the item being non-metallic

Industry

CPC
H01L2224/48225

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48225the item being non-metallic

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Multi-role semiconductor device substrates, semiconductor device as...
- Patent number 12,354,939
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technologies for radio frequency optimized interconnects for a quan...
- Patent number 12,349,604
- Issue date Jul 1, 2025
- Intel Corporation
- Hubert C. George
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power amplifier module with transistor dies for multiple amplifier...
- Patent number 12,347,740
- Issue date Jul 1, 2025
- NXP USA, INC.
- Stephen Reza Hiemstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, wearable device, and temperature detection m...
- Patent number 12,322,740
- Issue date Jun 3, 2025
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Limiting failures caused by dendrite growth on semiconductor chips
- Patent number 12,315,836
- Issue date May 27, 2025
- Wolfspeed, Inc.
- Dan Namishia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 12,308,305
- Issue date May 20, 2025
- Mitsubishi Electric Corporation
- Daisuke Oya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded product for semiconductor strip and method of manufacturing...
- Patent number 12,308,253
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Seunghwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for power semiconductor devices
- Patent number 12,300,678
- Issue date May 13, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated ultrasonic transducers
- Patent number 12,295,790
- Issue date May 13, 2025
- EXO IMAGING, INC.
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 12,300,569
- Issue date May 13, 2025
- Mitsubishi Electric Corporation
- Masanori Tsukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing semiconductor module
- Patent number 12,293,949
- Issue date May 6, 2025
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor EMI shielding component, semiconductor package struct...
- Patent number 12,293,976
- Issue date May 6, 2025
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- E-Tung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat dissipation structure
- Patent number 12,293,996
- Issue date May 6, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Moon Hee Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 12,283,577
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terahertz element and semiconductor device
- Patent number 12,278,423
- Issue date Apr 15, 2025
- Rohm Co., Ltd.
- Toshikazu Mukai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive adhesive that overflows for r...
- Patent number 12,278,206
- Issue date Apr 15, 2025
- Airoha Technology (HK) Limited
- Chun-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer configured for single touch-down testing
- Patent number 12,270,853
- Issue date Apr 8, 2025
- SanDisk Technologies, Inc.
- Toru Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball bond impedance matching
- Patent number 12,266,629
- Issue date Apr 1, 2025
- Raytheon Company
- Patrick E. Boyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 12,266,633
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,266,582
- Issue date Apr 1, 2025
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for producing a housing
- Patent number 12,261,063
- Issue date Mar 25, 2025
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,261,089
- Issue date Mar 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,255,191
- Issue date Mar 18, 2025
- Rohm Co., Ltd.
- Hideki Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device
- Patent number 12,255,275
- Issue date Mar 18, 2025
- Rohm Co., Ltd.
- Tomoichiro Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 12,255,177
- Issue date Mar 18, 2025
- SK HYNIX INC.
- Yo Sep Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon spacers with improved adhesion and semiconductor device ass...
- Patent number 12,255,128
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices, systems, and methods for stacked die packages
- Patent number 12,243,850
- Issue date Mar 4, 2025
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving current balance of parallel chips in power modu...
- Patent number 12,243,814
- Issue date Mar 4, 2025
- Hyundai Mobis Co., Ltd.
- Yu Cheol Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved performance in operation and imp...
- Patent number 12,218,029
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure of power semiconductor module
- Patent number 12,205,872
- Issue date Jan 21, 2025
- STARPOWER SEMICONDUCTOR LTD.
- Danting Feng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESS CONDITION MEASUREMENT DEVICE INCLUDING THERMALLY ISOLATED E...
- Publication number 20250239473
- Publication date Jul 24, 2025
- KLA Corporation
- Farhat A. Quli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250226271
- Publication date Jul 10, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250226336
- Publication date Jul 10, 2025
- MEDIATEK SINGAPORE PTE LTD
- Zhigang DUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20250218989
- Publication date Jul 3, 2025
- INTELPRO INC.
- Lung-Kun Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE TRANSFORMER POWER MODULES
- Publication number 20250218908
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Giacomo CALABRESE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...
- Publication number 20250218914
- Publication date Jul 3, 2025
- INFINEON TECHNOLOGIES AG
- Hao ZHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250218916
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Seungwan Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE
- Publication number 20250221011
- Publication date Jul 3, 2025
- BYD COMPANY LIMITED
- Rui HU
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210503
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR THREE PART SYSTEM ON CHIP MEMORY STACKING
- Publication number 20250210606
- Publication date Jun 26, 2025
- Meta Platforms Technologies, LLC
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERAHERTZ ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20250210854
- Publication date Jun 26, 2025
- ROHM CO., LTD.
- Toshikazu MUKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250210424
- Publication date Jun 26, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210487
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210504
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Masashi ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WITH BOND PAD
- Publication number 20250201738
- Publication date Jun 19, 2025
- TEXAS INSTRUMENTS INCORPORATED
- JEFFREY SOLAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250201770
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND WIRING SUBSTRATE INCLUDED IN THE SAME, AN...
- Publication number 20250201642
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Donggyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR APPARATUS
- Publication number 20250183233
- Publication date Jun 5, 2025
- Mitsubishi Electric Corporation
- Kozo HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ISOLATION FOR HARDWARE COMPONENT PACKAGE
- Publication number 20250174518
- Publication date May 29, 2025
- Microsoft Technology Licensing, LLC
- Rui JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250167134
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Huishu MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...
- Publication number 20250167065
- Publication date May 22, 2025
- SK HYNIX INC.
- Jun Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROMECHANICAL COMPONENT AND CORRESPONDING PRODUCTION METHOD
- Publication number 20250157998
- Publication date May 15, 2025
- ROBERT BOSCH GmbH
- Dorothea Papathanassiou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250149399
- Publication date May 8, 2025
- MITSUBISHI ELECTRIC CORPORATION
- Junji FUJINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIMODULE PACKAGE FOR MULTILEVEL INVERTER
- Publication number 20250140704
- Publication date May 1, 2025
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Chandra S. Namuduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250140677
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Min Jeong SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT DEVICE
- Publication number 20250125308
- Publication date Apr 17, 2025
- Fuji Electric Co., Ltd.
- Yasuyuki HOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES
- Publication number 20250125310
- Publication date Apr 17, 2025
- Yangtze Memory Technologies Co., Ltd.
- Daiyu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20250125228
- Publication date Apr 17, 2025
- STMicroelectronics International N.V.
- Guendalina CATALANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250125301
- Publication date Apr 17, 2025
- Fuji Electric Co., Ltd.
- Ryo MAETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND CO-PACKAGING OF CONFINEMENT APPARATUS AND APPLICATI...
- Publication number 20250125314
- Publication date Apr 17, 2025
- Quantinuum LLC
- David DEEN
- H01 - BASIC ELECTRIC ELEMENTS

the item being non-metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-role semiconductor device substrates, semiconductor device as...

Technologies for radio frequency optimized interconnects for a quan...

Power amplifier module with transistor dies for multiple amplifier...

Semiconductor package, wearable device, and temperature detection m...

Limiting failures caused by dendrite growth on semiconductor chips

Power semiconductor device

Molded product for semiconductor strip and method of manufacturing...

Package for power semiconductor devices

Integrated ultrasonic transducers

Semiconductor device

Semiconductor module and method for manufacturing semiconductor module

Semiconductor EMI shielding component, semiconductor package struct...

Semiconductor package including heat dissipation structure

Fan-out semiconductor package

Terahertz element and semiconductor device

Semiconductor package with conductive adhesive that overflows for r...

Semiconductor wafer configured for single touch-down testing

Ball bond impedance matching

Semiconductor structure and method of forming the same

Hermetic package for high CTE mismatch

Method and device for producing a housing

Semiconductor device package and a method of manufacturing the same

Semiconductor device

Semiconductor light emitting device

Stacked semiconductor device

Silicon spacers with improved adhesion and semiconductor device ass...

Devices, systems, and methods for stacked die packages

Method of improving current balance of parallel chips in power modu...

Semiconductor device with improved performance in operation and imp...

Packaging structure of power semiconductor module

Patents Applicationslast 30 patents

PROCESS CONDITION MEASUREMENT DEVICE INCLUDING THERMALLY ISOLATED E...

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE

Electronic Component

MULTI-DIE TRANSFORMER POWER MODULES

PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE

SEMICONDUCTOR DEVICE

SYSTEMS AND METHODS FOR THREE PART SYSTEM ON CHIP MEMORY STACKING

TERAHERTZ ELEMENT AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

DIE WITH BOND PAD

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND WIRING SUBSTRATE INCLUDED IN THE SAME, AN...

POWER MODULE SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR APPARATUS

THERMAL ISOLATION FOR HARDWARE COMPONENT PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...

MICROMECHANICAL COMPONENT AND CORRESPONDING PRODUCTION METHOD

POWER MODULE AND POWER CONVERSION APPARATUS

MULTIMODULE PACKAGE FOR MULTILEVEL INVERTER

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CIRCUIT DEVICE

SEMICONDUCTOR PACKAGE STRUCTURES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

SEMICONDUCTOR DEVICE

INTEGRATION AND CO-PACKAGING OF CONFINEMENT APPARATUS AND APPLICATI...