the other leads being parallel to the base

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/047the other leads being parallel to the base

Industries

Patents Grantslast 30 patents

Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating component, semiconductor package, and semiconductor appa...
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Information Patent Grant
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Air cavity package using high temperature silicone adhesive
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Information Patent Grant
Package and semiconductor device
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Information Patent Grant
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Information Patent Grant
Semiconductor device, control device, and method for manufacturing...
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Information Patent Grant
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Information Patent Grant
Power semiconductor device and method of manufacturing the same, an...
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- Satoshi Kondo
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Information Patent Grant
Semiconductor package and semiconductor apparatus for use with high...
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- Issue date Mar 9, 2021
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- Michikazu Nagata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
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CERAMIC SEMICONDUCTOR DEVICE PACKAGE
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- H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK
- Publication number 20230197629
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- Qorvo US, Inc.
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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PACKAGE FOR A SEMICONDUCTOR DEVICE
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SEMICONDUCTOR MODULE
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SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR
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SEMICONDUCTOR DEVICE AND PACKAGE
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- Publication date Jan 5, 2023
- Sumitomo Electric Industries, Ltd.
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INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND A PACKAGE AND PROCES...
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OUTPUT-INTEGRATED TRANSISTOR DEVICE PACKAGES
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- Mitsubishi Electric Corporation
- Kazuhisa OSADA
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR MODULE
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ELECTRONIC DEVICE PACKAGES WITH INTERNAL MOISTURE BARRIERS
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- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H03 - BASIC ELECTRONIC CIRCUITRY

the other leads being parallel to the base

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Output-integrated transistor device packages

Electronic component with lid to manage radiation feedback

Package for a semiconductor device

Integrated passive device (IPD) components and a package and proces...

Ceramic semiconductor device package with copper tungsten conductiv...

Insulating component, semiconductor package, and semiconductor appa...

Semiconductor device comprising a lead electrode including a throug...

High power laminate RF package

Electronic device packages with internal moisture barriers

Power module

Semiconductor device and power conversion device

Package, method for forming a package, carrier tape, chip card and...

Radio frequency transistor amplifiers having leadframes with integr...

Semiconductor device

Multi-zone radio frequency transistor amplifiers

Unitary housing for electronic device

Light-emitting device

Semiconductor module and method for manufacturing the same

Semiconductor package, semiconductor apparatus, and method for manu...

Insulating component, semiconductor package, and semiconductor appa...

Semiconductor package

Air cavity package using high temperature silicone adhesive

Package and semiconductor device

Semiconductor device, power conversion apparatus, and method for ma...

Semiconductor device

Semiconductor device and power conversion device

Semiconductor device, control device, and method for manufacturing...

Semiconductor device

Power semiconductor device and method of manufacturing the same, an...

Semiconductor package and semiconductor apparatus for use with high...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE PACKAGES WITH INTERNAL MOISTURE BARRIERS

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

CERAMIC SEMICONDUCTOR DEVICE PACKAGE

ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PACKAGE FOR A SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE AND PACKAGE

INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND A PACKAGE AND PROCES...

OUTPUT-INTEGRATED TRANSISTOR DEVICE PACKAGES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

INSULATING COMPONENT, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR APPA...

SEMICONDUCTOR DEVICE

PACKAGED RF POWER DEVICE WITH PCB ROUTING

Packaged Electronic Device

ELECTRONIC DEVICE PACKAGES WITH INTERNAL MOISTURE BARRIERS

PACKAGE, AND METHOD FOR MANUFACTURING POWER SEMICONDUCTOR MODULE

PACKAGE, METHOD FOR FORMING A PACKAGE, CARRIER TAPE, CHIP CARD AND...

POWER MODULE

MULTI-ZONE RADIO FREQUENCY TRANSISTOR AMPLIFIERS

RADIO FREQUENCY TRANSISTOR AMPLIFIERS HAVING LEADFRAMES WITH INTEGR...

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME

RF AMPLIFIER DEVICES AND METHODS OF MANUFACTURING

SEMICONDUCTOR PACKAGE

ELECTRONIC COMPONENT MOUNTING PACKAGE AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

SEMICONDUCTOR DEVICE