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H01L2224/08225

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/08225the item being non-metallic

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display panel, method of manufacturing display panel, and display d...
- Patent number 12,266,621
- Issue date Apr 1, 2025
- TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jinming Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package
- Patent number 12,266,639
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded dies in semiconductor packages and methods of forming same
- Patent number 12,261,163
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D package configuration
- Patent number 12,255,180
- Issue date Mar 18, 2025
- CCS TECHNOLOGY CORPORATION
- Tung-Po Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structure with bifunctional routing and assembly compris...
- Patent number 12,249,572
- Issue date Mar 11, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Candice Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and display unit
- Patent number 12,249,597
- Issue date Mar 11, 2025
- Osram Opto Semiconductors GmbH
- Sebastian Wittmann
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device with open cavity and method therefor
- Patent number 12,243,842
- Issue date Mar 4, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having topside power delivery structures
- Patent number 12,243,828
- Issue date Mar 4, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,256
- Issue date Feb 25, 2025
- Samsung Electronics Co, Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method of manufacture
- Patent number 12,237,288
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring micro-light emitting diode for LED display
- Patent number 12,205,931
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit bond pad with multi-material toothed structure
- Patent number 12,205,910
- Issue date Jan 21, 2025
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded liquid cooling
- Patent number 12,199,011
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics card including multi-chip module
- Patent number 12,199,080
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling assembly including coolant channel on the backsi...
- Patent number 12,176,263
- Issue date Dec 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory system
- Patent number 12,169,644
- Issue date Dec 17, 2024
- Kioxia Corporation
- Manabu Matsumoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 12,165,999
- Issue date Dec 10, 2024
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Kouki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic sealing structures in microelectronic assemblies having di...
- Patent number 12,165,962
- Issue date Dec 10, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide composite wafer and manufacturing method thereof
- Patent number 12,159,855
- Issue date Dec 3, 2024
- HONG CHUANG APPLIED TECHNOLOGY CO., LTD
- Yan-Kai Zeng
- C30 - CRYSTAL GROWTH
Information Patent Grant
Connecting multiple chips using an interconnect device
- Patent number 12,154,858
- Issue date Nov 26, 2024
- Invensas LLC
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with high density of through-silicon vias (TSV)
- Patent number 12,154,869
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method having a through substrate via and...
- Patent number 12,148,664
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 12,132,016
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged multi-chip semiconductor devices and methods of fabricatin...
- Patent number 12,132,019
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic sealing structures in microelectronic assemblies having di...
- Patent number 12,119,291
- Issue date Oct 15, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III nitride-based radio frequency transistor amplifiers havin...
- Patent number 12,113,490
- Issue date Oct 8, 2024
- MACOM Technology Solutions Holdings, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectable monolithic or external scalable die-to-die interconnecti...
- Patent number 12,087,689
- Issue date Sep 10, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting window element and motor vehicle comprising a light-...
- Patent number 12,087,743
- Issue date Sep 10, 2024
- Osram Opto Semiconductors GmbH
- Andreas Dobner
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 12,080,664
- Issue date Sep 3, 2024
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Kouki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRA...
- Publication number 20250112077
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES
- Publication number 20250112173
- Publication date Apr 3, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT...
- Publication number 20250112185
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...
- Publication number 20250112188
- Publication date Apr 3, 2025
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES
- Publication number 20250112199
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED AS...
- Publication number 20250112200
- Publication date Apr 3, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SU...
- Publication number 20250112161
- Publication date Apr 3, 2025
- Intel Corporation
- Minglu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250112137
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC ASSEMBLIES WITH SELF-ALIGNMENT STRUCTURES HAVING ZERO MISALIGNMENT
- Publication number 20250112187
- Publication date Apr 3, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY AND HIGH-VOLTAGE DEVICES
- Publication number 20250112216
- Publication date Apr 3, 2025
- Intel Corporation
- Qiang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH EMBEDDED ALIGNMENT MARKERS
- Publication number 20250112168
- Publication date Apr 3, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TILT MITIGATION IN SELF-ALIGNMENT ASSISTED ASSEMBLY OF IC DIE
- Publication number 20250112186
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOTSPOT-FREE SEMICONDUCTOR DEVICE CHIPS
- Publication number 20250105089
- Publication date Mar 27, 2025
- Diamond Foundry Inc.
- Jeroen Van Duren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20250105094
- Publication date Mar 27, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105236
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Hong Jin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH VIAS CONNECTED TO BONDING PADS
- Publication number 20250105139
- Publication date Mar 27, 2025
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A DUMMY CHIP AND METHOD OF MANUFACT...
- Publication number 20250105097
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Yeongseon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105127
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Dohyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105128
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Byungjoon Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT LEVEL SEMICONDUCTOR PACKAGE
- Publication number 20250105159
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Pyunghwa Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STRESS-REDUCTION CHAMFERS AND METHO...
- Publication number 20250105170
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AN...
- Publication number 20250105178
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- MinKi AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105235
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LAYER TRANSFER
- Publication number 20250105046
- Publication date Mar 27, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGING BOND PADS TO REDUCE IMPACT ON PASSIVE DEVICES
- Publication number 20250105185
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC INTEGRATED CIRCUIT CHIP
- Publication number 20250093594
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A BRIDGE LOCATED BETWEEN METALLIZATION PORTIONS
- Publication number 20250096207
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Yue LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250096218
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Haseob SEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087596
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Jaesun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BACKSIDE POWER DELIVERY NETWORK LAYER
- Publication number 20250087646
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS

the item being non-metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display panel, method of manufacturing display panel, and display d...

Method of fabricating semiconductor package

Molded dies in semiconductor packages and methods of forming same

3D package configuration

Integrated structure with bifunctional routing and assembly compris...

Display device and display unit

Semiconductor device with open cavity and method therefor

Microelectronic assemblies having topside power delivery structures

Semiconductor package

Semiconductor die package and method of manufacture

Method of transferring micro-light emitting diode for LED display

Integrated circuit bond pad with multi-material toothed structure

Embedded liquid cooling

Electronics card including multi-chip module

Integrated cooling assembly including coolant channel on the backsi...

Memory system

Semiconductor device and semiconductor module

Hermetic sealing structures in microelectronic assemblies having di...

Silicon carbide composite wafer and manufacturing method thereof

Connecting multiple chips using an interconnect device

Semiconductor package with high density of through-silicon vias (TSV)

Semiconductor device and method having a through substrate via and...

Bonding structures of integrated circuit devices and method forming...

Packaged multi-chip semiconductor devices and methods of fabricatin...

Hermetic sealing structures in microelectronic assemblies having di...

Group III nitride-based radio frequency transistor amplifiers havin...

Selectable monolithic or external scalable die-to-die interconnecti...

Light-emitting window element and motor vehicle comprising a light-...

Semiconductor device and semiconductor module

Methods and devices for fabricating and assembling printable semico...

Patents Applicationslast 30 patents

ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRA...

PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES

SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT...

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...

SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES

HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED AS...

METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SU...

INTEGRATED CIRCUIT PACKAGE AND METHOD

IC ASSEMBLIES WITH SELF-ALIGNMENT STRUCTURES HAVING ZERO MISALIGNMENT

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY AND HIGH-VOLTAGE DEVICES

HYBRID BONDING WITH EMBEDDED ALIGNMENT MARKERS

TILT MITIGATION IN SELF-ALIGNMENT ASSISTED ASSEMBLY OF IC DIE

HOTSPOT-FREE SEMICONDUCTOR DEVICE CHIPS

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT STRUCTURES WITH VIAS CONNECTED TO BONDING PADS

SEMICONDUCTOR PACKAGE INCLUDING A DUMMY CHIP AND METHOD OF MANUFACT...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

FAN-OUT LEVEL SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING STRESS-REDUCTION CHAMFERS AND METHO...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AN...

SEMICONDUCTOR PACKAGE

SELECTIVE LAYER TRANSFER

ARRANGING BOND PADS TO REDUCE IMPACT ON PASSIVE DEVICES

SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC INTEGRATED CIRCUIT CHIP

PACKAGE COMPRISING A BRIDGE LOCATED BETWEEN METALLIZATION PORTIONS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING BACKSIDE POWER DELIVERY NETWORK LAYER