Tungsten [W] as principal constituent

Industry

CPC
H01L2224/29184

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29184Tungsten [W] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 12,087,723
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layered bonding material, semiconductor package, and power module
- Patent number 12,080,671
- Issue date Sep 3, 2024
- Senju Metal Industry Co., Ltd.
- Naoto Kameda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 12,051,669
- Issue date Jul 30, 2024
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures including a fin structure and a metal cap
- Patent number 11,929,314
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered bonding material, semiconductor package, and power module
- Patent number 11,712,760
- Issue date Aug 1, 2023
- Senju Metal Industry Co., Ltd.
- Naoto Kameda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 11,610,861
- Issue date Mar 21, 2023
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon carbide devices and methods for manufacturing the same
- Patent number 11,282,805
- Issue date Mar 22, 2022
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 11,152,325
- Issue date Oct 19, 2021
- Cree, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure and method of manufacturing the same
- Patent number 11,094,661
- Issue date Aug 17, 2021
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Hirofumi Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid-state wafer bonding of functional materials on substrates and...
- Patent number 10,679,964
- Issue date Jun 9, 2020
- The Regents of the University of California
- Shadi A. Dayeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing electronic device with multi-layer contact
- Patent number 10,475,761
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 10,438,925
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-bonding structure and method of forming the same
- Patent number 10,388,627
- Issue date Aug 20, 2019
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and methods of packaging thereof
- Patent number 10,297,583
- Issue date May 21, 2019
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device including cap structure and met...
- Patent number 10,205,075
- Issue date Feb 12, 2019
- GLO AB
- Anusha Pokhriyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanently bonding wafers by a connecting layer by mean...
- Patent number 10,163,681
- Issue date Dec 25, 2018
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module comprising fluid cooling channel and method of ma...
- Patent number 10,037,972
- Issue date Jul 31, 2018
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing composite structure with metal/metal bonding
- Patent number 9,905,531
- Issue date Feb 27, 2018
- Soitec
- Ionut Radu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die attached with sintered me...
- Patent number 9,875,987
- Issue date Jan 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically integrated wafers with thermal dissipation
- Patent number 9,812,428
- Issue date Nov 7, 2017
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Zhijiong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming III-V semiconductor structures using multiple su...
- Patent number 9,716,164
- Issue date Jul 25, 2017
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 9,627,349
- Issue date Apr 18, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with double side molding
- Patent number 9,613,895
- Issue date Apr 4, 2017
- Inotera Memories, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die coupled to a thermally co...
- Patent number 9,589,860
- Issue date Mar 7, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,884,470
- Issue date Nov 11, 2014
- Semiconductor Energy Laboratory Co., Ltd.
- Tatsuji Nishijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and methods of packaging thereof
- Patent number 8,846,452
- Issue date Sep 30, 2014
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive bonding material, method of bonding with th...
- Patent number 8,840,811
- Issue date Sep 23, 2014
- Hitachi Chemical Company, Ltd.
- Yuusuke Yasuda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Substrate bonding with metal germanium silicon material
- Patent number 8,592,926
- Issue date Nov 26, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate bonding with metal germanium silicon material
- Patent number 8,058,143
- Issue date Nov 15, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS
- Publication number 20240347497
- Publication date Oct 17, 2024
- International Business Machines Corporation
- SHIDONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGING THERMAL INTERFACE MATERIAL ALLOY CREATED IN-SITU
- Publication number 20240243091
- Publication date Jul 18, 2024
- The Indium Corporation of America
- Richard McDonough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SYSTEM COMPRISING A TRANSDUCER AND A WAVEGUIDE
- Publication number 20240213382
- Publication date Jun 27, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Patrick LE MAITRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED BONDING MATERIAL, SEMICONDUCTOR PACKAGE, AND POWER MODULE
- Publication number 20240213206
- Publication date Jun 27, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Naoto KAMEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT STRUCTURES AND MANUFACTURING METHOD THEREOF
- Publication number 20240170381
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hsien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240063074
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP HEAT DISSIPATING STRUCTURE, PROCESS AND SEMICONDUCTOR DEVICE
- Publication number 20230386959
- Publication date Nov 30, 2023
- HEFEI SMAT TECHNOLOGY CO.,LTD.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEIGHT ADAPTABLE MULTILAYER SPACER
- Publication number 20230197665
- Publication date Jun 22, 2023
- Heraeus Deutschland GmbH & Co. KG
- Andreas HINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS FOR MANUFACTURING THE SAME
- Publication number 20230025412
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Pin CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND MANUFACTURING METHOD THEREOF
- Publication number 20220293503
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Hsien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diffusion Soldering with Contaminant Protection
- Publication number 20220084981
- Publication date Mar 17, 2022
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVI...
- Publication number 20220028821
- Publication date Jan 27, 2022
- Cree, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVI...
- Publication number 20210057370
- Publication date Feb 25, 2021
- Cree, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact and System
- Publication number 20200075530
- Publication date Mar 5, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHYSICAL QUANTITY MEASUREMENT DEVICE AND METHOD FOR MANUFACTURING S...
- Publication number 20190371759
- Publication date Dec 5, 2019
- Hitachi Automotive Systems, Ltd.
- Takuya AOYAGI
- G01 - MEASURING TESTING
Information Patent Application
Silicon Carbide Devices and Methods for Manufacturing the Same
- Publication number 20190295981
- Publication date Sep 26, 2019
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Electronic Device With Multi-Layer Contact
- Publication number 20190006311
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE INCLUDING CAP STRUCTURE AND MET...
- Publication number 20180159005
- Publication date Jun 7, 2018
- GLO AB
- Anusha POKHRIYAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE WAFER BONDING OF FUNCTIONAL MATERIALS ON SUBSTRATES AND...
- Publication number 20170317050
- Publication date Nov 2, 2017
- The Regents of the University of California
- Shadi A. Dayeh
- G02 - OPTICS
Information Patent Application
VERTICALLY INTEGRATED WAFERS WITH THERMAL DISSIPATION
- Publication number 20170040295
- Publication date Feb 9, 2017
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Zhijiong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact
- Publication number 20170025375
- Publication date Jan 26, 2017
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING A BONDING LAYER
- Publication number 20160190092
- Publication date Jun 30, 2016
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING COMPOSITE STRUCTURE WITH METAL/METAL BONDING
- Publication number 20150179603
- Publication date Jun 25, 2015
- SOITEC
- Ionut Radu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE OF SEMICONDUCTOR AND METHOD FOR FORMING THE SAME
- Publication number 20150171052
- Publication date Jun 18, 2015
- CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY, ARMAMENTS BUREAU, M.N.D.
- Yang-Kuao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM DEVICE
- Publication number 20150069602
- Publication date Mar 12, 2015
- NOVATEK MICROELECTRONICS CORP.
- Chiao-Ling Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING METALLIC BONDING LAYER AND METHOD OF MANUFACTURIN...
- Publication number 20140273318
- Publication date Sep 18, 2014
- Samsung Electronics Co., Ltd.
- Yung Ho RYU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEAN...
- Publication number 20140154867
- Publication date Jun 5, 2014
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device Package and Methods of Packaging Thereof
- Publication number 20140057393
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM DEVICE
- Publication number 20130292819
- Publication date Nov 7, 2013
- NOVATEK MICROELECTRONICS CORP.
- Chiao-Ling Huang
- H01 - BASIC ELECTRIC ELEMENTS

Tungsten [W] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Diffusion soldering with contaminant protection

Layered bonding material, semiconductor package, and power module

Contact and die attach metallization for silicon carbide based devi...

Interconnect structures including a fin structure and a metal cap

Electronic device with multi-layer contact and system

Layered bonding material, semiconductor package, and power module

Diffusion soldering with contaminant protection

Silicon carbide devices and methods for manufacturing the same

Contact and die attach metallization for silicon carbide based devi...

Bonded structure and method of manufacturing the same

Solid-state wafer bonding of functional materials on substrates and...

Method for producing electronic device with multi-layer contact

Method for applying a bonding layer

Micro-bonding structure and method of forming the same

Semiconductor device package and methods of packaging thereof

Semiconductor light emitting device including cap structure and met...

Method for permanently bonding wafers by a connecting layer by mean...

Electronic module comprising fluid cooling channel and method of ma...

Method for producing composite structure with metal/metal bonding

Electronic devices with semiconductor die attached with sintered me...

Vertically integrated wafers with thermal dissipation

Methods of forming III-V semiconductor structures using multiple su...

Method for applying a bonding layer

Semiconductor package with double side molding

Electronic devices with semiconductor die coupled to a thermally co...

Semiconductor device

Semiconductor device package and methods of packaging thereof

Electrically conductive bonding material, method of bonding with th...

Substrate bonding with metal germanium silicon material

Substrate bonding with metal germanium silicon material

Patents Applicationslast 30 patents

THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS

PHASE CHANGING THERMAL INTERFACE MATERIAL ALLOY CREATED IN-SITU

OPTOELECTRONIC SYSTEM COMPRISING A TRANSDUCER AND A WAVEGUIDE

LAYERED BONDING MATERIAL, SEMICONDUCTOR PACKAGE, AND POWER MODULE

INTERCONNECT STRUCTURES AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

CHIP HEAT DISSIPATING STRUCTURE, PROCESS AND SEMICONDUCTOR DEVICE

HEIGHT ADAPTABLE MULTILAYER SPACER

SEMICONDUCTOR STRUCTURES AND METHODS FOR MANUFACTURING THE SAME

INTERCONNECT STRUCTURES AND MANUFACTURING METHOD THEREOF

Diffusion Soldering with Contaminant Protection

CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVI...

CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVI...

Electronic Device with Multi-Layer Contact and System

PHYSICAL QUANTITY MEASUREMENT DEVICE AND METHOD FOR MANUFACTURING S...

Silicon Carbide Devices and Methods for Manufacturing the Same

Method for Producing Electronic Device With Multi-Layer Contact

SEMICONDUCTOR LIGHT EMITTING DEVICE INCLUDING CAP STRUCTURE AND MET...

SOLID-STATE WAFER BONDING OF FUNCTIONAL MATERIALS ON SUBSTRATES AND...

VERTICALLY INTEGRATED WAFERS WITH THERMAL DISSIPATION

Electronic Device with Multi-Layer Contact

METHOD FOR APPLYING A BONDING LAYER

METHOD FOR PRODUCING COMPOSITE STRUCTURE WITH METAL/METAL BONDING

SUBSTRATE OF SEMICONDUCTOR AND METHOD FOR FORMING THE SAME

CHIP-ON-FILM DEVICE

METHOD OF FORMING METALLIC BONDING LAYER AND METHOD OF MANUFACTURIN...

METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEAN...

Semiconductor Device Package and Methods of Packaging Thereof

CHIP-ON-FILM DEVICE