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H01L2224/08225
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/08225
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Patents Grants
last 30 patents
Information
Patent Grant
Embedded cooling systems for advanced device packaging and methods...
Patent number
12,368,087
Issue date
Jul 22, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High bandwidth die to die interconnect with package area reduction
Patent number
12,368,137
Issue date
Jul 22, 2025
Apple Inc.
Chonghua Zhong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating semiconductor package
Patent number
12,362,329
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Yi Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
12,354,929
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Kai-Fung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-role semiconductor device substrates, semiconductor device as...
Patent number
12,354,939
Issue date
Jul 8, 2025
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microdevice integration into system substrate
Patent number
12,349,527
Issue date
Jul 1, 2025
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies having a hybrid bonded interposer for di...
Patent number
12,341,114
Issue date
Jun 24, 2025
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device
Patent number
12,336,359
Issue date
Jun 17, 2025
Samsung Display Co., Ltd.
Joo Woan Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display panel including opaque encapsulation and doped planarizatio...
Patent number
12,322,735
Issue date
Jun 3, 2025
Au Optronics Corporation
Fu-Wei Chan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fluid channel geometry optimizations to improve cooling efficiency
Patent number
12,322,677
Issue date
Jun 3, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Ron Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro LED based display panel
Patent number
12,315,852
Issue date
May 27, 2025
Apple Inc.
Dmitry S. Sizov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Connector and method for forming the same
Patent number
12,300,645
Issue date
May 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fully molded structure with multi-height components comprising back...
Patent number
12,300,561
Issue date
May 13, 2025
Deca Technologies USA, Inc.
Clifford Sandstrom
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fingerprint recognition module and electronic device comprising same
Patent number
12,300,676
Issue date
May 13, 2025
LG Innotek Co., Ltd
Seung Ho Jeon
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Liquid cooled interposer for integrated circuit stack
Patent number
12,300,579
Issue date
May 13, 2025
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display panel including driving backplane
Patent number
12,295,172
Issue date
May 6, 2025
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
Can Huang
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Semiconductor device with open cavity and method therefor
Patent number
12,288,766
Issue date
Apr 29, 2025
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out semiconductor package
Patent number
12,283,577
Issue date
Apr 22, 2025
Samsung Electronics Co., Ltd.
Joonsung Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method
Patent number
12,278,214
Issue date
Apr 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor package structure having inte...
Patent number
12,278,190
Issue date
Apr 15, 2025
NANYA TECHNOLOGY CORPORATION
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure having interconnections between die...
Patent number
12,272,651
Issue date
Apr 8, 2025
NANYA TECHNOLOGY CORPORATION
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display panel, method of manufacturing display panel, and display d...
Patent number
12,266,621
Issue date
Apr 1, 2025
TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
Jinming Shi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating semiconductor package
Patent number
12,266,639
Issue date
Apr 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Yi Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded dies in semiconductor packages and methods of forming same
Patent number
12,261,163
Issue date
Mar 25, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D package configuration
Patent number
12,255,180
Issue date
Mar 18, 2025
CCS TECHNOLOGY CORPORATION
Tung-Po Sung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated structure with bifunctional routing and assembly compris...
Patent number
12,249,572
Issue date
Mar 11, 2025
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Candice Thomas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device and display unit
Patent number
12,249,597
Issue date
Mar 11, 2025
Osram Opto Semiconductors GmbH
Sebastian Wittmann
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Semiconductor device with open cavity and method therefor
Patent number
12,243,842
Issue date
Mar 4, 2025
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies having topside power delivery structures
Patent number
12,243,828
Issue date
Mar 4, 2025
Intel Corporation
Bernd Waidhas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
12,237,256
Issue date
Feb 25, 2025
Samsung Electronics Co, Ltd.
Kyoung Lim Suk
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD OF ELECTRONIC PACKAGE
Publication number
20250239530
Publication date
Jul 24, 2025
VIA TECHNOLOGIES, INC.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...
Publication number
20250239548
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Company Limited
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...
