the layer connector connecting to a pin of the item

Industry

CPC
H01L2224/3223

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/3223the layer connector connecting to a pin of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 12,183,704
- Issue date Dec 31, 2024
- Nepes Co., Ltd.
- Byung Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly board for use in a display manufacturing method
- Patent number 12,176,225
- Issue date Dec 24, 2024
- LG Electronics Inc.
- Changhyun Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and displayer
- Patent number 12,148,867
- Issue date Nov 19, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including package seal ring and methods for f...
- Patent number 12,125,761
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,080,662
- Issue date Sep 3, 2024
- Samsung Display Co., Ltd.
- Eui Jeong Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using semiconductor light-emitting elements and manu...
- Patent number 12,080,689
- Issue date Sep 3, 2024
- LG Electronics Inc.
- Dohee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,033,973
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Soohyun Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film in substrate for releasing z stack-up constraint
- Patent number 12,027,496
- Issue date Jul 2, 2024
- Intel Corporation
- Jianfeng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and display device using the same
- Patent number 12,021,056
- Issue date Jun 25, 2024
- LG Display Co., Ltd.
- Chang Hyun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming electrical interconnections using capillary microfluidics
- Patent number 11,937,381
- Issue date Mar 19, 2024
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,837,569
- Issue date Dec 5, 2023
- Kioxia Corporation
- Yoshiharu Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device package
- Patent number 11,837,570
- Issue date Dec 5, 2023
- SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
- June O Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate, package structure and method of manufacturing th...
- Patent number 11,830,796
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including adhesive film with conductive ball
- Patent number 11,824,034
- Issue date Nov 21, 2023
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic device
- Patent number 11,817,467
- Issue date Nov 14, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yoshihiro Makita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding structures and semiconductor devices including the same
- Patent number 11,804,462
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Module with substrate recess for conductive-bonding component
- Patent number 11,776,871
- Issue date Oct 3, 2023
- Semiconductor Components Industries, LLC
- Leo Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,756,934
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device integration into system substrate
- Patent number 11,735,623
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,302
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,306
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display pixels with integrated pipeline
- Patent number 11,699,383
- Issue date Jul 11, 2023
- Tectus Corporation
- Paul Scott Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,682,613
- Issue date Jun 20, 2023
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 11,683,963
- Issue date Jun 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heat dissipation member
- Patent number 11,670,565
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Hyo-Chang Ryu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MULTIPLE REDISTRIBUTION LAYERS AND MET...
- Publication number 20240429140
- Publication date Dec 26, 2024
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20240421029
- Publication date Dec 19, 2024
- Wolfspeed, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTER BONDING SHEET
- Publication number 20240413116
- Publication date Dec 12, 2024
- Nitto Denko Corporation
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING...
- Publication number 20240404978
- Publication date Dec 5, 2024
- Shinko Electric Industries Co., Ltd.
- Masaya Takizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404969
- Publication date Dec 5, 2024
- SAMSUNG DISPLAY CO., LTD.
- EUI JEONG KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE
- Publication number 20240395654
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240395761
- Publication date Nov 28, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240387492
- Publication date Nov 21, 2024
- LG ELECTRONICS INC.
- Dohan KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240379485
- Publication date Nov 14, 2024
- Fuji Electric Co., Ltd.
- Shinichi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATIVE SEMICONDUCTOR PACKAGE
- Publication number 20240355703
- Publication date Oct 24, 2024
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS
- Publication number 20240347497
- Publication date Oct 17, 2024
- International Business Machines Corporation
- SHIDONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PACKAGE DEVICE, FABRICATION METHOD THEREOF AND MEMORY SY...
- Publication number 20240332152
- Publication date Oct 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Xinru Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240321809
- Publication date Sep 26, 2024
- STMicroelectronics International N.V.
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321823
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Donguk Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321815
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Soohyun NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240313043
- Publication date Sep 19, 2024
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312960
- Publication date Sep 19, 2024
- Kabushiki Kaisha Toshiba
- Shun TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20240312945
- Publication date Sep 19, 2024
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE ADHESIVE FILM AND FABRICATION METHOD THEREFOR, ELECTRONI...
- Publication number 20240304586
- Publication date Sep 12, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shaopeng LI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR MODULE AND WIRING MEMBER
- Publication number 20240243093
- Publication date Jul 18, 2024
- Fuji Electric Co., Ltd.
- Koji OSAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234281
- Publication date Jul 11, 2024
- LG Innotek Co., Ltd.
- Hyun Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240234230
- Publication date Jul 11, 2024
- ROHM CO., LTD.
- Natsuki SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240222327
- Publication date Jul 4, 2024
- Innolux Corporation
- Chia-Ping Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, PACKAGE FORMING METHOD, AND POWER SUPPLY MODULE
- Publication number 20240203843
- Publication date Jun 20, 2024
- Shenzhen STS Microelectronics Co., Ltd.
- Lin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240203854
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Hyeon Jeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME
- Publication number 20240203855
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Jaemok JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240178082
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240178114
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- KYOUNG LIM SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240178083
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector connecting to a pin of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method for manufacturing the same

Assembly board for use in a display manufacturing method

Light-emitting device and displayer

Semiconductor package including package seal ring and methods for f...

Display device and method of manufacturing the same

Display device using semiconductor light-emitting elements and manu...

Selective transfer of micro devices

Semiconductor package

Film in substrate for releasing z stack-up constraint

Electronic device and display device using the same

Forming electrical interconnections using capillary microfluidics

Semiconductor device and manufacturing method thereof

Light emitting device package

Circuit substrate, package structure and method of manufacturing th...

Display device including adhesive film with conductive ball

Solid-state imaging device and electronic device

Hybrid bonding structures and semiconductor devices including the same

Light emitting diode display with redundancy scheme

Module with substrate recess for conductive-bonding component

Semiconductor structure and manufacturing method thereof

Micro device integration into system substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Display pixels with integrated pipeline

Package substrates with magnetic build-up layers

Anisotropic conductive film and display device using the same

Semiconductor package with heat dissipation member

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE HAVING MULTIPLE REDISTRIBUTION LAYERS AND MET...

Semiconductor Package

SINTER BONDING SHEET

WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE

METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

DISPLAY DEVICE

SEMICONDUCTOR DEVICE

SELECTIVE TRANSFER OF MICRO DEVICES

HEAT DISSIPATIVE SEMICONDUCTOR PACKAGE

THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS

INTEGRATED PACKAGE DEVICE, FABRICATION METHOD THEREOF AND MEMORY SY...

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

CONDUCTIVE ADHESIVE FILM AND FABRICATION METHOD THEREFOR, ELECTRONI...

SEMICONDUCTOR MODULE AND WIRING MEMBER

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE, PACKAGE FORMING METHOD, AND POWER SUPPLY MODULE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME