Membership
Tour
Register
Log in
the item being non-metallic
Follow
Industry
CPC
H01L2224/08225
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/08225
the item being non-metallic
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Electronic package structure, electronic substrate and method of ma...
Patent number
11,978,706
Issue date
May 7, 2024
Advanced Semiconductor Engineering, Inc.
Shun-Tsat Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple die assembly
Patent number
11,973,058
Issue date
Apr 30, 2024
International Business Machines Corporation
Katsuyuki Sakuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro LED based display panel
Patent number
11,967,586
Issue date
Apr 23, 2024
Apple Inc.
Dmitry S. Sizov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Via for semiconductor device connection and methods of forming the...
Patent number
11,961,800
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with connector in package and method therefor
Patent number
11,961,776
Issue date
Apr 16, 2024
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display apparatus and manufacturing method thereof
Patent number
11,948,928
Issue date
Apr 2, 2024
Au Optronics Corporation
Yang-En Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating the same
Patent number
11,935,871
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Yi Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display panel and display device
Patent number
11,903,298
Issue date
Feb 13, 2024
BOE Technology Group Co., Ltd.
Junbo Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Encapsulated vertical interconnects for high-speed applications and...
Patent number
11,887,917
Issue date
Jan 30, 2024
Intel Corporation
Bok Eng Cheah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of transferring micro-light emitting diode for LED display
Patent number
11,869,880
Issue date
Jan 9, 2024
Samsung Electronics Co., Ltd.
Kyungwook Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Group III nitride-based radio frequency transistor amplifiers havin...
Patent number
11,863,130
Issue date
Jan 2, 2024
Wolfspeed, Inc.
Basim Noori
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selectable monolithic or external scalable die-to-die interconnecti...
Patent number
11,862,557
Issue date
Jan 2, 2024
Apple Inc.
Sanjay Dabral
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
11,854,992
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages with pass-through clock traces and associate...
Patent number
11,855,048
Issue date
Dec 26, 2023
Thomas H. Kinsley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer scale bonded active photonics interposer
Patent number
11,841,531
Issue date
Dec 12, 2023
The Research Foundation for the State University of New York
Douglas Coolbaugh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method
Patent number
11,817,410
Issue date
Nov 14, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Wen-Chih Chiou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package for thermal dissipation
Patent number
11,804,475
Issue date
Oct 31, 2023
Taiwan Semiconductor Manufacturing Company
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating a semiconductor package
Patent number
11,776,882
Issue date
Oct 3, 2023
Infineon Technologies Austria AG
Markus Dinkel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultrathin bridge and multi-die ultrafine pitch patch architecture a...
Patent number
11,756,889
Issue date
Sep 12, 2023
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro device integration into system substrate
Patent number
11,735,623
Issue date
Aug 22, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device and method of fabricating the same
Patent number
11,735,601
Issue date
Aug 22, 2023
Samsung Display Co., Ltd.
Se Hoon Jeong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor IC-embedded substrate having heat dissipation structu...
Patent number
11,682,628
Issue date
Jun 20, 2023
TDK Corporation
Kazutoshi Tsuyutani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit bond pad with multi-material toothed structure
Patent number
11,682,641
Issue date
Jun 20, 2023
Microchip Technology Incorporated
Justin Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder joints on nickel surface finishes without gold plating
Patent number
11,676,926
Issue date
Jun 13, 2023
Schlumberger Technology Corporation
Mark Alex Kostinovsky
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked chip package and methods of manufacture thereof
Patent number
11,664,349
Issue date
May 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronics card including multi-chip module
Patent number
11,658,164
Issue date
May 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a semiconductor device having an interconn...
Patent number
11,658,069
Issue date
May 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting diode package and display apparatus including the same
Patent number
11,645,971
Issue date
May 9, 2023
Samsung Electronics Co., Ltd.
Kyoungjun Kim
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Under-bump-metallization structure and redistribution layer design...
Patent number
11,631,658
Issue date
Apr 18, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Chih Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method
Patent number
11,621,244
Issue date
Apr 4, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240162126
Publication date
May 16, 2024
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240153898
Publication date
May 9, 2024
Samsung Electronics Co., Ltd.
Minseung JI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED INTEGRATED CIRCUIT DIES AND INTERCONNECT STRUCTURES
Publication number
20240145515
Publication date
May 2, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Swarnal BORTHAKUR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NAND DIE WITH WIRE-BOND INDUCTIVE COMPENSATION FOR ALTERED BOND WIR...
Publication number
20240145424
Publication date
May 2, 2024
Western Digital Technologies, Inc.
John Contreras
G11 - INFORMATION STORAGE
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240145329
Publication date
May 2, 2024
Samsung Electronics Co. Ltd.
Geunwoo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
Publication number
20240136341
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Seokgeun AHN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-O...
Publication number
20240136264
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Chiwan SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
Publication number
20240136275
Publication date
Apr 25, 2024
MEDIATEK INC.
Shi-Bai Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240128174
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Choongbin Yim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING
Publication number
20240128211
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Packages and Methods of Forming the Same
Publication number
20240128194
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR AND METHOD FOR FORMING THE SAME
Publication number
20240128196
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wen-Shiang Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE FOR ENHANCED COOLING
Publication number
20240128146
Publication date
Apr 18, 2024
nD-HI Technologies Lab, Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...
Publication number
20240120282
Publication date
Apr 11, 2024
SERIPHY TECHNOLOGY CORPORATION
TZU-WEI CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE
Publication number
20240114623
Publication date
Apr 4, 2024
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC...
Publication number
20240112941
Publication date
Apr 4, 2024
Masaaki TAKEKOSHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STR...
Publication number
20240113005
Publication date
Apr 4, 2024
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20240105541
Publication date
Mar 28, 2024
Samsung Electronics Co., Ltd.
YONGHWAN KWON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20240105689
Publication date
Mar 28, 2024
Samsung Electronics Co., Ltd.
Seokhyun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-...
Publication number
20240105704
Publication date
Mar 28, 2024
Apple Inc.
Chonghua Zhong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding
Publication number
20240105545
Publication date
Mar 28, 2024
Apple Inc.
Jiongxin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D System and Wafer Reconstitution with Mid-layer Interposer
Publication number
20240105699
Publication date
Mar 28, 2024
Apple Inc.
Sanjay Dabral
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH TH...
Publication number
20240096817
Publication date
Mar 21, 2024
QUALCOMM Incorporated
Ranadeep DUTTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM-LEVEL FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURI...
Publication number
20240088002
Publication date
Mar 14, 2024
SJ Semiconductor(Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240088053
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing company Ltd.
CHEN-HUA YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GROUP III NITRIDE-BASED RADIO FREQUENCY TRANSISTOR AMPLIFIERS HAVIN...
Publication number
20240088838
Publication date
Mar 14, 2024
Wolfspeed, Inc.
Basim Noori
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT PACKAGING UNIT USED IN POP PACKAGING AND METHOD FOR MANUFAC...
Publication number
20240088008
Publication date
Mar 14, 2024
SJ Semiconductor(Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, WIRING BOARD, AND SEMICO...
Publication number
20240088051
Publication date
Mar 14, 2024
Resonac Corporation
Kazuyuki MITSUKURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20240079348
Publication date
Mar 7, 2024
InnoLux Corporation
Ker-Yih Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL INTEGRATION OF DIES IN AN INTEGRATED CIRCUIT DEVICE
Publication number
20240079335
Publication date
Mar 7, 2024
Intel Corporation
Jeremy D. Ecton
H01 - BASIC ELECTRIC ELEMENTS