Publication number
20250239578
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Company Limited
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH INTERPOSER DIES
Publication number
20250239579
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE WITH INTERPOSER
Publication number
20250233109
Publication date
Jul 17, 2025
Powerchip Semiconductor Manufacturing Corporation
Chun-Lin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES
Publication number
20250233094
Publication date
Jul 17, 2025
Samsung Electronics Co., Ltd.
Kyung Don Mun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20250233113
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Ting CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING STRUCTURE AND PREPARING METHOD THEREOF
Publication number
20250233033
Publication date
Jul 17, 2025
TRIPLE WIN TECHNOLOGY (SHENZHEN) CO.LTD.
HUNG-TA LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250226274
Publication date
Jul 10, 2025
Samsung Electronics Co., Ltd.
Younjeong CHOE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP ASSEMBLY, CHIP INTERPOSER AND FABRICATING METHOD FOR CHIP ASSE...
Publication number
20250226327
Publication date
Jul 10, 2025
HYGON INFORMATION TECHNOLOGY CO., LTD.
Xiaodi Xue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING IMPEDANCE ADAPTER
Publication number
20250226365
Publication date
Jul 10, 2025
QUALCOMM Incorporated
Je-Hsiung LAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE
Publication number
20250226364
Publication date
Jul 10, 2025
Advanced Semiconductor Engineering, Inc.
Hung Yi CHUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE COMPRISING A PLURALITY OF INTEGRATED CIRCUITS AND METHOD OF...
Publication number
20250226304
Publication date
Jul 10, 2025
STMicroelectronics International N.V.
Romain COFFY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making a Chip-on-Wafer Underfill...
Publication number
20250219006
Publication date
Jul 3, 2025
STATS ChipPAC Pte Ltd.
Marites Roque
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING AN INTEGRATED OPTICAL CHIP PACKAGE DEVICE AND MET...
Publication number
20250216600
Publication date
Jul 3, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL PATH TO CARRIER SUB...
Publication number
20250218891
Publication date
Jul 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Shih Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT BOND INTERCONNECT ARCHITECTURES FOR PACKAGING ASSEMBLIES
Publication number
20250218988
Publication date
Jul 3, 2025
Intel Corporation
Yosuke KANAOKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
Publication number
20250218916
Publication date
Jul 3, 2025
Samsung Electronics Co., Ltd.
Seungwan Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
Publication number
20250210420
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Bang Li Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250210560
Publication date
Jun 26, 2025
Samsung Electronics Co., Ltd.
Ji-Han KO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS...
Publication number
20250210459
Publication date
Jun 26, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REPACKAGING STRUCTURE
Publication number
20250210498
Publication date
Jun 26, 2025
Industrial Technology Research Institute
Shih-Hsien WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250210542
Publication date
Jun 26, 2025
Samsung Electronics Co., Ltd.
Wooyeol LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE FOR MONITORING HYBRID BONDS IN A SEMICONDUCTOR CHIP PACKAGE
Publication number
20250201638
Publication date
Jun 19, 2025
International Business Machines Corporation
Nicholas Alexander POLOMOFF
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIGNAL LINES FOR SEMICONDUCTOR DEVICES
Publication number
20250201693
Publication date
Jun 19, 2025
Altera Corporation
Arturo PACHON MUNOZ
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID BONDING INSULATION MEMBRANE FORMING MATERIAL, METHOD OF PROD...
Publication number
20250201760
Publication date
Jun 19, 2025
HD MICROSYSTEMS, LTD.
Kenya ADACHI
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
PACKAGE COMPRISING INTEGRATED DEVICES AND A PASSIVE DEVICE
Publication number
20250201786
Publication date
Jun 19, 2025
QUALCOMM Incorporated
Yue LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRONG BONDING STRUCTURES AND METHODS OF FORMING THE SAME
Publication number
20250201739
Publication date
Jun 19, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM AND METHODS FOR A LIQUID COOLING PACKAGE ARCHITECTURE
Publication number
20250201669
Publication date
Jun 19, 2025
Samsung Electronics Co., Ltd.
Jin YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES WITH ANTENNAS AND RF REFLECTORS AND METHODS OF F...
Publication number
20250202097
Publication date
Jun 19, 2025
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS