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H01L2224/11903

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/11903using different masks

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Packaged semiconductor device with electroplated pillars
- Patent number 12,027,483
- Issue date Jul 2, 2024
- Texas Instruments Incorporated
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 11,705,415
- Issue date Jul 18, 2023
- Lapis Semiconductor Co., Ltd.
- Taiichi Ogumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling inductors in an IC device using interconnecting elements w...
- Patent number 11,557,420
- Issue date Jan 17, 2023
- GLOBALFOUNDRIES Inc.
- Tak Ming Mak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding area including fused solder film and m...
- Patent number 11,545,452
- Issue date Jan 3, 2023
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having counductive bump with tapered portio...
- Patent number 11,495,556
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging mechanisms for dies with different sizes of connectors
- Patent number 11,488,878
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conical-shaped or tier-shaped pillar connections
- Patent number 11,315,896
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with electroplated pillars
- Patent number 11,094,656
- Issue date Aug 17, 2021
- Texas Instruments Incorporated
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,094,655
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 11,049,826
- Issue date Jun 29, 2021
- Lapis Semiconductor Co., Ltd.
- Taiichi Ogumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a conductive bump with a plurality o...
- Patent number 11,018,099
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging mechanisms for dies with different sizes of connectors
- Patent number 10,964,610
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding area including fused solder film and m...
- Patent number 10,910,331
- Issue date Feb 2, 2021
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor structure
- Patent number 10,861,711
- Issue date Dec 8, 2020
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on same substrate
- Patent number 10,629,567
- Issue date Apr 21, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging mechanisms for dies with different sizes of connectors
- Patent number 10,354,931
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 10,290,613
- Issue date May 14, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conical-shaped or tier-shaped pillar connections
- Patent number 10,056,345
- Issue date Aug 21, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure for yield improvement
- Patent number 10,056,347
- Issue date Aug 21, 2018
- Taiwan Semiconductor Manufacturing Company
- Tzu-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor package structure
- Patent number 10,037,973
- Issue date Jul 31, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate design for semiconductor packages and method of forming same
- Patent number 10,026,671
- Issue date Jul 17, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,008,466
- Issue date Jun 26, 2018
- Renesas Electronics Corporation
- Hiroyuki Utsunomiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable device assembly
- Patent number 9,893,030
- Issue date Feb 13, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar sidewall protection
- Patent number 9,875,980
- Issue date Jan 23, 2018
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof and semiconduct...
- Patent number 9,842,771
- Issue date Dec 12, 2017
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,818,709
- Issue date Nov 14, 2017
- Renesas Electronics Corporation
- Hiroyuki Utsunomiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate interconnections having different sizes
- Patent number 9,773,755
- Issue date Sep 26, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 9,728,527
- Issue date Aug 8, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240387430
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE DEVICE, SEMICONDUCTOR PA...
- Publication number 20240170431
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Chang-Kun KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE WIDTHS
- Publication number 20240006361
- Publication date Jan 4, 2024
- QUALCOMM Incorporated
- Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE
- Publication number 20230384367
- Publication date Nov 30, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH ELECTROPLATED PILLARS
- Publication number 20210375808
- Publication date Dec 2, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20210280543
- Publication date Sep 9, 2021
- LAPIS SEMICONDUCTOR CO., LTD.
- TAIICHI OGUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Mechanisms for Dies with Different Sizes of Connectors
- Publication number 20210217672
- Publication date Jul 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE BONDING AREA INCLUDING FUSED SOLDER FILM AND M...
- Publication number 20210118831
- Publication date Apr 22, 2021
- LAPIS SEMICONDUCTOR CO., LTD.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200395323
- Publication date Dec 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hsiung LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH ELECTROPLATED PILLARS
- Publication number 20200211990
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Mechanisms for Dies with Different Sizes of Connectors
- Publication number 20190341319
- Publication date Nov 7, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE PLATED VIA ARRAYS OF DIFFERENT WIRE HEIGHTS ON SAME SUBSTRATE
- Publication number 20190148344
- Publication date May 16, 2019
- Invensas Corporation
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Conical-Shaped or Tier-Shaped Pillar Connections
- Publication number 20180358316
- Publication date Dec 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple bond via arrays of different wire heights on a same substrate
- Publication number 20180301436
- Publication date Oct 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180047691
- Publication date Feb 15, 2018
- RENESAS ELECTRONICS CORPORATION
- Hiroyuki UTSUNOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170271432
- Publication date Sep 21, 2017
- XINTEC INC.
- Wei-Ming LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE DEVICE ASSEMBLY
- Publication number 20140376200
- Publication date Dec 25, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE WETTING PROCESS TO INCREASE SOLDER JOINT STANDOFF
- Publication number 20140362550
- Publication date Dec 11, 2014
- Leilei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar Bumps and Process for Making Same
- Publication number 20140363966
- Publication date Dec 11, 2014
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140361431
- Publication date Dec 11, 2014
- SONY CORPORATION
- Katsuji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mixed-Sized Pillars That Are Probeable and Routable
- Publication number 20140346513
- Publication date Nov 27, 2014
- eSilicon Corporation
- Javier DeLaCruz
- G01 - MEASURING TESTING
Information Patent Application
CHIP ARRANGEMENT, AND METHOD FOR FORMING A CHIP ARRANGEMENT
- Publication number 20140332953
- Publication date Nov 13, 2014
- INFINEON TECHNOLOGIES AG
- Peter Ossimitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE PICKUP DEVICE AND MANUFACTURING METHOD FOR PRODUCING SAME
- Publication number 20140327101
- Publication date Nov 6, 2014
- Hiroki Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INTERPOSER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING...
- Publication number 20140306355
- Publication date Oct 16, 2014
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Conductive Pillars Having Recesses or Pro...
- Publication number 20140225256
- Publication date Aug 14, 2014
- STATS ChipPAC, Ltd.
- Jen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20140206145
- Publication date Jul 24, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interconnect Structure w...
- Publication number 20140175642
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, ELECTRONIC APPARATUS INCLUDING THE SAME, AND...
- Publication number 20140159235
- Publication date Jun 12, 2014
- Fujitsu Limited
- Muneyuki Odaira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF
- Publication number 20140141606
- Publication date May 22, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS

using different masks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Packaged semiconductor device with electroplated pillars

Multiple plated via arrays of different wire heights on a same subs...

Semiconductor device and semiconductor device manufacturing method

Coupling inductors in an IC device using interconnecting elements w...

Semiconductor device bonding area including fused solder film and m...

Semiconductor structure having counductive bump with tapered portio...

Packaging mechanisms for dies with different sizes of connectors

Conical-shaped or tier-shaped pillar connections

Packaged semiconductor device with electroplated pillars

Semiconductor structure and method for forming the same

Semiconductor device and semiconductor device manufacturing method

Semiconductor structure having a conductive bump with a plurality o...

Packaging mechanisms for dies with different sizes of connectors

Semiconductor device bonding area including fused solder film and m...

Method of manufacturing a semiconductor structure

Expanded head pillar for bump bonds

Multiple plated via arrays of different wire heights on same substrate

Packaging mechanisms for dies with different sizes of connectors

Multiple bond via arrays of different wire heights on a same substrate

Conical-shaped or tier-shaped pillar connections

Bump structure for yield improvement

Method for manufacturing semiconductor package structure

Substrate design for semiconductor packages and method of forming same

Semiconductor device and manufacturing method thereof

Reliable device assembly

Copper pillar sidewall protection

Semiconductor device and fabrication method thereof and semiconduct...

Semiconductor device and manufacturing method thereof

Substrate interconnections having different sizes

Multiple bond via arrays of different wire heights on a same substrate

Patents Applicationslast 30 patents

METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME

BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE DEVICE, SEMICONDUCTOR PA...

INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE WIDTHS

BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE

PACKAGED SEMICONDUCTOR DEVICE WITH ELECTROPLATED PILLARS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Packaging Mechanisms for Dies with Different Sizes of Connectors

SEMICONDUCTOR DEVICE BONDING AREA INCLUDING FUSED SOLDER FILM AND M...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

EXPANDED HEAD PILLAR FOR BUMP BONDS

PACKAGED SEMICONDUCTOR DEVICE WITH ELECTROPLATED PILLARS

Packaging Mechanisms for Dies with Different Sizes of Connectors

MULTIPLE PLATED VIA ARRAYS OF DIFFERENT WIRE HEIGHTS ON SAME SUBSTRATE

Conical-Shaped or Tier-Shaped Pillar Connections

Multiple bond via arrays of different wire heights on a same substrate

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

RELIABLE DEVICE ASSEMBLY

SELECTIVE WETTING PROCESS TO INCREASE SOLDER JOINT STANDOFF

Pillar Bumps and Process for Making Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Mixed-Sized Pillars That Are Probeable and Routable

CHIP ARRANGEMENT, AND METHOD FOR FORMING A CHIP ARRANGEMENT

IMAGE PICKUP DEVICE AND MANUFACTURING METHOD FOR PRODUCING SAME

CHIP INTERPOSER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING...

Semiconductor Device with Conductive Pillars Having Recesses or Pro...

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

Semiconductor Device and Method of Forming Interconnect Structure w...

ELECTRONIC COMPONENT, ELECTRONIC APPARATUS INCLUDING THE SAME, AND...

SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF