the item being non-metallic

Industry

CPC
H01L2224/08225

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/08225the item being non-metallic

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Embedded cooling systems for advanced device packaging and methods...
- Patent number 12,368,087
- Issue date Jul 22, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth die to die interconnect with package area reduction
- Patent number 12,368,137
- Issue date Jul 22, 2025
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package
- Patent number 12,362,329
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,354,929
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-role semiconductor device substrates, semiconductor device as...
- Patent number 12,354,939
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microdevice integration into system substrate
- Patent number 12,349,527
- Issue date Jul 1, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having a hybrid bonded interposer for di...
- Patent number 12,341,114
- Issue date Jun 24, 2025
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,336,359
- Issue date Jun 17, 2025
- Samsung Display Co., Ltd.
- Joo Woan Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid channel geometry optimizations to improve cooling efficiency
- Patent number 12,322,677
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Ron Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel including opaque encapsulation and doped planarizatio...
- Patent number 12,322,735
- Issue date Jun 3, 2025
- Au Optronics Corporation
- Fu-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro LED based display panel
- Patent number 12,315,852
- Issue date May 27, 2025
- Apple Inc.
- Dmitry S. Sizov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector and method for forming the same
- Patent number 12,300,645
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded structure with multi-height components comprising back...
- Patent number 12,300,561
- Issue date May 13, 2025
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint recognition module and electronic device comprising same
- Patent number 12,300,676
- Issue date May 13, 2025
- LG Innotek Co., Ltd
- Seung Ho Jeon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Liquid cooled interposer for integrated circuit stack
- Patent number 12,300,579
- Issue date May 13, 2025
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel including driving backplane
- Patent number 12,295,172
- Issue date May 6, 2025
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Can Huang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device with open cavity and method therefor
- Patent number 12,288,766
- Issue date Apr 29, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 12,283,577
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,278,214
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package structure having inte...
- Patent number 12,278,190
- Issue date Apr 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having interconnections between die...
- Patent number 12,272,651
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, method of manufacturing display panel, and display d...
- Patent number 12,266,621
- Issue date Apr 1, 2025
- TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jinming Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package
- Patent number 12,266,639
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded dies in semiconductor packages and methods of forming same
- Patent number 12,261,163
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D package configuration
- Patent number 12,255,180
- Issue date Mar 18, 2025
- CCS TECHNOLOGY CORPORATION
- Tung-Po Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structure with bifunctional routing and assembly compris...
- Patent number 12,249,572
- Issue date Mar 11, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Candice Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and display unit
- Patent number 12,249,597
- Issue date Mar 11, 2025
- Osram Opto Semiconductors GmbH
- Sebastian Wittmann
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device with open cavity and method therefor
- Patent number 12,243,842
- Issue date Mar 4, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having topside power delivery structures
- Patent number 12,243,828
- Issue date Mar 4, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,256
- Issue date Feb 25, 2025
- Samsung Electronics Co, Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD OF ELECTRONIC PACKAGE
- Publication number 20250239530
- Publication date Jul 24, 2025
- VIA TECHNOLOGIES, INC.
- Yeh-Chi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...
- Publication number 20250239548
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yung Lin Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...
- Publication number 20250239578
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tso-Jung Chang
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH INTERPOSER DIES
- Publication number 20250239579
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tso-Jung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH INTERPOSER
- Publication number 20250233109
- Publication date Jul 17, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250233094
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Kyung Don Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250233113
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PREPARING METHOD THEREOF
- Publication number 20250233033
- Publication date Jul 17, 2025
- TRIPLE WIN TECHNOLOGY (SHENZHEN) CO.LTD.
- HUNG-TA LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226274
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Younjeong CHOE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLY, CHIP INTERPOSER AND FABRICATING METHOD FOR CHIP ASSE...
- Publication number 20250226327
- Publication date Jul 10, 2025
- HYGON INFORMATION TECHNOLOGY CO., LTD.
- Xiaodi Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING IMPEDANCE ADAPTER
- Publication number 20250226365
- Publication date Jul 10, 2025
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250226364
- Publication date Jul 10, 2025
- Advanced Semiconductor Engineering, Inc.
- Hung Yi CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING A PLURALITY OF INTEGRATED CIRCUITS AND METHOD OF...
- Publication number 20250226304
- Publication date Jul 10, 2025
- STMicroelectronics International N.V.
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Chip-on-Wafer Underfill...
- Publication number 20250219006
- Publication date Jul 3, 2025
- STATS ChipPAC Pte Ltd.
- Marites Roque
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN INTEGRATED OPTICAL CHIP PACKAGE DEVICE AND MET...
- Publication number 20250216600
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL PATH TO CARRIER SUB...
- Publication number 20250218891
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Shih Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BOND INTERCONNECT ARCHITECTURES FOR PACKAGING ASSEMBLIES
- Publication number 20250218988
- Publication date Jul 3, 2025
- Intel Corporation
- Yosuke KANAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250218916
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Seungwan Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250210420
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bang Li Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250210560
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Ji-Han KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS...
- Publication number 20250210459
- Publication date Jun 26, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPACKAGING STRUCTURE
- Publication number 20250210498
- Publication date Jun 26, 2025
- Industrial Technology Research Institute
- Shih-Hsien WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210542
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Wooyeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR MONITORING HYBRID BONDS IN A SEMICONDUCTOR CHIP PACKAGE
- Publication number 20250201638
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING INSULATION MEMBRANE FORMING MATERIAL, METHOD OF PROD...
- Publication number 20250201760
- Publication date Jun 19, 2025
- HD MICROSYSTEMS, LTD.
- Kenya ADACHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SIGNAL LINES FOR SEMICONDUCTOR DEVICES
- Publication number 20250201693
- Publication date Jun 19, 2025
- Altera Corporation
- Arturo PACHON MUNOZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING INTEGRATED DEVICES AND A PASSIVE DEVICE
- Publication number 20250201786
- Publication date Jun 19, 2025
- QUALCOMM Incorporated
- Yue LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRONG BONDING STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20250201739
- Publication date Jun 19, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES WITH ANTENNAS AND RF REFLECTORS AND METHODS OF F...
- Publication number 20250202097
- Publication date Jun 19, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR A LIQUID COOLING PACKAGE ARCHITECTURE
- Publication number 20250201669
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS

the item being non-metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedded cooling systems for advanced device packaging and methods...

High bandwidth die to die interconnect with package area reduction

Method of fabricating semiconductor package

Package structure and manufacturing method thereof

Multi-role semiconductor device substrates, semiconductor device as...

Microdevice integration into system substrate

Microelectronic assemblies having a hybrid bonded interposer for di...

Display device

Fluid channel geometry optimizations to improve cooling efficiency

Display panel including opaque encapsulation and doped planarizatio...

Micro LED based display panel

Connector and method for forming the same

Fully molded structure with multi-height components comprising back...

Fingerprint recognition module and electronic device comprising same

Liquid cooled interposer for integrated circuit stack

Display panel including driving backplane

Semiconductor device with open cavity and method therefor

Fan-out semiconductor package

Integrated circuit package and method

Manufacturing method of semiconductor package structure having inte...

Semiconductor package structure having interconnections between die...

Display panel, method of manufacturing display panel, and display d...

Method of fabricating semiconductor package

Molded dies in semiconductor packages and methods of forming same

3D package configuration

Integrated structure with bifunctional routing and assembly compris...

Display device and display unit

Semiconductor device with open cavity and method therefor

Microelectronic assemblies having topside power delivery structures

Semiconductor package

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD OF ELECTRONIC PACKAGE

BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...

OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...

SEMICONDUCTOR PACKAGE STRUCTURE WITH INTERPOSER DIES

PACKAGE ARCHITECTURE WITH INTERPOSER

SEMICONDUCTOR PACKAGES

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

PACKAGING STRUCTURE AND PREPARING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

CHIP ASSEMBLY, CHIP INTERPOSER AND FABRICATING METHOD FOR CHIP ASSE...

INTEGRATED CIRCUIT DEVICE INCLUDING IMPEDANCE ADAPTER

PACKAGE STRUCTURE

DEVICE COMPRISING A PLURALITY OF INTEGRATED CIRCUITS AND METHOD OF...

Semiconductor Device and Method of Making a Chip-on-Wafer Underfill...

METHOD OF FORMING AN INTEGRATED OPTICAL CHIP PACKAGE DEVICE AND MET...

INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL PATH TO CARRIER SUB...

DIRECT BOND INTERCONNECT ARCHITECTURES FOR PACKAGING ASSEMBLIES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

INTEGRATED CIRCUIT PACKAGES AND METHODS

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS...

REPACKAGING STRUCTURE

SEMICONDUCTOR PACKAGE

STRUCTURE FOR MONITORING HYBRID BONDS IN A SEMICONDUCTOR CHIP PACKAGE

HYBRID BONDING INSULATION MEMBRANE FORMING MATERIAL, METHOD OF PROD...

SIGNAL LINES FOR SEMICONDUCTOR DEVICES

PACKAGE COMPRISING INTEGRATED DEVICES AND A PASSIVE DEVICE

STRONG BONDING STRUCTURES AND METHODS OF FORMING THE SAME

ELECTRONIC DEVICES WITH ANTENNAS AND RF REFLECTORS AND METHODS OF F...

SYSTEM AND METHODS FOR A LIQUID COOLING PACKAGE ARCHITECTURE