Titanium [Ti] as principal constituent

Industry

CPC
H01L2224/29166

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29166Titanium [Ti] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for producing nitride mesas each intended to form an electro...
- Patent number 12,278,224
- Issue date Apr 15, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Guy Feuillet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 12,255,168
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 12,087,723
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for multi-color LED pixel unit with vertical li...
- Patent number 12,074,151
- Issue date Aug 27, 2024
- Jade Bird Display (Shanghai) Limited
- Qunchao Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out packaging
- Patent number 12,062,622
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-Ping Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,051,633
- Issue date Jul 30, 2024
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 12,051,669
- Issue date Jul 30, 2024
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for multi-color LED pixel unit with vertical li...
- Patent number 12,027,509
- Issue date Jul 2, 2024
- Jade Bird Display (Shanghai) Limited
- Qunchao Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,854,923
- Issue date Dec 26, 2023
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 11,610,861
- Issue date Mar 21, 2023
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,502,014
- Issue date Nov 15, 2022
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side metallization
- Patent number 11,488,922
- Issue date Nov 1, 2022
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silver nano-twinned thin film structure and method for forming the...
- Patent number 11,488,920
- Issue date Nov 1, 2022
- AG MATERIALS TECHNOLOGY CO., LTD.
- Hsing-Hua Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out packaging
- Patent number 11,437,327
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-Ping Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fastening a semiconductor chip on a substrate, and elect...
- Patent number 11,315,898
- Issue date Apr 26, 2022
- OSRAM OLED GmbH
- Klaus Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide devices and methods for manufacturing the same
- Patent number 11,282,805
- Issue date Mar 22, 2022
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device, silicon carbide semiconductor...
- Patent number 11,183,476
- Issue date Nov 23, 2021
- Fuji Electric Co., Ltd.
- Makoto Utsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 11,152,325
- Issue date Oct 19, 2021
- Cree, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel lanthanide alloys for MEMS packaging applications
- Patent number 11,091,366
- Issue date Aug 17, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor devices including a metal silicide layer and methods...
- Patent number 11,063,014
- Issue date Jul 13, 2021
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side metallization
- Patent number 10,957,669
- Issue date Mar 23, 2021
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dam for three-dimensional integrated circuit
- Patent number 10,867,878
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out packaging
- Patent number 10,867,930
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-Ping Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor apparatus
- Patent number 10,847,699
- Issue date Nov 24, 2020
- Nikkiso Co., Ltd.
- Shoichi Niizeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for semiconductor, and semiconductor device
- Patent number 10,818,610
- Issue date Oct 27, 2020
- LG Chem, Ltd.
- Hee Jung Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, POWER DEVICE, AND POWER MODULE
- Publication number 20250210574
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND BYPRODUCT OF SEMICONDUCTOR COMP...
- Publication number 20250201752
- Publication date Jun 19, 2025
- PANJIT INTERNATIONAL INC.
- Chung Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250201753
- Publication date Jun 19, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME
- Publication number 20250191984
- Publication date Jun 12, 2025
- AMOGREENTECH CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250183217
- Publication date Jun 5, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250149515
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Kiju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250140733
- Publication date May 1, 2025
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BONDING ON AuSn BASIS WITH LOW BONDING TEMPERATURE
- Publication number 20250046748
- Publication date Feb 6, 2025
- ams-OSRAM International GmbH
- Klaus MUELLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022873
- Publication date Jan 16, 2025
- Murata Manufacturing Co., Ltd.
- Masayuki AOIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347405
- Publication date Oct 17, 2024
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS
- Publication number 20240347497
- Publication date Oct 17, 2024
- International Business Machines Corporation
- SHIDONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282744
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGING THERMAL INTERFACE MATERIAL ALLOY CREATED IN-SITU
- Publication number 20240243091
- Publication date Jul 18, 2024
- The Indium Corporation of America
- Richard McDonough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SYSTEM COMPRISING A TRANSDUCER AND A WAVEGUIDE
- Publication number 20240213382
- Publication date Jun 27, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Patrick LE MAITRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
- Publication number 20240194629
- Publication date Jun 13, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE METALLIZATION THIN FILM STRUCTURE AND METHOD FOR FORMING...
- Publication number 20240170434
- Publication date May 23, 2024
- AG MATERIALS TECHNOLOGY CO., LTD.
- Chien-Hsun CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Improved Heat Dissipation Efficiency and Method for Fo...
- Publication number 20240162109
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Yi Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
- Publication number 20240128227
- Publication date Apr 18, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Perceval COUDRAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT-EMBEDDED PACKAGING STRUCTURE
- Publication number 20240096838
- Publication date Mar 21, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240071847
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Huan Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240063250
- Publication date Feb 22, 2024
- SAMSUNG DISPLAY CO., LTD.
- Sang Jo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240063074
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240038711
- Publication date Feb 1, 2024
- DENSO CORPORATION
- TERUAKI KUMAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038626
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC HEAT SPREADER FOR CHIP PACKAGE, PACKAGE STRUCTURE AND PACKA...
- Publication number 20230411235
- Publication date Dec 21, 2023
- STATS ChipPac Semiconductor (Jiangyin) Co., LTD.
- MAN BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE INCLUDING MICRO LIGHT EMITTING DIODES
- Publication number 20230387372
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Yoonsuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL
- Publication number 20230112531
- Publication date Apr 13, 2023
- AU OPTRONICS CORPORATION
- Yang-En Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANO-TWINNED STRUCTURE ON METALLIC THIN FILM SURFACE AND METHOD FOR...
- Publication number 20230090030
- Publication date Mar 23, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fastening a Semiconductor Chip on a Substrate, and Elect...
- Publication number 20220208715
- Publication date Jun 30, 2022
- OSRAM OLED GmbH
- Klaus Mueller
- H01 - BASIC ELECTRIC ELEMENTS

Titanium [Ti] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for producing nitride mesas each intended to form an electro...

Semiconductor packages with an intermetallic layer

Electronic device with multi-layer contact and system

Diffusion soldering with contaminant protection

Systems and methods for multi-color LED pixel unit with vertical li...

Integrated fan-out packaging

Semiconductor device

Contact and die attach metallization for silicon carbide based devi...

Systems and methods for multi-color LED pixel unit with vertical li...

Semiconductor device

Electronic device with multi-layer contact and system

Diffusion soldering with contaminant protection

Chip assembly

Semiconductor device

Back side metallization

Silver nano-twinned thin film structure and method for forming the...

Integrated fan-out packaging

Method for fastening a semiconductor chip on a substrate, and elect...

Silicon carbide devices and methods for manufacturing the same

Silicon carbide semiconductor device, silicon carbide semiconductor...

Contact and die attach metallization for silicon carbide based devi...

Nickel lanthanide alloys for MEMS packaging applications

Semiconductor devices including a metal silicide layer and methods...

Semiconductor packages with an intermetallic layer

Back side metallization

Method and apparatus for creating a bond between objects based on f...

Dam for three-dimensional integrated circuit

Integrated fan-out packaging

Optical semiconductor apparatus

Adhesive film for semiconductor, and semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, POWER DEVICE, AND POWER MODULE

SEMICONDUCTOR PACKAGE STRUCTURE AND BYPRODUCT OF SEMICONDUCTOR COMP...

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

SEMICONDUCTOR PACKAGES

DIE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SOLDER BONDING ON AuSn BASIS WITH LOW BONDING TEMPERATURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS

SEMICONDUCTOR DEVICE

PHASE CHANGING THERMAL INTERFACE MATERIAL ALLOY CREATED IN-SITU

OPTOELECTRONIC SYSTEM COMPRISING A TRANSDUCER AND A WAVEGUIDE

Semiconductor Device and Method of Making a Semiconductor Package w...

BACK SIDE METALLIZATION THIN FILM STRUCTURE AND METHOD FOR FORMING...

Package with Improved Heat Dissipation Efficiency and Method for Fo...

SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE

COMPONENT-EMBEDDED PACKAGING STRUCTURE

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

SEMICONDUCTOR PACKAGE AND METHOD

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELASTIC HEAT SPREADER FOR CHIP PACKAGE, PACKAGE STRUCTURE AND PACKA...

DISPLAY MODULE INCLUDING MICRO LIGHT EMITTING DIODES

DISPLAY PANEL

NANO-TWINNED STRUCTURE ON METALLIC THIN FILM SURFACE AND METHOD FOR...

Method for Fastening a Semiconductor Chip on a Substrate, and Elect...