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H01L2224/85043

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85043using a flame torch

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of wirebonding that utilizes a gas flow within a capillary f...
- Patent number 8,485,418
- Issue date Jul 16, 2013
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gas delivery system for reducing oxidation in wire bonding operations
- Patent number 8,313,015
- Issue date Nov 20, 2012
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package system having interconnect stack and ext...
- Patent number 8,138,080
- Issue date Mar 20, 2012
- Stats Chippac Ltd.
- Dario S. Filoteo, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer and semiconductor package
- Patent number 8,110,931
- Issue date Feb 7, 2012
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for packaging a semiconductor package
- Patent number 8,076,786
- Issue date Dec 13, 2011
- Advanced Semiconductor Engineering, Inc.
- Chang Ying Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas delivery system for reducing oxidation in wire bonding operations
- Patent number 8,066,170
- Issue date Nov 29, 2011
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for processing and bonding a wire
- Patent number 8,053,906
- Issue date Nov 8, 2011
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having through wire interconnect with compr...
- Patent number 8,053,909
- Issue date Nov 8, 2011
- Micron Technology, Inc.
- David R. Hembree
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor component having through wire interconnect
- Patent number 7,919,846
- Issue date Apr 5, 2011
- Micron Technology, Inc.
- David R. Hembree
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for fabricating semiconductor components with through wire i...
- Patent number 7,757,385
- Issue date Jul 20, 2010
- Micron Technology, Inc.
- David R. Hembree
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor components with through wire interconnects
- Patent number 7,728,443
- Issue date Jun 1, 2010
- Micron Technology, Inc.
- David R. Hembree
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating stacked semiconductor components with throug...
- Patent number 7,682,962
- Issue date Mar 23, 2010
- Micron Technology, Inc.
- David R. Hembree
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave face wire bond capillary and method
- Patent number 7,677,429
- Issue date Mar 16, 2010
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for low loop wire bonding
- Patent number 7,475,802
- Issue date Jan 13, 2009
- Texas Instruments Incorporated
- Kaoru Yajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave face wire bond capillary and method
- Patent number 7,416,107
- Issue date Aug 26, 2008
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating semiconductor components with through wire i...
- Patent number 7,371,676
- Issue date May 13, 2008
- Micron Technology, Inc.
- David R. Hembree
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resilient contact structures formed and then attached to a substrate
- Patent number 7,225,538
- Issue date Jun 5, 2007
- FormFactor, Inc.
- Benjamin Niles Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding for thin semiconductor package
- Patent number 7,192,861
- Issue date Mar 20, 2007
- Texas Instruments Incorporated
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures and methods for making same
- Patent number 7,082,682
- Issue date Aug 1, 2006
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave face wire bond capillary and method
- Patent number 6,966,480
- Issue date Nov 22, 2005
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wirebonding insulated wire
- Patent number 6,854,637
- Issue date Feb 15, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Fuaida Harun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE...
- Patent number 6,835,898
- Issue date Dec 28, 2004
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing raised electrical contact pattern of contr...
- Patent number 6,818,840
- Issue date Nov 16, 2004
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding for thin semiconductor package
- Patent number 6,815,836
- Issue date Nov 9, 2004
- Texas Instruments Incorporated
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concave face wire bond capillary and method
- Patent number 6,595,406
- Issue date Jul 22, 2003
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing raised electrical contact pattern of contr...
- Patent number 6,538,214
- Issue date Mar 25, 2003
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic spring contact element and electronic component hav...
- Patent number 6,482,013
- Issue date Nov 19, 2002
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and contact point for producing an electrical connection
- Patent number 6,467,677
- Issue date Oct 22, 2002
- Robert Bosch GmbH
- Ingolf Wildner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave face wire bond capillary
- Patent number 6,439,450
- Issue date Aug 27, 2002
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for wire-bonding for electric components
- Patent number 6,352,197
- Issue date Mar 5, 2002
- Rohm Co., Ltd.
- Yoshihiko Mutaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS
- Publication number 20120031877
- Publication date Feb 9, 2012
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Component Having Through Wire Interconnect With Compr...
- Publication number 20110108959
- Publication date May 12, 2011
- David R. Hembree
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS
- Publication number 20110073635
- Publication date Mar 31, 2011
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PRE-FORMED BALL BONDS
- Publication number 20110068469
- Publication date Mar 24, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF WIREBONDING THAT UTILIZES A GAS FLOW WITHIN A CAPILLARY F...
- Publication number 20110057018
- Publication date Mar 10, 2011
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked Semiconductor Component Having Through Wire Interconnect An...
- Publication number 20100140753
- Publication date Jun 10, 2010
- David R. Hembree
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF WIREBONDING THAT UTILIZES A GAS FLOW WITHIN A CAPILLARY F...
- Publication number 20100065963
- Publication date Mar 18, 2010
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING BALL BOND
- Publication number 20100059883
- Publication date Mar 11, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER AND SEMICONDUCTOR PACKAGE
- Publication number 20100007004
- Publication date Jan 14, 2010
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR PROCESSING AND BONDING A WIRE
- Publication number 20100007009
- Publication date Jan 14, 2010
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Hsiao Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR PACKAGING A SEMICONDUCTOR PACKAGE
- Publication number 20100007011
- Publication date Jan 14, 2010
- Advanced Semiconductor Engineering, Inc.
- Chang Ying HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR WIRE BONDING
- Publication number 20090140029
- Publication date Jun 4, 2009
- Ernst WANDKE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONCAVE FACE WIRE BOND CAPILLARY AND METHOD
- Publication number 20080302862
- Publication date Dec 11, 2008
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus for wire bonding and integrated circuit chip package
- Publication number 20080197461
- Publication date Aug 21, 2008
- Taiwan Semiconductor Manufacturing Co.,Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary F...
- Publication number 20070228110
- Publication date Oct 4, 2007
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR COMPONENTS WITH THROUGH WIRE INTERCONNECTS
- Publication number 20070222054
- Publication date Sep 27, 2007
- David R. Hembree
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM
- Publication number 20070210436
- Publication date Sep 13, 2007
- STATS ChipPAC Ltd.
- Dario S. Filoteo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR FABRICATING SEMICONDUCTOR COMPONENTS WITH THROUGH WIRE I...
- Publication number 20070200255
- Publication date Aug 30, 2007
- David R. Hembree
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING STACKED SEMICONDUCTOR COMPONENTS WITH THROUG...
- Publication number 20070202617
- Publication date Aug 30, 2007
- David R. Hembree
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Contact Structures Comprising A Core Structure And An Overcoat
- Publication number 20060286828
- Publication date Dec 21, 2006
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and system for fabricating semiconductor components with thr...
- Publication number 20060228825
- Publication date Oct 12, 2006
- Micron Technology, Inc.
- David R. Hembree
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Concave face wire bond capillary and method
- Publication number 20060032888
- Publication date Feb 16, 2006
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and method for low loop wire bonding
- Publication number 20050242159
- Publication date Nov 3, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Kaoru Yajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding for thin semiconductor package
- Publication number 20050042855
- Publication date Feb 24, 2005
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact structures and methods for making same
- Publication number 20050028363
- Publication date Feb 10, 2005
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING FOR THIN SEMICONDUCTOR PACKAGE
- Publication number 20040191954
- Publication date Sep 30, 2004
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wirebonding insulated wire
- Publication number 20040164126
- Publication date Aug 26, 2004
- Fuaida Harun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding capillary
- Publication number 20040129755
- Publication date Jul 8, 2004
- KESSEM TRADE COMPANY LTD.
- Eran Macover
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Concave face wire bond capillary and method
- Publication number 20040056072
- Publication date Mar 25, 2004
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked die semiconductor device
- Publication number 20030230796
- Publication date Dec 18, 2003
- Aminuddin Ismail
- H01 - BASIC ELECTRIC ELEMENTS

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Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of wirebonding that utilizes a gas flow within a capillary f...

Gas delivery system for reducing oxidation in wire bonding operations

Integrated circuit package system having interconnect stack and ext...

Wafer and semiconductor package

Semiconductor package and method for packaging a semiconductor package

Gas delivery system for reducing oxidation in wire bonding operations

Semiconductor package and method for processing and bonding a wire

Semiconductor component having through wire interconnect with compr...

Stacked semiconductor component having through wire interconnect

System for fabricating semiconductor components with through wire i...

Semiconductor components with through wire interconnects

Method for fabricating stacked semiconductor components with throug...

Concave face wire bond capillary and method

Method for low loop wire bonding

Concave face wire bond capillary and method

Method for fabricating semiconductor components with through wire i...

Resilient contact structures formed and then attached to a substrate

Wire bonding for thin semiconductor package

Contact structures and methods for making same

Concave face wire bond capillary and method

Wirebonding insulated wire

ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE...

Method for manufacturing raised electrical contact pattern of contr...

Wire bonding for thin semiconductor package

Concave face wire bond capillary and method

Method for manufacturing raised electrical contact pattern of contr...

Microelectronic spring contact element and electronic component hav...

Method and contact point for producing an electrical connection

Concave face wire bond capillary

Method and apparatus for wire-bonding for electric components

Patents Applicationslast 30 patents

GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS

Semiconductor Component Having Through Wire Interconnect With Compr...

GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS

SEMICONDUCTOR PACKAGE WITH PRE-FORMED BALL BONDS

METHOD OF WIREBONDING THAT UTILIZES A GAS FLOW WITHIN A CAPILLARY F...

Stacked Semiconductor Component Having Through Wire Interconnect An...

METHOD OF WIREBONDING THAT UTILIZES A GAS FLOW WITHIN A CAPILLARY F...

METHOD OF FORMING BALL BOND

WAFER AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR PROCESSING AND BONDING A WIRE

SEMICONDUCTOR PACKAGE AND METHOD FOR PACKAGING A SEMICONDUCTOR PACKAGE

METHOD AND DEVICE FOR WIRE BONDING

CONCAVE FACE WIRE BOND CAPILLARY AND METHOD

Apparatus for wire bonding and integrated circuit chip package

Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary F...

SEMICONDUCTOR COMPONENTS WITH THROUGH WIRE INTERCONNECTS

INTEGRATED CIRCUIT PACKAGE SYSTEM

SYSTEM FOR FABRICATING SEMICONDUCTOR COMPONENTS WITH THROUGH WIRE I...

METHOD FOR FABRICATING STACKED SEMICONDUCTOR COMPONENTS WITH THROUG...

Contact Structures Comprising A Core Structure And An Overcoat

Method and system for fabricating semiconductor components with thr...

Concave face wire bond capillary and method

System and method for low loop wire bonding

Wire bonding for thin semiconductor package

Contact structures and methods for making same

WIRE BONDING FOR THIN SEMICONDUCTOR PACKAGE

Wirebonding insulated wire

Wire bonding capillary

Concave face wire bond capillary and method

Stacked die semiconductor device