the wire connector connecting to a bonding area protruding from the surface

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H01L2224/4814

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4814the wire connector connecting to a bonding area protruding from the surface

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 12,142,592
- Issue date Nov 12, 2024
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies and systems with one or more dies a...
- Patent number 12,125,816
- Issue date Oct 22, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and driving circuit structure
- Patent number 12,112,669
- Issue date Oct 8, 2024
- E Ink Holdings Inc.
- Shu-Fen Tsai
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Memory device for wafer-on-wafer formed memory and logic
- Patent number 12,112,792
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Signal routing between memory die and logic die for mode based oper...
- Patent number 12,112,793
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Die stack with cascade and vertical connections
- Patent number 12,068,283
- Issue date Aug 20, 2024
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting substrate, method of manufacturing light-emitting su...
- Patent number 12,046,591
- Issue date Jul 23, 2024
- BOE Technology Group Co., Ltd.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a suspended reinforcing layer and me...
- Patent number 12,033,958
- Issue date Jul 9, 2024
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 12,033,983
- Issue date Jul 9, 2024
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor assemblies and methods of manufact...
- Patent number 12,033,929
- Issue date Jul 9, 2024
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film in substrate for releasing z stack-up constraint
- Patent number 12,027,496
- Issue date Jul 2, 2024
- Intel Corporation
- Jianfeng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with unbalanced die stackup
- Patent number 12,027,497
- Issue date Jul 2, 2024
- Western Digital Technologies, Inc.
- Haiyue Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 12,009,344
- Issue date Jun 11, 2024
- SK hynix Inc.
- Jin Kyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Semiconductor devices, semiconductor device packages, electronic sy...
- Patent number 11,984,440
- Issue date May 14, 2024
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic sense amplifier supply voltage for power and die size reduc...
- Patent number 11,978,516
- Issue date May 7, 2024
- SANDISK TECHNOLOGIES LLC
- Yanjie Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated high voltage capacitor
- Patent number 11,967,610
- Issue date Apr 23, 2024
- Semtech Corporation
- Christopher David Ainsworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and related methods
- Patent number 11,961,775
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, semiconductor package structure, and method for...
- Patent number 11,961,831
- Issue date Apr 16, 2024
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including multiple stacks of differ...
- Patent number 11,961,821
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Blaine J. Thurgood
- G11 - INFORMATION STORAGE
Information Patent Grant
Die over mold stacked semiconductor package
- Patent number 11,948,917
- Issue date Apr 2, 2024
- Intel Corporation
- Florence Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package
- Patent number 11,948,919
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Ae-Nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management
- Patent number 11,935,602
- Issue date Mar 19, 2024
- Micron Technology, Inc.
- Liang Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 11,923,331
- Issue date Mar 5, 2024
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having chip stack
- Patent number 11,916,042
- Issue date Feb 27, 2024
- Samsung Electronics Co., Ltd.
- Won-young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-on-wafer formed memory and logic for genomic annotations
- Patent number 11,915,742
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor die stack having bent wires and vertical wires and a...
- Patent number 11,908,825
- Issue date Feb 20, 2024
- SK hynix Inc.
- Jeong Hyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,901,345
- Issue date Feb 13, 2024
- SK hynix Inc.
- Jeong Hyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,901,348
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Tae-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated heat distribution and manufact...
- Patent number 11,901,343
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240387460
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Heejae NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND WIRE INDUCTION APPARATUS
- Publication number 20240371914
- Publication date Nov 7, 2024
- Micron Technology, Inc.
- Carlos Franco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING SEMICONDUCTO...
- Publication number 20240365543
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Taegon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240347466
- Publication date Oct 17, 2024
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347499
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND ELECTRO...
- Publication number 20240349520
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Moorym CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY REGULATED SEMICONDUCTOR DEVICE
- Publication number 20240347413
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Chen Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CONTROL CHIP INCLUDING CHIP ENABLE...
- Publication number 20240339435
- Publication date Oct 10, 2024
- SK HYNIX INC.
- Ki Yong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...
- Publication number 20240339390
- Publication date Oct 10, 2024
- Lodestar Licensing Group LLC
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES
- Publication number 20240339436
- Publication date Oct 10, 2024
- SK HYNIX INC.
- Eun Hye DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...
- Publication number 20240339444
- Publication date Oct 10, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE
- Publication number 20240332105
- Publication date Oct 3, 2024
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240332171
- Publication date Oct 3, 2024
- Rohm Co., Ltd.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING COMPENSATED ELECTRICAL CHANNEL PATHS
- Publication number 20240321710
- Publication date Sep 26, 2024
- SK HYNIX INC.
- Ki Yong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE
- Publication number 20240319455
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321826
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Dongchul YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE OF STACKED CHIPS T...
- Publication number 20240321704
- Publication date Sep 26, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Maohua DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20240321774
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kitae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND CHIP
- Publication number 20240321828
- Publication date Sep 26, 2024
- ALi Corporation
- Liang-Cai Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240312974
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- KYOUNGLIM SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND AS...
- Publication number 20240312890
- Publication date Sep 19, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312958
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Toshimitsu ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Die Stackup and Interposer
- Publication number 20240312916
- Publication date Sep 19, 2024
- Western Digital Technologies, Inc.
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THERMAL DISSIPATION FEATURES FOR A FLIP CHIP STRUCTURE
- Publication number 20240304515
- Publication date Sep 12, 2024
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE, FABRICATING METHOD THEREOF, AND ME...
- Publication number 20240304509
- Publication date Sep 12, 2024
- Yangtze Memory Technologies Co., Ltd.
- Hui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER APPARATUS
- Publication number 20240304530
- Publication date Sep 12, 2024
- Fuji Electric Co., Ltd.
- Hisato INOKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF
- Publication number 20240304607
- Publication date Sep 12, 2024
- KIOXIA Corporation
- Kazuma HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MULTI-DIE QFP-QFN PACKAGE
- Publication number 20240297147
- Publication date Sep 5, 2024
- STMicroelectronics International N.V.
- Shei Meng LOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...
- Publication number 20240290761
- Publication date Aug 29, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20240282756
- Publication date Aug 22, 2024
- SK HYNIX INC.
- Jin Kyoung PARK
- H01 - BASIC ELECTRIC ELEMENTS

the wire connector connecting to a bonding area protruding from the surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package including stacked semiconductor chips

Semiconductor device assemblies and systems with one or more dies a...

Display device and driving circuit structure

Memory device for wafer-on-wafer formed memory and logic

Signal routing between memory die and logic die for mode based oper...

Die stack with cascade and vertical connections

Light-emitting substrate, method of manufacturing light-emitting su...

Semiconductor device including a suspended reinforcing layer and me...

Method for interconnecting stacked semiconductor devices

Package-on-package semiconductor assemblies and methods of manufact...

Film in substrate for releasing z stack-up constraint

Semiconductor device with unbalanced die stackup

Semiconductor package including stacked semiconductor chips

Multiple plated via arrays of different wire heights on a same subs...

Semiconductor devices, semiconductor device packages, electronic sy...

Dynamic sense amplifier supply voltage for power and die size reduc...

Integrated high voltage capacitor

Semiconductor devices and related methods

Electronic package, semiconductor package structure, and method for...

Semiconductor device assemblies including multiple stacks of differ...

Die over mold stacked semiconductor package

Stacked semiconductor package

Power management

Die attached leveling control by metal stopper bumps

Semiconductor package having chip stack

Wafer-on-wafer formed memory and logic for genomic annotations

Semiconductor die stack having bent wires and vertical wires and a...

Semiconductor package

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor device with integrated heat distribution and manufact...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

BOND WIRE INDUCTION APPARATUS

SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING SEMICONDUCTO...

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND ELECTRO...

THERMALLY REGULATED SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING CONTROL CHIP INCLUDING CHIP ENABLE...

PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...

STACK PACKAGES

LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...

MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

SEMICONDUCTOR PACKAGE HAVING COMPENSATED ELECTRICAL CHANNEL PATHS

PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE OF STACKED CHIPS T...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

INTEGRATED CIRCUIT STRUCTURE AND CHIP

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND AS...

SEMICONDUCTOR DEVICE

Semiconductor Device Package with Die Stackup and Interposer

HIGH THERMAL DISSIPATION FEATURES FOR A FLIP CHIP STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE, FABRICATING METHOD THEREOF, AND ME...

POWER CONVERTER APPARATUS

SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF

HYBRID MULTI-DIE QFP-QFN PACKAGE

SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS