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SEMICONDUCTOR PACKAGE
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Publication number 20240128195
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Publication date Apr 18, 2024
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Samsung Electronics Co., Ltd.
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Sangwoong Lee
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240088075
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Publication date Mar 14, 2024
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Samsung Electronics Co., Ltd.
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Sunkyoung SEO
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H01 - BASIC ELECTRIC ELEMENTS
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Integrated Circuit Package and Method
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Publication number 20240088123
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Publication date Mar 14, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Chen-Hua Yu
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240087976
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Publication date Mar 14, 2024
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Samsung Electronics Co., Ltd.
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Youngdeuk Kim
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240055339
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Publication date Feb 15, 2024
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Samsung Electronics Co., Ltd.
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Hwanjoo Park
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H01 - BASIC ELECTRIC ELEMENTS
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BONDED SEMICONDUCTOR DEVICE
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Publication number 20240047396
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Publication date Feb 8, 2024
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Micron Technology, Inc.
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Thiagarajan Raman
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR STRUCTURE
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Publication number 20240047298
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Publication date Feb 8, 2024
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nD-HI Technologies Lab, Inc.
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Ho-Ming TONG
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H01 - BASIC ELECTRIC ELEMENTS
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MICROELECTRONIC ASSEMBLIES
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Publication number 20240030150
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Publication date Jan 25, 2024
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Intel Corporation
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Aleksandar Aleksov
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE AND METHOD
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Publication number 20240014095
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Publication date Jan 11, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Ming-Fa Chen
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H01 - BASIC ELECTRIC ELEMENTS
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