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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48225the item being non-metallic

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Ball bond impedance matching
- Patent number 12,266,629
- Issue date Apr 1, 2025
- Raytheon Company
- Patrick E. Boyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 12,266,633
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,266,582
- Issue date Apr 1, 2025
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for producing a housing
- Patent number 12,261,063
- Issue date Mar 25, 2025
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,261,089
- Issue date Mar 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,255,191
- Issue date Mar 18, 2025
- Rohm Co., Ltd.
- Hideki Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device
- Patent number 12,255,275
- Issue date Mar 18, 2025
- Rohm Co., Ltd.
- Tomoichiro Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 12,255,177
- Issue date Mar 18, 2025
- SK HYNIX INC.
- Yo Sep Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon spacers with improved adhesion and semiconductor device ass...
- Patent number 12,255,128
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices, systems, and methods for stacked die packages
- Patent number 12,243,850
- Issue date Mar 4, 2025
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving current balance of parallel chips in power modu...
- Patent number 12,243,814
- Issue date Mar 4, 2025
- Hyundai Mobis Co., Ltd.
- Yu Cheol Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved performance in operation and imp...
- Patent number 12,218,029
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure of power semiconductor module
- Patent number 12,205,872
- Issue date Jan 21, 2025
- STARPOWER SEMICONDUCTOR LTD.
- Danting Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit device
- Patent number 12,205,922
- Issue date Jan 21, 2025
- Fuji Electric Co., Ltd.
- Yasuyuki Hoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring base, package for storing semiconductor element, and semicon...
- Patent number 12,199,194
- Issue date Jan 14, 2025
- Kyocera Corporation
- Makoto Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,199,061
- Issue date Jan 14, 2025
- SK hynix Inc.
- Ha Gyeong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including surface pressure absorbing member fo...
- Patent number 12,191,218
- Issue date Jan 7, 2025
- Mitsubishi Electric Corporation
- Arata Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal performance improvement and stress reduction in semiconduct...
- Patent number 12,191,264
- Issue date Jan 7, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluorescent body, method for manufacturing same, and light-emitting...
- Patent number 12,180,402
- Issue date Dec 31, 2024
- National Institute for Materials Science
- Naoto Hirosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing memory device
- Patent number 12,174,737
- Issue date Dec 24, 2024
- ESSENCORE LIMITED
- Chan Ho Sohn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dicing die attach film, and semiconductor package using the same an...
- Patent number 12,176,314
- Issue date Dec 24, 2024
- Furukawa Electric Co., Ltd.
- Minoru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Half-bridge module for an inverter of an electric drive of an elect...
- Patent number 12,176,316
- Issue date Dec 24, 2024
- ZF Friedrichshafen AG
- Manuel Raimann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and temperature measurement method
- Patent number 12,163,845
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Shinichi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,166,050
- Issue date Dec 10, 2024
- UTAC HEADQUARTERS PTD. LTD.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation device and method of transmitting a signal across an isol...
- Patent number 12,166,146
- Issue date Dec 10, 2024
- MPICS INNOVATIONS PTE. LTD
- Kok Keong Richard Lum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 12,136,591
- Issue date Nov 5, 2024
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biometric sensor module for a smart card and method for manufacturi...
- Patent number 12,131,987
- Issue date Oct 29, 2024
- Linxens Holding
- Christophe Mathieu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device assemblies and systems with one or more dies a...
- Patent number 12,125,816
- Issue date Oct 22, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,100,631
- Issue date Sep 24, 2024
- Fuji Electric Co., Ltd.
- Taichi Itoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ISOLATOR
- Publication number 20250105125
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Daisuke Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105236
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Hong Jin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF AND INTERMEDIATE FOR MANUFACTURING A SEMICONDUCTOR DIE PA...
- Publication number 20250105206
- Publication date Mar 27, 2025
- NEXPERIA B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096099
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- JAESUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...
- Publication number 20250098347
- Publication date Mar 20, 2025
- ams-OSRAM International GmbH
- Michael Zitzlsperger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductive Heatable Particles in Semiconductor Module
- Publication number 20250096219
- Publication date Mar 20, 2025
- Fabian Jaeger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20250096086
- Publication date Mar 20, 2025
- ACTRON TECHNOLOGY CORPORATION
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR STORAGE UNIT
- Publication number 20250098068
- Publication date Mar 20, 2025
- KIOXIA Corporation
- Kiyohito NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PERFORMANCE IMPROVEMENT AND STRESS REDUCTION IN SEMICONDUCT...
- Publication number 20250096159
- Publication date Mar 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096118
- Publication date Mar 20, 2025
- KIOXIA Corporation
- Kunio OTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250079287
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNSINGULATED SEMICONDUCTOR PACKAGE
- Publication number 20250079400
- Publication date Mar 6, 2025
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGES AND RELATED METHODS
- Publication number 20250081647
- Publication date Mar 6, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Soon Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND POWER CONVERTER
- Publication number 20250070095
- Publication date Feb 27, 2025
- LX Semicon Co., Ltd.
- In Hwan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250069995
- Publication date Feb 27, 2025
- Realtek Semiconductor Corp.
- Nai-Jen Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250070057
- Publication date Feb 27, 2025
- Fuji Electric Co., Ltd.
- Hiroaki ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062237
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Kwangsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250054901
- Publication date Feb 13, 2025
- Fuji Electric Co., Ltd.
- Seiichi TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE BRIDGE AND METHOD FOR MANUFACTURING IT
- Publication number 20250054868
- Publication date Feb 13, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20250054921
- Publication date Feb 13, 2025
- Sony Semiconductor Solutions Corporation
- Akira OHMAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH ONE OR MORE DIES A...
- Publication number 20250046743
- Publication date Feb 6, 2025
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250038057
- Publication date Jan 30, 2025
- Kabushiki Kaisha Toshiba
- Eitaro Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250038146
- Publication date Jan 30, 2025
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250040053
- Publication date Jan 30, 2025
- Kabushiki Kaisha Toshiba
- Eitaro Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND CHIPLET MODULE
- Publication number 20250029970
- Publication date Jan 23, 2025
- Advanced Semiconductor Engineering, Inc.
- Jung Jui KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250022835
- Publication date Jan 16, 2025
- Fuji Electric Co., Ltd.
- Hideo AMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP SIDE COOLING FOR POWER AMPLIFIER MODULE
- Publication number 20250022765
- Publication date Jan 16, 2025
- Qorvo US, Inc.
- Miles Larkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A MULTI-CHIP PACKAGE DEVICE
- Publication number 20250022721
- Publication date Jan 16, 2025
- FORCE MOS TECHNOLOGY CO., LTD.
- YUAN-SHUN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250022783
- Publication date Jan 16, 2025
- Fuji Electric Co., Ltd.
- Kousuke KOMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOUSING, SEMICONDUCTOR MODULE AND METHODS FOR PRODUCING THE SAME
- Publication number 20250014952
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Georg Troska
- H01 - BASIC ELECTRIC ELEMENTS

the item being non-metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ball bond impedance matching

Semiconductor structure and method of forming the same

Hermetic package for high CTE mismatch

Method and device for producing a housing

Semiconductor device package and a method of manufacturing the same

Semiconductor device

Semiconductor light emitting device

Stacked semiconductor device

Silicon spacers with improved adhesion and semiconductor device ass...

Devices, systems, and methods for stacked die packages

Method of improving current balance of parallel chips in power modu...

Semiconductor device with improved performance in operation and imp...

Packaging structure of power semiconductor module

Semiconductor circuit device

Wiring base, package for storing semiconductor element, and semicon...

Semiconductor packages

Semiconductor device including surface pressure absorbing member fo...

Thermal performance improvement and stress reduction in semiconduct...

Fluorescent body, method for manufacturing same, and light-emitting...

Method for processing memory device

Dicing die attach film, and semiconductor package using the same an...

Half-bridge module for an inverter of an electric drive of an elect...

Semiconductor device and temperature measurement method

Reliable semiconductor packages

Isolation device and method of transmitting a signal across an isol...

Through electrode substrate and semiconductor device

Biometric sensor module for a smart card and method for manufacturi...

Semiconductor device assemblies and systems with one or more dies a...

Hermetic package for high CTE mismatch

Semiconductor device

Patents Applicationslast 30 patents

ISOLATOR

SEMICONDUCTOR PACKAGE

METHOD OF AND INTERMEDIATE FOR MANUFACTURING A SEMICONDUCTOR DIE PA...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...

Inductive Heatable Particles in Semiconductor Module

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR STORAGE UNIT

THERMAL PERFORMANCE IMPROVEMENT AND STRESS REDUCTION IN SEMICONDUCT...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES

UNSINGULATED SEMICONDUCTOR PACKAGE

IMAGE SENSOR PACKAGES AND RELATED METHODS

POWER SEMICONDUCTOR MODULE AND POWER CONVERTER

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

POWER MODULE BRIDGE AND METHOD FOR MANUFACTURING IT

LIGHT EMITTING DEVICE AND ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH ONE OR MORE DIES A...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE AND CHIPLET MODULE

SEMICONDUCTOR MODULE

TOP SIDE COOLING FOR POWER AMPLIFIER MODULE

METHOD OF MAKING A MULTI-CHIP PACKAGE DEVICE

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR

HOUSING, SEMICONDUCTOR MODULE AND METHODS FOR PRODUCING THE SAME