package embedded magnetic inductor structures and manufacturing tec...

Semiconductor package and method for manufacturing the same

Semiconductor package

Semiconductor bonding structures and methods

Multilayer capacitor and circuit board containing the same

Flexible circuit film having a power wiring set and display apparat...

Package having an electronic component and an encapsulant encapsula...

Multi-chip package and method of providing die-to-die interconnects...

Semiconductor package with dual sides of metal routing

Localized high density substrate routing

Offset interposers for large-bottom packages and large-die package-...

Semiconductor package

Semiconductor package structure

Embedded resistor-capacitor film for fan out wafer level packaging

Semiconductor device with encapsulant deposited along sides and sur...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...

INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...

CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWE...

SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...

SEMICONDUCTOR DEVICE WITH TRANSMISSIVE LAYER AND MANUFACTURING METH...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

CATHODE FOR A SOLID-STATE BATTERY

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...

LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS

Three-Dimensional Vertical Interconnect Architecture and Methods Fo...

MULTI-CHIP PACKAGE AND METHOD OF MAKING

PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATI...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

CHIP PACKAGE HAVING A STIFFENER AND AN ELECTRONIC DEVICE HAVING THE...

METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE WITH WARPAGE CONTROL

SEMICONDUCTOR PACKAGE STACK AND A METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

CHIP PACKAGE WITH A GLASS INTERPOSER

ELECTRONIC PACKAGE AND A PACKAGING METHOD

RADIANT SUBSTRATE HEATING FOR THERMOCOMPRESSIVE BONDING AND APPARAT...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR APPARATUS USING BOTH SURFACES OF A WAFER AND MANUFACT...

SEMICONDUCTOR PACKAGE