Thermal management

Industry

CPC
H01L2225/06589

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06589Thermal management

Industries

Patents Grantslast 30 patents

Information Patent Grant
Circuit board assembly and manufacturing method thereof
- Patent number 12,324,100
- Issue date Jun 3, 2025
- Unimicron Technology Corp.
- Yu-Shen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,322,742
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,315,840
- Issue date May 27, 2025
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact for thermal displacement in a multi-wafer stacked...
- Patent number 12,300,669
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 12,300,575
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooled interposer for integrated circuit stack
- Patent number 12,300,579
- Issue date May 13, 2025
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power module package structures
- Patent number 12,293,955
- Issue date May 6, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with signal bump and dummy bump, semiconductor p...
- Patent number 12,288,762
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Keum Hee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,288,751
- Issue date Apr 29, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of forming the same
- Patent number 12,283,537
- Issue date Apr 22, 2025
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,278,216
- Issue date Apr 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal structure for semiconductor device and method of forming th...
- Patent number 12,272,613
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for integrated cold plate in XPUs and memory
- Patent number 12,266,545
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Laura Mirkarimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement and thermal management of 3D stacked dies
- Patent number 12,266,585
- Issue date Apr 1, 2025
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,255,182
- Issue date Mar 18, 2025
- Siliconware Precision Industries Co., Ltd.
- Meng-Huan Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat dissipation layer
- Patent number 12,255,183
- Issue date Mar 18, 2025
- SK hynix Inc.
- Joo Wan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having supportive plating structures
- Patent number 12,237,275
- Issue date Feb 25, 2025
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided substrate with cavities for direct die-to-die intercon...
- Patent number 12,230,610
- Issue date Feb 18, 2025
- Intel Corporation
- Pooya Tadayon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,230,606
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit structure with direct die heat removal structure
- Patent number 12,224,225
- Issue date Feb 11, 2025
- INVENTION AND COLLABORATION LABORATORY, INC.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,218,102
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Youngkun Jee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with substrate heat sinks and...
- Patent number 12,211,822
- Issue date Jan 28, 2025
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including monolithic silicon struct...
- Patent number 12,205,865
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable logic device with fine-grained disaggregation
- Patent number 12,206,410
- Issue date Jan 21, 2025
- Intel Corporation
- Dheeraj Subbareddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package and method of manufactu...
- Patent number 12,199,056
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Jumyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded liquid cooling
- Patent number 12,199,011
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic device assemblies and packages
- Patent number 12,199,068
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of three-dimensional stacking structure
- Patent number 12,191,283
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally efficient semiconductor device assemblies including inter...
- Patent number 12,191,284
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Pezhman Monadgemi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED LIQUID COOLING
- Publication number 20250183120
- Publication date Jun 5, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR APPARATUS
- Publication number 20250183233
- Publication date Jun 5, 2025
- Mitsubishi Electric Corporation
- Kozo HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PRODUCING HIGH POWER MODULE PACKAGE STRUCTURES
- Publication number 20250174515
- Publication date May 29, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167137
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167178
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Youngkun JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MONOLITHIC SILICON STRUCT...
- Publication number 20250167072
- Publication date May 22, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-IC FOR RF APPLICATIONS
- Publication number 20250157988
- Publication date May 15, 2025
- INFINEON TECHNOLOGIES AG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH THERMAL DISSIPATION LAYER AND METHOD O...
- Publication number 20250149345
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20250149512
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE AND INTEGRATED CIRCUIT PACKAGE INCLUDING THE...
- Publication number 20250151411
- Publication date May 8, 2025
- Myeong-Eun HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149481
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING
- Publication number 20250140642
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A CORE LAYER
- Publication number 20250140771
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Dahee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC CONDUCTIVE COLUMNS IN A SEMICONDUCTOR DEVICE AND ASSOCIA...
- Publication number 20250140756
- Publication date May 1, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY PACKAGING WITH INTEGRATED ACTIVE COOLING DEVICES AND RELATED...
- Publication number 20250132290
- Publication date Apr 24, 2025
- SMART Modular Technologies, Inc.
- Satyanarayan Iyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250126809
- Publication date Apr 17, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTED MEMORY STACK
- Publication number 20250125220
- Publication date Apr 17, 2025
- ADVANCED MICRO DEVICES, INC.
- Gabriel LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND CO-PACKAGING OF CONFINEMENT APPARATUS AND APPLICATI...
- Publication number 20250125314
- Publication date Apr 17, 2025
- Quantinuum LLC
- David DEEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118650
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- SUNJAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE
- Publication number 20250118625
- Publication date Apr 10, 2025
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE
- Publication number 20250112116
- Publication date Apr 3, 2025
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20250105181
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jumyong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE
- Publication number 20250104761
- Publication date Mar 27, 2025
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250105182
- Publication date Mar 27, 2025
- SAMSUNG ELECTRONICS CO,. LTD.
- JAEYONG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND METHOD OF HEATING SEMICONDUCTOR ST...
- Publication number 20250096102
- Publication date Mar 20, 2025
- KIOXIA Corporation
- Kazuma HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250096204
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SANDWICHED MULTI-LAYER STRUCTURE FOR COOLING HIGH POWER ELECTRONICS
- Publication number 20250087557
- Publication date Mar 13, 2025
- Tesla, Inc.
- Aydin Nabovati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION
- Publication number 20250079261
- Publication date Mar 6, 2025
- UTAC Headquarters Pte. Ltd.
- IL Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF ELECTRONIC SYSTEM ASSEMBLY WITH THERMAL INTERFACE PAD AN...
- Publication number 20250079358
- Publication date Mar 6, 2025
- Tesla, Inc.
- Abel Misrak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR...
- Publication number 20250070070
- Publication date Feb 27, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Mirko BERNARDONI
- H01 - BASIC ELECTRIC ELEMENTS

