Thermal management

Industry

CPC
H01L2225/06589

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06589Thermal management

Industries

Patents Grantslast 30 patents

Information Patent Grant
Memory device and manufacturing method thereof
- Patent number 12,148,735
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,136,596
- Issue date Nov 5, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid fan-out architecture with EMIB and glass core for heterogene...
- Patent number 12,125,793
- Issue date Oct 22, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies with molded support substrates
- Patent number 12,119,325
- Issue date Oct 15, 2024
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device for wafer-on-wafer formed memory and logic
- Patent number 12,112,792
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Signal routing between memory die and logic die for mode based oper...
- Patent number 12,112,793
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid fan-out architecture with EMIB and glass core for heterogene...
- Patent number 12,087,695
- Issue date Sep 10, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and mechanism for processing neural network tasks using a...
- Patent number 12,079,711
- Issue date Sep 3, 2024
- Google LLC
- Uday Kumar Dasari
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package including a molding layer
- Patent number 12,080,676
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Hae-Jung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation in semiconductor packages and methods of forming same
- Patent number 12,074,148
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for providing thermal wear leveling
- Patent number 12,068,215
- Issue date Aug 20, 2024
- Advanced Micro Devices, Inc.
- David A. Roberts
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structures
- Patent number 12,068,218
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive film sheet and semiconductor package including the same
- Patent number 12,062,633
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,057,408
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Chulwoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EM and RF mitigation silicon structures in stacked die microprocess...
- Patent number 12,057,433
- Issue date Aug 6, 2024
- Intel Corporation
- Sameer Shekhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,051,674
- Issue date Jul 30, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a method for manufacturing the same
- Patent number 12,040,313
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a through intervia through the molding...
- Patent number 12,033,976
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal pads between stacked semiconductor dies and associated syst...
- Patent number 12,033,980
- Issue date Jul 9, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having stiffener structure
- Patent number 12,027,471
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Eunkyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies and systems with improved thermal p...
- Patent number 12,015,011
- Issue date Jun 18, 2024
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable package and method
- Patent number 12,009,343
- Issue date Jun 11, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of manufacturing the same
- Patent number 12,002,729
- Issue date Jun 4, 2024
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,002,778
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,996,387
- Issue date May 28, 2024
- Samsung Electronics Co., Ltd.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,996,345
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,990,452
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigating thermal impacts on adjacent stacked semiconductor devices
- Patent number 11,984,427
- Issue date May 14, 2024
- Sui Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for managing thermal dissipation in multi-stack...
- Patent number 11,977,781
- Issue date May 7, 2024
- SMART IOPS, INC.
- Ashutosh K. Das
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THEREOF
- Publication number 20240395751
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC LID STRUCTURE FOR DISSIPATING HEAT GENERATED BY A THERMAL...
- Publication number 20240395770
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...
- Publication number 20240387459
- Publication date Nov 21, 2024
- Microsoft Technology Licensing, LLC
- Haohua ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH LOGIC CIRCUITS, MEMORY C...
- Publication number 20240389366
- Publication date Nov 21, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387454
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE COMPOSITION
- Publication number 20240376294
- Publication date Nov 14, 2024
- SUMITOMO CHEMICAL CO., LTD.
- Thomas Fletcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES
- Publication number 20240371724
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipation in Semiconductor Packages and Methods of Forming Same
- Publication number 20240371839
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT CHIPS INCORPORATING NEGATIVE POISSON`S RATIO STRUCTURES
- Publication number 20240363458
- Publication date Oct 31, 2024
- Joon Bu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EM AND RF MITIGATION SILICON STRUCTURES IN STACKED DIE MICROPROCESS...
- Publication number 20240355778
- Publication date Oct 24, 2024
- Intel Corporation
- Sameer SHEKHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING THERMAL IMPACTS ON ADJACENT STACKED SEMICONDUCTOR DEVICES
- Publication number 20240347505
- Publication date Oct 17, 2024
- Lodestar Licensing Group LLC
- Sui Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...
- Publication number 20240347511
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMPROVED THERMAL P...
- Publication number 20240339437
- Publication date Oct 10, 2024
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20240332255
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- HYUEKJAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20240321832
- Publication date Sep 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING STIFFENER STRUCTURE
- Publication number 20240321776
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- EUNKYOUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH 2-PHASE COOLING STRUCTURE
- Publication number 20240321680
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Sungchan KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240290751
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...
- Publication number 20240290761
- Publication date Aug 29, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH STACKED DIES AND METHODS OF FORMING THE...
- Publication number 20240282732
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL LAYER PROTECTION STRUCTURES AND METHODS...
- Publication number 20240274503
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEGGED SUPPORT STRUCTURE TO MITIGATE STACKED DIE OVERHANG DEFLECTION
- Publication number 20240268132
- Publication date Aug 8, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240266246
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING THERMAL DISSIPATION STRUCTURE THEREIN AND...
- Publication number 20240258122
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS
- Publication number 20240250067
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED LIQUID COOLING
- Publication number 20240222222
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20240222333
- Publication date Jul 4, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER
- Publication number 20240222217
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Sunjae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES
- Publication number 20240222218
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED C...
- Publication number 20240213235
- Publication date Jun 27, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS

Thermal management

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Memory device and manufacturing method thereof

Integrated fan-out package and the methods of manufacturing

Microelectronic assemblies

Hybrid fan-out architecture with EMIB and glass core for heterogene...

Semiconductor device assemblies with molded support substrates

Memory device for wafer-on-wafer formed memory and logic

Signal routing between memory die and logic die for mode based oper...

Hybrid fan-out architecture with EMIB and glass core for heterogene...

Apparatus and mechanism for processing neural network tasks using a...

Semiconductor package including a molding layer

Heat dissipation in semiconductor packages and methods of forming same

Method and apparatus for providing thermal wear leveling

Package structures

Non-conductive film sheet and semiconductor package including the same

Semiconductor packages

EM and RF mitigation silicon structures in stacked die microprocess...

3D semiconductor device and structure with metal layers

Semiconductor package and a method for manufacturing the same

Semiconductor package having a through intervia through the molding...

Thermal pads between stacked semiconductor dies and associated syst...

Semiconductor package having stiffener structure

Semiconductor device assemblies and systems with improved thermal p...

Stackable package and method

Electronic package and method of manufacturing the same

Semiconductor packages and methods of forming the same

Semiconductor package

Package structure and manufacturing method thereof

Semiconductor package

Mitigating thermal impacts on adjacent stacked semiconductor devices

Systems and methods for managing thermal dissipation in multi-stack...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THEREOF

METALLIC LID STRUCTURE FOR DISSIPATING HEAT GENERATED BY A THERMAL...

THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH LOGIC CIRCUITS, MEMORY C...

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

THERMALLY CONDUCTIVE COMPOSITION

PACKAGE STRUCTURES

Heat Dissipation in Semiconductor Packages and Methods of Forming Same

CIRCUIT CHIPS INCORPORATING NEGATIVE POISSON`S RATIO STRUCTURES

EM AND RF MITIGATION SILICON STRUCTURES IN STACKED DIE MICROPROCESS...

MITIGATING THERMAL IMPACTS ON ADJACENT STACKED SEMICONDUCTOR DEVICES

THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...

SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMPROVED THERMAL P...

SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

SEMICONDUCTOR PACKAGE HAVING STIFFENER STRUCTURE

SEMICONDUCTOR DEVICE WITH 2-PHASE COOLING STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...

SEMICONDUCTOR PACKAGES WITH STACKED DIES AND METHODS OF FORMING THE...

THERMAL INTERFACE MATERIAL LAYER PROTECTION STRUCTURES AND METHODS...

LEGGED SUPPORT STRUCTURE TO MITIGATE STACKED DIE OVERHANG DEFLECTION

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE HAVING THERMAL DISSIPATION STRUCTURE THEREIN AND...

MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS

EMBEDDED LIQUID COOLING

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER

3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES

ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED C...