the layer connector connecting to a pin of the item

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H01L2224/3223

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/3223the layer connector connecting to a pin of the item

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Solid-state imaging device and electronic device
- Patent number 12,317,619
- Issue date May 27, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yoshihiro Makita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint recognition module and electronic device comprising same
- Patent number 12,300,676
- Issue date May 13, 2025
- LG Innotek Co., Ltd
- Seung Ho Jeon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,243,843
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed hybrid bonding structures and methods of forming the same
- Patent number 12,224,261
- Issue date Feb 11, 2025
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module, and photosensitive assembly and manufacturing method...
- Patent number 12,211,864
- Issue date Jan 28, 2025
- NINGBO SUNNY OPOTECH CO., LTD.
- Zhongyu Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 12,183,704
- Issue date Dec 31, 2024
- Nepes Co., Ltd.
- Byung Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly board for use in a display manufacturing method
- Patent number 12,176,225
- Issue date Dec 24, 2024
- LG Electronics Inc.
- Changhyun Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and displayer
- Patent number 12,148,867
- Issue date Nov 19, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including package seal ring and methods for f...
- Patent number 12,125,761
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,080,662
- Issue date Sep 3, 2024
- Samsung Display Co., Ltd.
- Eui Jeong Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using semiconductor light-emitting elements and manu...
- Patent number 12,080,689
- Issue date Sep 3, 2024
- LG Electronics Inc.
- Dohee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,033,973
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Soohyun Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film in substrate for releasing z stack-up constraint
- Patent number 12,027,496
- Issue date Jul 2, 2024
- Intel Corporation
- Jianfeng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and display device using the same
- Patent number 12,021,056
- Issue date Jun 25, 2024
- LG Display Co., Ltd.
- Chang Hyun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming electrical interconnections using capillary microfluidics
- Patent number 11,937,381
- Issue date Mar 19, 2024
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,837,569
- Issue date Dec 5, 2023
- Kioxia Corporation
- Yoshiharu Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device package
- Patent number 11,837,570
- Issue date Dec 5, 2023
- SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
- June O Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate, package structure and method of manufacturing th...
- Patent number 11,830,796
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including adhesive film with conductive ball
- Patent number 11,824,034
- Issue date Nov 21, 2023
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic device
- Patent number 11,817,467
- Issue date Nov 14, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yoshihiro Makita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding structures and semiconductor devices including the same
- Patent number 11,804,462
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Module with substrate recess for conductive-bonding component
- Patent number 11,776,871
- Issue date Oct 3, 2023
- Semiconductor Components Industries, LLC
- Leo Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,756,934
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device integration into system substrate
- Patent number 11,735,623
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME
- Publication number 20250191984
- Publication date Jun 12, 2025
- AMOGREENTECH CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20250176105
- Publication date May 29, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250167159
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20250160096
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20250160095
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140770
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Che-Yu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR IMPROVING EMBEDDED SUBSTRATE THERMALS
- Publication number 20250112113
- Publication date Apr 3, 2025
- ADVANCED MICRO DEVICES, INC.
- Sriram Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE, METHOD OF MANUFACTURING AN ELEMENT PACKAGE AND...
- Publication number 20250112098
- Publication date Apr 3, 2025
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY TILE WITH PROBE PAD ARRANGEMENT AND STACKED MEMORY DEVICE
- Publication number 20250105123
- Publication date Mar 27, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Takeo Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER
- Publication number 20250105200
- Publication date Mar 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seokbong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250105197
- Publication date Mar 27, 2025
- Mitsubishi Electric Corporation
- Tatsuto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250096187
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250096057
- Publication date Mar 20, 2025
- STMicroelectronics International N.V.
- Michael DE CRUZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH PACKAGE SUBSTRATE HAVING BLIND CAVITY WIT...
- Publication number 20250079266
- Publication date Mar 6, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079280
- Publication date Mar 6, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- WEI-CHUNG CHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING SUBSTRATE WITH PASSIVE ELECTRONIC COMPONENT EMBEDD...
- Publication number 20250070001
- Publication date Feb 27, 2025
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250062272
- Publication date Feb 20, 2025
- Fuji Electric Co., Ltd.
- Tsubasa WATAKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING TH...
- Publication number 20250062202
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yi Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHO...
- Publication number 20250054826
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Che Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250031434
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE STRUCTURE
- Publication number 20250022770
- Publication date Jan 16, 2025
- Delta Electronics, Inc.
- Fu-Yuan SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INTEGRATED STACK CAPACITOR (ISC) IN SUBSTRATE BUILD-UP LAYER
- Publication number 20250014986
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Rui ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA ARRAY IN A REDISTRIBUTION LAYER STRUCTURE FOR STRESS RELIEF
- Publication number 20250015007
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP INCLUDING THROUGH-SUBSTRATE VIA (TSV) AND LANDING S...
- Publication number 20250014987
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20250015030
- Publication date Jan 9, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MULTIPLE REDISTRIBUTION LAYERS AND MET...
- Publication number 20240429140
- Publication date Dec 26, 2024
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20240421029
- Publication date Dec 19, 2024
- Wolfspeed, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTER BONDING SHEET
- Publication number 20240413116
- Publication date Dec 12, 2024
- Nitto Denko Corporation
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING...
- Publication number 20240404978
- Publication date Dec 5, 2024
- Shinko Electric Industries Co., Ltd.
- Masaya Takizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404969
- Publication date Dec 5, 2024
- SAMSUNG DISPLAY CO., LTD.
- EUI JEONG KANG
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector connecting to a pin of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solid-state imaging device and electronic device

Fingerprint recognition module and electronic device comprising same

Integrated circuit package and method of forming same

Mixed hybrid bonding structures and methods of forming the same

Camera module, and photosensitive assembly and manufacturing method...

Selective micro device transfer to receiver substrate

Semiconductor package and method for manufacturing the same

Assembly board for use in a display manufacturing method

Light-emitting device and displayer

Semiconductor package including package seal ring and methods for f...

Display device and method of manufacturing the same

Display device using semiconductor light-emitting elements and manu...

Selective transfer of micro devices

Semiconductor package

Film in substrate for releasing z stack-up constraint

Electronic device and display device using the same

Forming electrical interconnections using capillary microfluidics

Semiconductor device and manufacturing method thereof

Light emitting device package

Circuit substrate, package structure and method of manufacturing th...

Display device including adhesive film with conductive ball

Solid-state imaging device and electronic device

Hybrid bonding structures and semiconductor devices including the same

Light emitting diode display with redundancy scheme

Module with substrate recess for conductive-bonding component

Semiconductor structure and manufacturing method thereof

Micro device integration into system substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Patents Applicationslast 30 patents

CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME

SELECTIVE TRANSFER OF MICRO DEVICES

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SYSTEMS AND METHODS FOR IMPROVING EMBEDDED SUBSTRATE THERMALS

PACKAGING SUBSTRATE, METHOD OF MANUFACTURING AN ELEMENT PACKAGE AND...

MEMORY TILE WITH PROBE PAD ARRANGEMENT AND STACKED MEMORY DEVICE

POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

ELECTRONIC COMPONENT

PACKAGE ARCHITECTURE WITH PACKAGE SUBSTRATE HAVING BLIND CAVITY WIT...

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

DEVICE INCLUDING SUBSTRATE WITH PASSIVE ELECTRONIC COMPONENT EMBEDD...

SEMICONDUCTOR MODULE

PACKAGE STRUCTURE, SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING TH...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHO...

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

POWER MODULE STRUCTURE

EMBEDDED INTEGRATED STACK CAPACITOR (ISC) IN SUBSTRATE BUILD-UP LAYER

VIA ARRAY IN A REDISTRIBUTION LAYER STRUCTURE FOR STRESS RELIEF

INTEGRATED CHIP INCLUDING THROUGH-SUBSTRATE VIA (TSV) AND LANDING S...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SEMICONDUCTOR PACKAGE HAVING MULTIPLE REDISTRIBUTION LAYERS AND MET...

Semiconductor Package

SINTER BONDING SHEET

WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME