the wire connector connecting to a bonding area protruding from the surface

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H01L2224/4814

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/4814the wire connector connecting to a bonding area protruding from the surface

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for using spacer-on-spacer design for solder...
- Patent number 12,368,113
- Issue date Jul 22, 2025
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management
- Patent number 12,367,939
- Issue date Jul 22, 2025
- Micron Technology, Inc.
- Liang Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package comprising semiconductor chip with stepped po...
- Patent number 12,362,318
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cross stack bridge bonding devices and associated methods
- Patent number 12,362,319
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods of LIDAR sensor systems having integrated semic...
- Patent number 12,352,868
- Issue date Jul 8, 2025
- AURORA OPERATIONS, INC.
- James Ferrara
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Multi-role semiconductor device substrates, semiconductor device as...
- Patent number 12,354,939
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die for performing oper...
- Patent number 12,354,649
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device package die stacking system and method
- Patent number 12,347,810
- Issue date Jul 1, 2025
- Western Digital Technologies, Inc.
- Yazhou Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Method and apparatus for fault isolation, computer device, medium a...
- Patent number 12,347,093
- Issue date Jul 1, 2025
- China Electronics Reliability And Environmental Testing Institute
- Chao Pang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package having chip stack
- Patent number 12,327,821
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Won-young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for UBM/RDL routing
- Patent number 12,322,727
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 12,322,722
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Siliconized heterogeneous optical engine
- Patent number 12,292,605
- Issue date May 6, 2025
- Rockley Photonics Limited
- Seungjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with systems and methods for managing high...
- Patent number 12,293,992
- Issue date May 6, 2025
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,272,652
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Jiwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer configured for single touch-down testing
- Patent number 12,270,853
- Issue date Apr 8, 2025
- SanDisk Technologies, Inc.
- Toru Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate void filling for an integrated circuit assembly
- Patent number 12,237,300
- Issue date Feb 25, 2025
- Intel Corporation
- Tyler Leuten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through stack bridge bonding devices and associated methods
- Patent number 12,237,301
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,250
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,218,077
- Issue date Feb 4, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,211,829
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and lead frame with enhanced device isolation
- Patent number 12,211,770
- Issue date Jan 28, 2025
- Infineon Technologies Austria AG
- Balehithlu Manjappaiah Upendra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,205,875
- Issue date Jan 21, 2025
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF circuit module and manufacturing method therefor
- Patent number 12,199,083
- Issue date Jan 14, 2025
- Murata Manufacturing Co., Ltd.
- Masayuki Aoike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxially integrated protection diodes for monochromatic photosen...
- Patent number 12,199,112
- Issue date Jan 14, 2025
- National Technology & Engineering Solutions of Sandia, LLC
- Erik J. Skogen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with recessed molding region disposed below h...
- Patent number 12,191,290
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- In-Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple pixel package structure with buried chip and electronic de...
- Patent number 12,183,724
- Issue date Dec 31, 2024
- Lite-On Opto Technology (Changzhou) Co., Ltd.
- Chen-Hsiu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die
- Patent number 12,165,696
- Issue date Dec 10, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package
- Patent number 12,166,007
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Byeonguk Jeon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY DEVICE
- Publication number 20250239278
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250233093
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jungmin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250233100
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Youn Jo MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250226336
- Publication date Jul 10, 2025
- MEDIATEK SINGAPORE PTE LTD
- Zhigang DUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250218968
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Buwon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250218916
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Seungwan Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME WITH RETAINING FEATURES
- Publication number 20250218907
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jefferson LUGUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING PACKAGE-SIDE CONDUCTIVE PATH
- Publication number 20250210496
- Publication date Jun 26, 2025
- Christopher Schaef
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210533
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- JIWON SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210580
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Hee Woo AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS OF LIDAR SENSOR SYSTEMS HAVING INTEGRATED SEMIC...
- Publication number 20250208299
- Publication date Jun 26, 2025
- AURORA OPERATIONS, INC.
- James Ferrara
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210592
- Publication date Jun 26, 2025
- KIOXIA Corporation
- Yasuo TAKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210570
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Hakmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONITORING OF ELECTRONIC PACKAGES
- Publication number 20250210444
- Publication date Jun 26, 2025
- SK Hynix NAND Product Solutions Corp. (dba Solidigm)
- Jorge MARTINEZ ARAIZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210542
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Wooyeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH BOUNDARY...
- Publication number 20250201767
- Publication date Jun 19, 2025
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT PACKAGE HAVING AN INTERNAL REDUNDANT ELECTRICAL CONNE...
- Publication number 20250201682
- Publication date Jun 19, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250201755
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Kihong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS
- Publication number 20250192102
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH DUAL CHIP-PAD STRUCTURE AND SEMICONDUCTOR P...
- Publication number 20250192035
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Keunyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A COMPOSITE SPACER
- Publication number 20250192129
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Seunghyun BAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT ASSEMBLY FOR ELECTROLYTIC CAPACITORS ON SOLID STATE DRIVES
- Publication number 20250194016
- Publication date Jun 12, 2025
- Western Digital Technologies, Inc.
- Dibin Gangadharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK CHIP PACKAGE
- Publication number 20250183238
- Publication date Jun 5, 2025
- SK HYNIX INC.
- Dong Sop LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183147
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY SEMICONDUCTOR CHIP PACKAGE
- Publication number 20250183227
- Publication date Jun 5, 2025
- Micron Technology, Inc.
- Kelvin Aik Boo TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174556
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jitaek OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174617
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Junbyeong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167084
- Publication date May 22, 2025
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20250167115
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jimo GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH A CIRCUIT CARRIER
- Publication number 20250140663
- Publication date May 1, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS

the wire connector connecting to a bonding area protruding from the surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods and apparatus for using spacer-on-spacer design for solder...

Power management

Semiconductor package comprising semiconductor chip with stepped po...

Cross stack bridge bonding devices and associated methods

Systems and methods of LIDAR sensor systems having integrated semic...

Multi-role semiconductor device substrates, semiconductor device as...

Signal routing between memory die and logic die for performing oper...

Semiconductor device package die stacking system and method

Method and apparatus for fault isolation, computer device, medium a...

Semiconductor package having chip stack

Device and method for UBM/RDL routing

Die attached leveling control by metal stopper bumps

Siliconized heterogeneous optical engine

Semiconductor assemblies with systems and methods for managing high...

Semiconductor package

Semiconductor wafer configured for single touch-down testing

Through-substrate void filling for an integrated circuit assembly

Through stack bridge bonding devices and associated methods

Semiconductor package

Semiconductor device package

Semiconductor package

Semiconductor package and lead frame with enhanced device isolation

Package-on-package assembly with wire bond vias

Semiconductor device and manufacturing method thereof

RF circuit module and manufacturing method therefor

Epitaxially integrated protection diodes for monochromatic photosen...

Semiconductor package with recessed molding region disposed below h...

Multiple pixel package structure with buried chip and electronic de...

Signal routing between memory die and logic die

Semiconductor package

Patents Applicationslast 30 patents

MEMORY DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

LEADFRAME WITH RETAINING FEATURES

SEMICONDUCTOR DIE INCLUDING PACKAGE-SIDE CONDUCTIVE PATH

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SYSTEMS AND METHODS OF LIDAR SENSOR SYSTEMS HAVING INTEGRATED SEMIC...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

MONITORING OF ELECTRONIC PACKAGES

SEMICONDUCTOR PACKAGE

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH BOUNDARY...

SURFACE MOUNT PACKAGE HAVING AN INTERNAL REDUNDANT ELECTRICAL CONNE...

SEMICONDUCTOR PACKAGE

THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS

SEMICONDUCTOR CHIP WITH DUAL CHIP-PAD STRUCTURE AND SEMICONDUCTOR P...

SEMICONDUCTOR PACKAGE INCLUDING A COMPOSITE SPACER

EFFICIENT ASSEMBLY FOR ELECTROLYTIC CAPACITORS ON SOLID STATE DRIVES

STACK CHIP PACKAGE

SEMICONDUCTOR PACKAGE

HIGH-DENSITY SEMICONDUCTOR CHIP PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

POWER MODULE WITH A CIRCUIT CARRIER