Tungsten [W] as principal constituent

Industry

CPC
H01L2224/13684

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13684Tungsten [W] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Industrial chip scale package for microelectronic device
- Patent number 11,749,616
- Issue date Sep 5, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 11,710,718
- Issue date Jul 25, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bond structure for enhanced electromigration performance
- Patent number 11,450,638
- Issue date Sep 20, 2022
- Texas Instruments Incorporated
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 11,244,917
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 11,171,102
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,121,106
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 11,094,657
- Issue date Aug 17, 2021
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,892,246
- Issue date Jan 12, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,886,250
- Issue date Jan 5, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,818,629
- Issue date Oct 27, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump bond structure for enhanced electromigration performance
- Patent number 10,763,231
- Issue date Sep 1, 2020
- Texas Instruments Incorporated
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with barrier layer
- Patent number 10,593,621
- Issue date Mar 17, 2020
- Shinko Electric Industries Co., Ltd.
- Keigo Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,535,626
- Issue date Jan 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alloy diffusion barrier layer
- Patent number 10,424,552
- Issue date Sep 24, 2019
- Texas Instruments Incorporated
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 10,403,590
- Issue date Sep 3, 2019
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 10,396,051
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,013
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,012
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,224,301
- Issue date Mar 5, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
RF resonators and filters
- Patent number 10,141,912
- Issue date Nov 27, 2018
- ZHUHAI CRYSTAL RESONANCE TECHNOLOGIES CO., LTD.
- Dror Hurwitz
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,103,121
- Issue date Oct 16, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 9,842,819
- Issue date Dec 12, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 9,698,088
- Issue date Jul 4, 2017
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip and fabrication method
- Patent number 9,455,239
- Issue date Sep 27, 2016
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 9,368,390
- Issue date Jun 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong Ni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Controlled collapse chip connection (C4) structure and methods of f...
- Patent number 8,765,593
- Issue date Jul 1, 2014
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV pillar as an interconnecting structure
- Patent number 8,691,691
- Issue date Apr 8, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR...
- Publication number 20240213198
- Publication date Jun 27, 2024
- Intel Corporation
- Liang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
- Publication number 20240162163
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230335531
- Publication date Oct 19, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230132060
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20210225801
- Publication date Jul 22, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20210134749
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE
- Publication number 20200402938
- Publication date Dec 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20200152598
- Publication date May 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE
- Publication number 20200035633
- Publication date Jan 30, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY DIFFUSION BARRIER LAYER
- Publication number 20200020656
- Publication date Jan 16, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20190326242
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20190326243
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20190157230
- Publication date May 23, 2019
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY DIFFUSION BARRIER LAYER
- Publication number 20190088608
- Publication date Mar 21, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190013284
- Publication date Jan 10, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang FANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TALL AND FINE PITCH INTERCONNECTS
- Publication number 20190013287
- Publication date Jan 10, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF RESONATORS AND FILTERS
- Publication number 20180278234
- Publication date Sep 27, 2018
- DROR HURWITZ
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Tall and Fine Pitch Interconnects
- Publication number 20180096960
- Publication date Apr 5, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20170170135
- Publication date Jun 15, 2017
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TALL AND FINE PITCH INTERCONNECTS
- Publication number 20170053886
- Publication date Feb 23, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact bumps methods of making contact bumps
- Publication number 20160233188
- Publication date Aug 11, 2016
- SMARTRAC TECHNOLOGY GmbH
- Frank Kriebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Batch-Packaging Low Pin Count Embedded Semi...
- Publication number 20160005705
- Publication date Jan 7, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP AND FABRICATION METHOD
- Publication number 20150287689
- Publication date Oct 8, 2015
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED COLLAPSE CHIP CONNECTION (C4) STRUCTURE AND METHODS OF F...
- Publication number 20140042630
- Publication date Feb 13, 2014
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
- Publication number 20130200520
- Publication date Aug 8, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20130130496
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong NI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
- Publication number 20130113106
- Publication date May 9, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV PILLAR AS AN INTERCONNECTING STRUCTURE
- Publication number 20130026606
- Publication date Jan 31, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS

Tungsten [W] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structures for low temperature bonding using nanoparticles

Methods for low temperature bonding using nanoparticles

Industrial chip scale package for microelectronic device

Structures and methods for low temperature bonding using nanoparticles

Bump bond structure for enhanced electromigration performance

Multilayer pillar for reduced stress interconnect and method of mak...

Multilayer pillar for reduced stress interconnect and method of mak...

Integrated circuit package and method

Multilayer pillar for reduced stress interconnect and method of mak...

Structures and methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Tall and fine pitch interconnects

Bump bond structure for enhanced electromigration performance

Expanded head pillar for bump bonds

Semiconductor device with barrier layer

Structures and methods for low temperature bonding using nanoparticles

Alloy diffusion barrier layer

Multilayer pillar for reduced stress interconnect and method of mak...

Multilayer pillar for reduced stress interconnect and method of mak...

Advanced through substrate via metallization in three dimensional s...

Advanced through substrate via metallization in three dimensional s...

Semiconductor package device and method of manufacturing the same

RF resonators and filters

Tall and fine pitch interconnects

Tall and fine pitch interconnects

Semiconductor packages

Integrated circuit chip and fabrication method

Semiconductor apparatus

Controlled collapse chip connection (C4) structure and methods of f...

TSV pillar as an interconnecting structure

Patents Applicationslast 30 patents

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR...

INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

Structures And Methods For Low Temperature Bonding Using Nanoparticles

Integrated Circuit Package and Method

BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE

EXPANDED HEAD PILLAR FOR BUMP BONDS

Structures And Methods For Low Temperature Bonding Using Nanoparticles

BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE

ALLOY DIFFUSION BARRIER LAYER

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

ALLOY DIFFUSION BARRIER LAYER

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

TALL AND FINE PITCH INTERCONNECTS

RF RESONATORS AND FILTERS

Tall and Fine Pitch Interconnects

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

TALL AND FINE PITCH INTERCONNECTS

Contact bumps methods of making contact bumps

Structure and Method of Batch-Packaging Low Pin Count Embedded Semi...

INTEGRATED CIRCUIT CHIP AND FABRICATION METHOD

CONTROLLED COLLAPSE CHIP CONNECTION (C4) STRUCTURE AND METHODS OF F...

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...

SEMICONDUCTOR APPARATUS

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...

TSV PILLAR AS AN INTERCONNECTING STRUCTURE