the lowermost container comprising a device support

Industry

CPC
H01L2225/1017

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/1017the lowermost container comprising a device support

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-die, vertical-wire package-in-package apparatus, and methods...
- Patent number 11,749,653
- Issue date Sep 5, 2023
- Intel Corporation
- Hyoung Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and imaging apparatus
- Patent number 11,728,447
- Issue date Aug 15, 2023
- Sony Group Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable substrate and systems
- Patent number 11,171,126
- Issue date Nov 9, 2021
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and imaging apparatus
- Patent number 11,024,757
- Issue date Jun 1, 2021
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic silicon bridge stack including a hybrid baseband die sup...
- Patent number 11,018,114
- Issue date May 25, 2021
- Intel IP Corporation
- Bernd Waidhas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing a semiconductor package
- Patent number 10,121,774
- Issue date Nov 6, 2018
- Samsung Electronics Co., Ltd.
- Junyoung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 10,079,193
- Issue date Sep 18, 2018
- ABB Schweiz AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 10,037,938
- Issue date Jul 31, 2018
- Samsung Electronics Co., Ltd.
- Keung Beum Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure and fabrication method thereof
- Patent number 9,343,387
- Issue date May 17, 2016
- Siliconware Precision Industries Co., Ltd.
- Chu-Chi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die carrier for package on package assembly
- Patent number 8,927,333
- Issue date Jan 6, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming and assembling pre-encapsulated assemblies and o...
- Patent number 8,399,297
- Issue date Mar 19, 2013
- Micron Technology, Inc.
- Tay Wuu Yean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with package stacking and metho...
- Patent number 8,389,329
- Issue date Mar 5, 2013
- Stats Chippac Ltd.
- NamJu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-encapsulated cavity interposer
- Patent number 8,072,082
- Issue date Dec 6, 2011
- Micron Technology, Inc.
- Tay Wuu Yean
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-DIE PACKAGE ON PACKAGE
- Publication number 20240096860
- Publication date Mar 21, 2024
- MEDIATEK INC.
- Tai-Hao PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE, VERTICAL-WIRE PACKAGE-IN-PACKAGE APPARATUS, AND METHODS...
- Publication number 20210288034
- Publication date Sep 16, 2021
- Intel Corporation
- Hyoung IL Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND IMAGING APPARATUS
- Publication number 20210280724
- Publication date Sep 9, 2021
- SONY GROUP CORPORATION
- MAKOTO MURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20170263527
- Publication date Sep 14, 2017
- ABB Schweiz AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20150255360
- Publication date Sep 10, 2015
- Siliconware Precision Industries Co., Ltd.
- Chu-Chi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR PROCESSING SEMICONDUCTOR DEVICES
- Publication number 20150206813
- Publication date Jul 23, 2015
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES, METHODS OF MANUFACTURING SEMICONDUCTOR PACK...
- Publication number 20140084456
- Publication date Mar 27, 2014
- Myun-sung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CARRIER FOR PACKAGE ON PACKAGE ASSEMBLY
- Publication number 20130127040
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PACKAGE INTERCONNECT WITH COPPER HEAT SPREADER AND MET...
- Publication number 20130069218
- Publication date Mar 21, 2013
- STMicroelectronics Asia Pacific Pte. Ltd.
- Lee Hua Alvin Seah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE PACKAGE MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20130026616
- Publication date Jan 31, 2013
- Samsung Electro-Mechanics CO., LTD.
- Suk Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHO...
- Publication number 20120306102
- Publication date Dec 6, 2012
- NamJu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-ENCAPSULATED CAVITY INTERPOSER
- Publication number 20120034740
- Publication date Feb 9, 2012
- Micron Technology, Inc.
- Tay Wuu Yean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-ENCAPSULATED CAVITY INTERPOSER
- Publication number 20090267171
- Publication date Oct 29, 2009
- Micron Technology, Inc.
- Tay Wuu Yean
- H01 - BASIC ELECTRIC ELEMENTS

the lowermost container comprising a device support

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-die, vertical-wire package-in-package apparatus, and methods...

Semiconductor device and imaging apparatus

Configurable substrate and systems

Semiconductor device and imaging apparatus

Monolithic silicon bridge stack including a hybrid baseband die sup...

Method of manufacturing a semiconductor package

Semiconductor module

Semiconductor packages

Package on package structure and fabrication method thereof

Die carrier for package on package assembly

Methods of forming and assembling pre-encapsulated assemblies and o...

Integrated circuit packaging system with package stacking and metho...

Pre-encapsulated cavity interposer

Patents Applicationslast 30 patents

MULTI-DIE PACKAGE ON PACKAGE

MULTI-DIE, VERTICAL-WIRE PACKAGE-IN-PACKAGE APPARATUS, AND METHODS...

SEMICONDUCTOR DEVICE AND IMAGING APPARATUS

SEMICONDUCTOR MODULE

PACKAGE ON PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

METHODS AND STRUCTURES FOR PROCESSING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES, METHODS OF MANUFACTURING SEMICONDUCTOR PACK...

DIE CARRIER FOR PACKAGE ON PACKAGE ASSEMBLY

HIGH DENSITY PACKAGE INTERCONNECT WITH COPPER HEAT SPREADER AND MET...

POWER DEVICE PACKAGE MODULE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHO...

PRE-ENCAPSULATED CAVITY INTERPOSER

PRE-ENCAPSULATED CAVITY INTERPOSER