Thermal management

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board assembly and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Microelectronic assemblies

Backside contact for thermal displacement in a multi-wafer stacked...

Semiconductor package and method

Liquid cooled interposer for integrated circuit stack

High power module package structures

Semiconductor chip with signal bump and dummy bump, semiconductor p...

Microelectronic assemblies

Electronic package and method of forming the same

3D semiconductor device and structure with metal layers

Thermal structure for semiconductor device and method of forming th...

Structures and methods for integrated cold plate in XPUs and memory

Arrangement and thermal management of 3D stacked dies

Electronic package and manufacturing method thereof

Semiconductor package including heat dissipation layer

Semiconductor devices having supportive plating structures

Double-sided substrate with cavities for direct die-to-die intercon...

Semiconductor package and related methods

Semiconductor circuit structure with direct die heat removal structure

Semiconductor package

Stacked semiconductor die assemblies with substrate heat sinks and...

Semiconductor device assemblies including monolithic silicon struct...

Programmable logic device with fine-grained disaggregation

Multi-die package structures including redistribution layers

Semiconductor device, semiconductor package and method of manufactu...

Embedded liquid cooling

Methods of forming microelectronic device assemblies and packages

Manufacturing method of three-dimensional stacking structure

Thermally efficient semiconductor device assemblies including inter...

Patents Applicationslast 30 patents

EMBEDDED LIQUID COOLING

POWER MODULE SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR APPARATUS

METHODS OF PRODUCING HIGH POWER MODULE PACKAGE STRUCTURES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MONOLITHIC SILICON STRUCT...

3D-IC FOR RF APPLICATIONS

SEMICONDUCTOR STRUCTURE WITH THERMAL DISSIPATION LAYER AND METHOD O...

SEMICONDUCTOR PACKAGE AND RELATED METHODS

INTEGRATED CIRCUIT DIE AND INTEGRATED CIRCUIT PACKAGE INCLUDING THE...

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING

SEMICONDUCTOR PACKAGE INCLUDING A CORE LAYER

MONOLITHIC CONDUCTIVE COLUMNS IN A SEMICONDUCTOR DEVICE AND ASSOCIA...

MEMORY PACKAGING WITH INTEGRATED ACTIVE COOLING DEVICES AND RELATED...

SEMICONDUCTOR STRUCTURE

INVERTED MEMORY STACK

INTEGRATION AND CO-PACKAGING OF CONFINEMENT APPARATUS AND APPLICATI...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE

SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR STORAGE DEVICE AND METHOD OF HEATING SEMICONDUCTOR ST...

THREE-DIMENSIONAL STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF

SANDWICHED MULTI-LAYER STRUCTURE FOR COOLING HIGH POWER ELECTRONICS

SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION

METHODS OF ELECTRONIC SYSTEM ASSEMBLY WITH THERMAL INTERFACE PAD AN...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR...