the layer connector being disposed on a via connection of the semiconductor or solid-state body

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29025the layer connector being disposed on a via connection of the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 12,051,669
- Issue date Jul 30, 2024
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive film and manufacturing method of semiconductor laminate
- Patent number 12,024,654
- Issue date Jul 2, 2024
- LG Chem, Ltd.
- Eun Yeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 11,152,325
- Issue date Oct 19, 2021
- Cree, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing high electron mobility transistor (HEMT)
- Patent number 10,861,947
- Issue date Dec 8, 2020
- RFHIC CORPORATION
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor (HEMT)
- Patent number 10,707,311
- Issue date Jul 7, 2020
- RFHIC CORPORATION
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated multi-color light-emitting pixel arrays based devices by...
- Patent number 10,636,838
- Issue date Apr 28, 2020
- Shaoher Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated multi-color light-emitting pixel arrays based devices by...
- Patent number 10,325,894
- Issue date Jun 18, 2019
- Shaoher Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor (HEMT)
- Patent number 10,217,827
- Issue date Feb 26, 2019
- RFHIC CORPORATION
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package systems including passive electrical components
- Patent number 9,660,532
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alan Roth
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Preform including a groove extending to an edge of the preform
- Patent number 9,190,384
- Issue date Nov 17, 2015
- TriQuint Semiconductor, Inc.
- Shixi Louis Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising at least a chip enclosed in a package...
- Patent number 9,159,652
- Issue date Oct 13, 2015
- STMicroelectronics S.r.l.
- Concetto Privitera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die including a groove extending from a via to an edge of the die
- Patent number 8,718,720
- Issue date May 6, 2014
- TriQuint Semiconductor, Inc.
- Shixi Louis Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED AND PACKAGED HEAT DISSIPATION STRUCTURE AND MANUFACTURING...
- Publication number 20240266244
- Publication date Aug 8, 2024
- Zhuhai ACCESS Semiconductor Co., LTD.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF AND CHIP PACKAGE S...
- Publication number 20240243021
- Publication date Jul 18, 2024
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH CORE EMBEDDED CHIPLET
- Publication number 20240234304
- Publication date Jul 11, 2024
- ADVANCED MICRO DEVICES, INC.
- Deepak Vasant KULKARNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER BOARD INTEGRATED WITH INDUCTIVE CIRCUIT STRUCTURE A...
- Publication number 20240222140
- Publication date Jul 4, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SUBSTRATE, METHOD OF MAKING THE SAME, AND SEMICONDUCTO...
- Publication number 20240222246
- Publication date Jul 4, 2024
- Shinko Electric Industries Co., Ltd.
- Kensuke UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BODY, MOUNTING SUBSTRATE, METHOD FOR MANUFACTURING WIRING BO...
- Publication number 20240153859
- Publication date May 9, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Takayoshi NIRENGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVI...
- Publication number 20220028821
- Publication date Jan 27, 2022
- Cree, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONDUCTIVE FILM AND MANUFACTURING METHOD OF SEMICONDUCTOR LAMINATE
- Publication number 20210388244
- Publication date Dec 16, 2021
- LG CHEM, LTD.
- Eun Yeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVI...
- Publication number 20210057370
- Publication date Feb 25, 2021
- Cree, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR (HEMT)
- Publication number 20190115435
- Publication date Apr 18, 2019
- RFHIC Corporation
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR (HEMT)
- Publication number 20170330940
- Publication date Nov 16, 2017
- RFHIC Corporation
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS
- Publication number 20170063236
- Publication date Mar 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alan ROTH
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRONIC DEVICE COMPRISING AT LEAST A CHIP ENCLOSED IN A PACKAGE...
- Publication number 20140239502
- Publication date Aug 28, 2014
- STMicroelectronics S.r.l.
- Concetto Privitera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREFORM INCLUDING A GROOVE EXTENDING TO AN EDGE OF THE PREFORM
- Publication number 20140206149
- Publication date Jul 24, 2014
- TriQuint Semiconductor, Inc.
- Shixi Louis Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

the layer connector being disposed on a via connection of the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Contact and die attach metallization for silicon carbide based devi...

Non-conductive film and manufacturing method of semiconductor laminate

Contact and die attach metallization for silicon carbide based devi...

Methods for processing high electron mobility transistor (HEMT)

High electron mobility transistor (HEMT)

Integrated multi-color light-emitting pixel arrays based devices by...

Integrated multi-color light-emitting pixel arrays based devices by...

High electron mobility transistor (HEMT)

Package systems including passive electrical components

Preform including a groove extending to an edge of the preform

Electronic device comprising at least a chip enclosed in a package...

Die including a groove extending from a via to an edge of the die

Patents Applicationslast 30 patents

EMBEDDED AND PACKAGED HEAT DISSIPATION STRUCTURE AND MANUFACTURING...

PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF AND CHIP PACKAGE S...

CHIP PACKAGE WITH CORE EMBEDDED CHIPLET

PACKAGE CARRIER BOARD INTEGRATED WITH INDUCTIVE CIRCUIT STRUCTURE A...

INTERCONNECT SUBSTRATE, METHOD OF MAKING THE SAME, AND SEMICONDUCTO...

WIRING BODY, MOUNTING SUBSTRATE, METHOD FOR MANUFACTURING WIRING BO...

CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVI...

NON-CONDUCTIVE FILM AND MANUFACTURING METHOD OF SEMICONDUCTOR LAMINATE

CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVI...

HIGH ELECTRON MOBILITY TRANSISTOR (HEMT)

HIGH ELECTRON MOBILITY TRANSISTOR (HEMT)

PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS

ELECTRONIC DEVICE COMPRISING AT LEAST A CHIP ENCLOSED IN A PACKAGE...

PREFORM INCLUDING A GROOVE EXTENDING TO AN EDGE OF THE PREFORM