Claims
- 1. A wire bonding capillary for pressing a metal wire against an electrode pad comprising:
a capillary tip having a pressing face, wherein at least a part of the pressing face of the capillary tip is coated with a layer of polymeric material, said polymeric material including at least one thermoplastic polymer.
- 2. The wire bonding capillary as in claim 1 wherein said thermoplastic polymer is poly-p-xylylene.
- 3. A wire bonding capillary, for pressing a metal wire against an electrode pad, having a life span of at least 1.4 Mwire.
Parent Case Info
[0001] This is a Divisional of U.S. patent application Ser. No. 10/083,588, pending, which is a Continuation-In-Part of U.S. patent application Ser. No. 09/534,970 filed Mar. 27, 2000, now abandoned.
Divisions (1)
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Number |
Date |
Country |
Parent |
10083588 |
Feb 2002 |
US |
Child |
10740634 |
Dec 2003 |
US |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
09534970 |
Mar 2000 |
US |
Child |
10083588 |
Feb 2002 |
US |