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H01L2224/48225

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48225the item being non-metallic

Industries

Patents Grantslast 30 patents

Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 12,136,591
- Issue date Nov 5, 2024
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biometric sensor module for a smart card and method for manufacturi...
- Patent number 12,131,987
- Issue date Oct 29, 2024
- Linxens Holding
- Christophe Mathieu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device assemblies and systems with one or more dies a...
- Patent number 12,125,816
- Issue date Oct 22, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,100,631
- Issue date Sep 24, 2024
- Fuji Electric Co., Ltd.
- Taichi Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Command and address interface regions, and associated devices and s...
- Patent number 12,100,471
- Issue date Sep 24, 2024
- Kazuhiro Yoshida
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor module
- Patent number 12,087,699
- Issue date Sep 10, 2024
- Danfoss Silicon Power GmbH
- Alvaro Jorge Mari Curbelo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,080,692
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Keisuke Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,080,621
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Yoshiaki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,057,365
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Takumi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,046,549
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency packages containing multilevel power substrates and...
- Patent number 12,040,291
- Issue date Jul 16, 2024
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,033,984
- Issue date Jul 9, 2024
- Fuji Electric Co., Ltd.
- Mitsuhiro Kakefu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a suspended reinforcing layer and me...
- Patent number 12,033,958
- Issue date Jul 9, 2024
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages to minimize stress on a semiconductor die
- Patent number 12,027,472
- Issue date Jul 2, 2024
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection substrate, semiconductor package, and method of man...
- Patent number 12,027,452
- Issue date Jul 2, 2024
- Kioxia Corporation
- Motoshi Seto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,027,438
- Issue date Jul 2, 2024
- Mitsubishi Electric Corporation
- Daisuke Nakaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film in substrate for releasing z stack-up constraint
- Patent number 12,027,496
- Issue date Jul 2, 2024
- Intel Corporation
- Jianfeng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with unbalanced die stackup
- Patent number 12,027,497
- Issue date Jul 2, 2024
- Western Digital Technologies, Inc.
- Haiyue Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,009,342
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Hyoungjoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,002,794
- Issue date Jun 4, 2024
- Rohm Co., Ltd.
- Takumi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board, power semiconductor module arrangement compr...
- Patent number 12,002,740
- Issue date Jun 4, 2024
- Infineon Technologies AG
- Sebastian Michalski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die memory device
- Patent number 11,990,177
- Issue date May 21, 2024
- RAMBUS INC.
- Scott C. Best
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit package structure with conductive stair structur...
- Patent number 11,984,389
- Issue date May 14, 2024
- NANYA TECHNOLOGY CORPORATION
- Chien-Chung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip stack module and method of fabricating the same
- Patent number 11,984,432
- Issue date May 14, 2024
- Unity Power Technology Limited
- Kuk Fong Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, semiconductor device packages, electronic sy...
- Patent number 11,984,440
- Issue date May 14, 2024
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,967,545
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Centralized placement of command and address swapping in memory dev...
- Patent number 11,961,585
- Issue date Apr 16, 2024
- Kazuhiro Yoshida
- G11 - INFORMATION STORAGE
Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having multi-layer molding compound an...
- Patent number 11,961,778
- Issue date Apr 16, 2024
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR UNIT
- Publication number 20240387513
- Publication date Nov 21, 2024
- ROHM CO., LTD.
- Isao TAKOBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240379572
- Publication date Nov 14, 2024
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240371720
- Publication date Nov 7, 2024
- STATS ChipPAC Pte Ltd.
- OhYoung Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE DEVICES AND MEMORY SYSTEMS
- Publication number 20240363588
- Publication date Oct 31, 2024
- Yangtze Memory Technologies Co., Ltd.
- XuHui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE
- Publication number 20240355753
- Publication date Oct 24, 2024
- PIERBURG GMBH
- MIKA NUOTIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH ENHANCED DAM STRUCTURES TH...
- Publication number 20240355777
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- SEUNGHYUN BAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSED OVERHANG MEMORY ON PACKAGE (MOP) ARCHITECTURE
- Publication number 20240355792
- Publication date Oct 24, 2024
- Intel Corporation
- Poh Boon Khoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CLIP IN INTEGRATED DEVICE PACKAGE FOR GROUNDING AND ELECTROMA...
- Publication number 20240347474
- Publication date Oct 17, 2024
- Skyworks Solutions, Inc.
- Andrew Christopher Laib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240347487
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Jaeean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...
- Publication number 20240347476
- Publication date Oct 17, 2024
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND EQUIPMENT
- Publication number 20240347565
- Publication date Oct 17, 2024
- Canon Kabushiki Kaisha
- YU KATASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making an Optical Semiconductor...
- Publication number 20240339484
- Publication date Oct 10, 2024
- UTAC Headquarters Pte. Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240332271
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Hiroto SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE AND FLEXIBLE SUBSTRATE
- Publication number 20240332273
- Publication date Oct 3, 2024
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321834
- Publication date Sep 26, 2024
- Fuji Electric Co., Ltd.
- Mitsuhiro KAKEFU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF FABRICATING DISPLAY STRUCTURES
- Publication number 20240321856
- Publication date Sep 26, 2024
- LUMIODE, INC.
- Ioannis Kymissis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321826
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Dongchul YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321675
- Publication date Sep 26, 2024
- Fuji Electric Co., Ltd.
- Satoshi KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312947
- Publication date Sep 19, 2024
- Kabushiki Kaisha Toshiba
- Tomohiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240312921
- Publication date Sep 19, 2024
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312958
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Toshimitsu ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312960
- Publication date Sep 19, 2024
- Kabushiki Kaisha Toshiba
- Shun TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Upside-Down DRAM Package Structure
- Publication number 20240315054
- Publication date Sep 19, 2024
- Apple Inc.
- Jiongxin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240304567
- Publication date Sep 12, 2024
- Mitsubishi Electric Corporation
- Aya MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE
- Publication number 20240304569
- Publication date Sep 12, 2024
- Analong Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan et al.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THERMAL DISSIPATION FEATURES FOR A FLIP CHIP STRUCTURE
- Publication number 20240304515
- Publication date Sep 12, 2024
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE, FABRICATING METHOD THEREOF, AND ME...
- Publication number 20240304509
- Publication date Sep 12, 2024
- Yangtze Memory Technologies Co., Ltd.
- Hui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE
- Publication number 20240304639
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE ARRANGEMENT
- Publication number 20240304538
- Publication date Sep 12, 2024
- INFINEON TECHNOLOGIES AG
- Christoph Bayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF
- Publication number 20240304607
- Publication date Sep 12, 2024
- KIOXIA Corporation
- Kazuma HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS

the item being non-metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Through electrode substrate and semiconductor device

Biometric sensor module for a smart card and method for manufacturi...

Semiconductor device assemblies and systems with one or more dies a...

Hermetic package for high CTE mismatch

Semiconductor device

Command and address interface regions, and associated devices and s...

Semiconductor module

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device

Semiconductor device

Radio frequency packages containing multilevel power substrates and...

Semiconductor device

Semiconductor device including a suspended reinforcing layer and me...

Integrated circuit packages to minimize stress on a semiconductor die

Interconnection substrate, semiconductor package, and method of man...

Semiconductor device

Film in substrate for releasing z stack-up constraint

Semiconductor device with unbalanced die stackup

Semiconductor packages

Semiconductor device

Printed circuit board, power semiconductor module arrangement compr...

Multi-die memory device

Integrated circuit package structure with conductive stair structur...

Semiconductor chip stack module and method of fabricating the same

Semiconductor devices, semiconductor device packages, electronic sy...

Semiconductor device

Centralized placement of command and address swapping in memory dev...

Devices and methods related to dual-sided radio-frequency package w...

Semiconductor device package having multi-layer molding compound an...

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE AND SEMICONDUCTOR UNIT

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE DEVICES AND MEMORY SYSTEMS

POWER SEMICONDUCTOR PACKAGE

PACKAGED INTEGRATED CIRCUIT DEVICES WITH ENHANCED DAM STRUCTURES TH...

REVERSED OVERHANG MEMORY ON PACKAGE (MOP) ARCHITECTURE

METAL CLIP IN INTEGRATED DEVICE PACKAGE FOR GROUNDING AND ELECTROMA...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...

ELECTRONIC COMPONENT AND EQUIPMENT

Semiconductor Device and Method of Making an Optical Semiconductor...

SEMICONDUCTOR DEVICE

OPTICAL MODULE AND FLEXIBLE SUBSTRATE

SEMICONDUCTOR DEVICE

SYSTEM AND METHOD OF FABRICATING DISPLAY STRUCTURES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Upside-Down DRAM Package Structure

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE

HIGH THERMAL DISSIPATION FEATURES FOR A FLIP CHIP STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE, FABRICATING METHOD THEREOF, AND ME...

OPTICAL SENSOR PACKAGE

SEMICONDUCTOR MODULE ARRANGEMENT

SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF