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H01L2224/08225

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/08225the item being non-metallic

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Connector and method for forming the same
- Patent number 12,300,645
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded structure with multi-height components comprising back...
- Patent number 12,300,561
- Issue date May 13, 2025
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooled interposer for integrated circuit stack
- Patent number 12,300,579
- Issue date May 13, 2025
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint recognition module and electronic device comprising same
- Patent number 12,300,676
- Issue date May 13, 2025
- LG Innotek Co., Ltd
- Seung Ho Jeon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display panel including driving backplane
- Patent number 12,295,172
- Issue date May 6, 2025
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Can Huang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device with open cavity and method therefor
- Patent number 12,288,766
- Issue date Apr 29, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 12,283,577
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,278,214
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package structure having inte...
- Patent number 12,278,190
- Issue date Apr 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having interconnections between die...
- Patent number 12,272,651
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, method of manufacturing display panel, and display d...
- Patent number 12,266,621
- Issue date Apr 1, 2025
- TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jinming Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package
- Patent number 12,266,639
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded dies in semiconductor packages and methods of forming same
- Patent number 12,261,163
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D package configuration
- Patent number 12,255,180
- Issue date Mar 18, 2025
- CCS TECHNOLOGY CORPORATION
- Tung-Po Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structure with bifunctional routing and assembly compris...
- Patent number 12,249,572
- Issue date Mar 11, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Candice Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and display unit
- Patent number 12,249,597
- Issue date Mar 11, 2025
- Osram Opto Semiconductors GmbH
- Sebastian Wittmann
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device with open cavity and method therefor
- Patent number 12,243,842
- Issue date Mar 4, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having topside power delivery structures
- Patent number 12,243,828
- Issue date Mar 4, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,256
- Issue date Feb 25, 2025
- Samsung Electronics Co, Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method of manufacture
- Patent number 12,237,288
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring micro-light emitting diode for LED display
- Patent number 12,205,931
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit bond pad with multi-material toothed structure
- Patent number 12,205,910
- Issue date Jan 21, 2025
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded liquid cooling
- Patent number 12,199,011
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics card including multi-chip module
- Patent number 12,199,080
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling assembly including coolant channel on the backsi...
- Patent number 12,176,263
- Issue date Dec 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory system
- Patent number 12,169,644
- Issue date Dec 17, 2024
- Kioxia Corporation
- Manabu Matsumoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 12,165,999
- Issue date Dec 10, 2024
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Kouki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic sealing structures in microelectronic assemblies having di...
- Patent number 12,165,962
- Issue date Dec 10, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide composite wafer and manufacturing method thereof
- Patent number 12,159,855
- Issue date Dec 3, 2024
- HONG CHUANG APPLIED TECHNOLOGY CO., LTD
- Yan-Kai Zeng
- C30 - CRYSTAL GROWTH
Information Patent Grant
Connecting multiple chips using an interconnect device
- Patent number 12,154,858
- Issue date Nov 26, 2024
- Invensas LLC
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DIE STACK WITH A BRIDGE DIE
- Publication number 20250167192
- Publication date May 22, 2025
- ADVANCED MICRO DEVICES, INC.
- Arsalan ALAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20250167075
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jen Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167098
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20250160096
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20250160095
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250157996
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20250157941
- Publication date May 15, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157867
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongkook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149426
- Publication date May 8, 2025
- Unimicron Technology Corp.
- An-Sheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE PROGNOSTICS WITH QUANTUM SENSING THROUGH 2-D MATERIALS
- Publication number 20250151340
- Publication date May 8, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Ercan Mehmet DEDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Dielectric Capping for Hybrid Bonding
- Publication number 20250149474
- Publication date May 8, 2025
- Applied Materials, Inc.
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149392
- Publication date May 8, 2025
- Unimicron Technology Corp.
- Chia Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140746
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
- Publication number 20250140707
- Publication date May 1, 2025
- ABSOLICS INC.
- Tae Kyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250140749
- Publication date May 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250140677
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Min Jeong SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250140705
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Kyuhyeon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250140726
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Kyunglyul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250140747
- Publication date May 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR DIES OF VARIABLE SIZE
- Publication number 20250140753
- Publication date May 1, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250140668
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Hyunwoong HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20250132219
- Publication date Apr 24, 2025
- Resonac Corporation
- Kazue HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20250132213
- Publication date Apr 24, 2025
- PANJIT INTERNATIONAL INC.
- Chung Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COUPLER STRUCTURE
- Publication number 20250133779
- Publication date Apr 24, 2025
- International Business Machines Corporation
- Adinath Shantinath Narasgond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICON...
- Publication number 20250132266
- Publication date Apr 24, 2025
- Universal Global Technology(Shanghai)Co.,Ltd.
- Yao LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACRIFICIAL TEST PAD
- Publication number 20250132208
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE
- Publication number 20250125196
- Publication date Apr 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL CHARACTERISTICS
- Publication number 20250125293
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES
- Publication number 20250125310
- Publication date Apr 17, 2025
- Yangtze Memory Technologies Co., Ltd.
- Daiyu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR SEMICONDUCTOR DIE COUPLING IN STACKED MEMORY ARCHITE...
- Publication number 20250118693
- Publication date Apr 10, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS

the item being non-metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connector and method for forming the same

Fully molded structure with multi-height components comprising back...

Liquid cooled interposer for integrated circuit stack

Fingerprint recognition module and electronic device comprising same

Display panel including driving backplane

Semiconductor device with open cavity and method therefor

Fan-out semiconductor package

Integrated circuit package and method

Manufacturing method of semiconductor package structure having inte...

Semiconductor package structure having interconnections between die...

Display panel, method of manufacturing display panel, and display d...

Method of fabricating semiconductor package

Molded dies in semiconductor packages and methods of forming same

3D package configuration

Integrated structure with bifunctional routing and assembly compris...

Display device and display unit

Semiconductor device with open cavity and method therefor

Microelectronic assemblies having topside power delivery structures

Semiconductor package

Semiconductor die package and method of manufacture

Method of transferring micro-light emitting diode for LED display

Integrated circuit bond pad with multi-material toothed structure

Embedded liquid cooling

Electronics card including multi-chip module

Integrated cooling assembly including coolant channel on the backsi...

Memory system

Semiconductor device and semiconductor module

Hermetic sealing structures in microelectronic assemblies having di...

Silicon carbide composite wafer and manufacturing method thereof

Connecting multiple chips using an interconnect device

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DIE STACK WITH A BRIDGE DIE

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

SEMICONDUCTOR PACKAGE

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE

SEMICONDUCTOR PACKAGES

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

POWER DEVICE PROGNOSTICS WITH QUANTUM SENSING THROUGH 2-D MATERIALS

Selective Dielectric Capping for Hybrid Bonding

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

STACKED SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR DIES OF VARIABLE SIZE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

SEMICONDUCTOR PACKAGING STRUCTURE

SEMICONDUCTOR DEVICE WITH COUPLER STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICON...

SACRIFICIAL TEST PAD

MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE

SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL CHARACTERISTICS

SEMICONDUCTOR PACKAGE STRUCTURES

TECHNIQUES FOR SEMICONDUCTOR DIE COUPLING IN STACKED MEMORY ARCHITE...