Thermal management

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CPC
H01L2225/06589

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

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H01L2225/06589Thermal management

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of three-dimensional stacking structure
- Patent number 12,191,283
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally efficient semiconductor device assemblies including inter...
- Patent number 12,191,284
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Pezhman Monadgemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic conductive columns in a semiconductor device and associa...
- Patent number 12,183,716
- Issue date Dec 31, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,170,237
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with direct chip attach to circuit bo...
- Patent number 12,170,273
- Issue date Dec 17, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,165,991
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-bonded memory stacks with copper-bonded interconnection memo...
- Patent number 12,166,027
- Issue date Dec 10, 2024
- Avago Technologies International Sales Pte. Limited
- Thomas Edward Dungan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die
- Patent number 12,165,696
- Issue date Dec 10, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory device and manufacturing method thereof
- Patent number 12,148,735
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,136,596
- Issue date Nov 5, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid fan-out architecture with EMIB and glass core for heterogene...
- Patent number 12,125,793
- Issue date Oct 22, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies with molded support substrates
- Patent number 12,119,325
- Issue date Oct 15, 2024
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device for wafer-on-wafer formed memory and logic
- Patent number 12,112,792
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Signal routing between memory die and logic die for mode based oper...
- Patent number 12,112,793
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid fan-out architecture with EMIB and glass core for heterogene...
- Patent number 12,087,695
- Issue date Sep 10, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and mechanism for processing neural network tasks using a...
- Patent number 12,079,711
- Issue date Sep 3, 2024
- Google LLC
- Uday Kumar Dasari
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package including a molding layer
- Patent number 12,080,676
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Hae-Jung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation in semiconductor packages and methods of forming same
- Patent number 12,074,148
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for providing thermal wear leveling
- Patent number 12,068,215
- Issue date Aug 20, 2024
- Advanced Micro Devices, Inc.
- David A. Roberts
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structures
- Patent number 12,068,218
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive film sheet and semiconductor package including the same
- Patent number 12,062,633
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,057,408
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Chulwoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EM and RF mitigation silicon structures in stacked die microprocess...
- Patent number 12,057,433
- Issue date Aug 6, 2024
- Intel Corporation
- Sameer Shekhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,051,674
- Issue date Jul 30, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a method for manufacturing the same
- Patent number 12,040,313
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a through intervia through the molding...
- Patent number 12,033,976
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal pads between stacked semiconductor dies and associated syst...
- Patent number 12,033,980
- Issue date Jul 9, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having stiffener structure
- Patent number 12,027,471
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Eunkyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies and systems with improved thermal p...
- Patent number 12,015,011
- Issue date Jun 18, 2024
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250014963
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...
- Publication number 20250015003
- Publication date Jan 9, 2025
- Intel Corporation
- Srinivas PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A THROUGH VIA BETWEEN REDISTRIBUTION LAYERS
- Publication number 20250008750
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES
- Publication number 20250006697
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORTHOGONAL BRIDGE PACKAGING TECHNOLOGY
- Publication number 20250006699
- Publication date Jan 2, 2025
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE
- Publication number 20250006586
- Publication date Jan 2, 2025
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE FOR MODE BASED OPER...
- Publication number 20250006251
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240429194
- Publication date Dec 26, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- EUNSU LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH VERY THIN VAPOR CHAMBER FOR HEAT DISSIPATION
- Publication number 20240429123
- Publication date Dec 26, 2024
- WEI-LIN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC
- Publication number 20240420757
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND APPARATUS FOR PROVIDING THERMAL WEAR LEVELING
- Publication number 20240413035
- Publication date Dec 12, 2024
- ADVANCED MICRO DEVICES, INC.
- David A. Roberts
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Multi-Die Package Structures Including Redistribution Layers
- Publication number 20240404992
- Publication date Dec 5, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A MOLDING LAYER
- Publication number 20240404984
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- HAE-JUNG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED HEAT DISSIPATION
- Publication number 20240404911
- Publication date Dec 5, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240404909
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SPACER
- Publication number 20240404994
- Publication date Dec 5, 2024
- Western Digital Technologies, Inc.
- Jayavel Pachamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THEREOF
- Publication number 20240395751
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC LID STRUCTURE FOR DISSIPATING HEAT GENERATED BY A THERMAL...
- Publication number 20240395770
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...
- Publication number 20240387459
- Publication date Nov 21, 2024
- Microsoft Technology Licensing, LLC
- Haohua ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH LOGIC CIRCUITS, MEMORY C...
- Publication number 20240389366
- Publication date Nov 21, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387454
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE COMPOSITION
- Publication number 20240376294
- Publication date Nov 14, 2024
- SUMITOMO CHEMICAL CO., LTD.
- Thomas Fletcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES
- Publication number 20240371724
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipation in Semiconductor Packages and Methods of Forming Same
- Publication number 20240371839
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT CHIPS INCORPORATING NEGATIVE POISSON`S RATIO STRUCTURES
- Publication number 20240363458
- Publication date Oct 31, 2024
- Joon Bu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EM AND RF MITIGATION SILICON STRUCTURES IN STACKED DIE MICROPROCESS...
- Publication number 20240355778
- Publication date Oct 24, 2024
- Intel Corporation
- Sameer SHEKHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING THERMAL IMPACTS ON ADJACENT STACKED SEMICONDUCTOR DEVICES
- Publication number 20240347505
- Publication date Oct 17, 2024
- Lodestar Licensing Group LLC
- Sui Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...
- Publication number 20240347511
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMPROVED THERMAL P...
- Publication number 20240339437
- Publication date Oct 10, 2024
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20240332255
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- HYUEKJAE LEE
- H01 - BASIC ELECTRIC ELEMENTS

Thermal management

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of three-dimensional stacking structure

Thermally efficient semiconductor device assemblies including inter...

Monolithic conductive columns in a semiconductor device and associa...

Semiconductor structure and manufacturing method thereof

Integrated circuit assemblies with direct chip attach to circuit bo...

Semiconductor package

Copper-bonded memory stacks with copper-bonded interconnection memo...

Signal routing between memory die and logic die

Memory device and manufacturing method thereof

Integrated fan-out package and the methods of manufacturing

Microelectronic assemblies

Hybrid fan-out architecture with EMIB and glass core for heterogene...

Semiconductor device assemblies with molded support substrates

Memory device for wafer-on-wafer formed memory and logic

Signal routing between memory die and logic die for mode based oper...

Hybrid fan-out architecture with EMIB and glass core for heterogene...

Apparatus and mechanism for processing neural network tasks using a...

Semiconductor package including a molding layer

Heat dissipation in semiconductor packages and methods of forming same

Method and apparatus for providing thermal wear leveling

Package structures

Non-conductive film sheet and semiconductor package including the same

Semiconductor packages

EM and RF mitigation silicon structures in stacked die microprocess...

3D semiconductor device and structure with metal layers

Semiconductor package and a method for manufacturing the same

Semiconductor package having a through intervia through the molding...

Thermal pads between stacked semiconductor dies and associated syst...

Semiconductor package having stiffener structure

Semiconductor device assemblies and systems with improved thermal p...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...

SEMICONDUCTOR DEVICE WITH A THROUGH VIA BETWEEN REDISTRIBUTION LAYERS

SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES

ORTHOGONAL BRIDGE PACKAGING TECHNOLOGY

SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE

SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE FOR MODE BASED OPER...

SEMICONDUCTOR PACKAGE

IC PACKAGE WITH VERY THIN VAPOR CHAMBER FOR HEAT DISSIPATION

MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC

METHOD AND APPARATUS FOR PROVIDING THERMAL WEAR LEVELING

Multi-Die Package Structures Including Redistribution Layers

SEMICONDUCTOR PACKAGE INCLUDING A MOLDING LAYER

SEMICONDUCTOR PACKAGE WITH IMPROVED HEAT DISSIPATION

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

THERMALLY CONDUCTIVE SPACER

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THEREOF

METALLIC LID STRUCTURE FOR DISSIPATING HEAT GENERATED BY A THERMAL...

THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH LOGIC CIRCUITS, MEMORY C...

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

THERMALLY CONDUCTIVE COMPOSITION

PACKAGE STRUCTURES

Heat Dissipation in Semiconductor Packages and Methods of Forming Same

CIRCUIT CHIPS INCORPORATING NEGATIVE POISSON`S RATIO STRUCTURES

EM AND RF MITIGATION SILICON STRUCTURES IN STACKED DIE MICROPROCESS...

MITIGATING THERMAL IMPACTS ON ADJACENT STACKED SEMICONDUCTOR DEVICES

THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...

SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMPROVED THERMAL P...

SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME