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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/03622
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Patents Grants
last 30 patents
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Patent Grant
Via for semiconductor device connection and methods of forming the...
Patent number
11,961,800
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die including stress-resistant bonding structures and...
Patent number
11,887,955
Issue date
Jan 30, 2024
Taiwan Semiconductor Manufacturing Company Limited
Hui-Min Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Array substrate, method for fabricating same, and display device
Patent number
11,869,904
Issue date
Jan 9, 2024
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
Xiaobo Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with air gap
Patent number
11,830,837
Issue date
Nov 28, 2023
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light-emitting panel, method manufacturing the same, and display de...
Patent number
11,817,461
Issue date
Nov 14, 2023
TCL China Star Optoelectronics Technology Co., Ltd.
Maoxia Zhu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display backboard and manufacturing method thereof and display device
Patent number
11,764,343
Issue date
Sep 19, 2023
BOE Technology Group Co., Ltd.
Zhiwei Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit (IC) device including a force mitigation system...
Patent number
11,682,642
Issue date
Jun 20, 2023
Microchip Technology Incorporated
Justin Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic devices and apparatuses having a patterned surface...
Patent number
11,640,948
Issue date
May 2, 2023
Micron Technology, Inc.
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
Patent number
11,488,882
Issue date
Nov 1, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming package structure with a barrier layer
Patent number
11,469,203
Issue date
Oct 11, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Cheng-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Via for semiconductor device connection and methods of forming the...
Patent number
11,444,020
Issue date
Sep 13, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solid-state image pickup element and electronic apparatus
Patent number
11,398,518
Issue date
Jul 26, 2022
Sony Corporation
Keishi Inoue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductor design for integrated magnetic devices
Patent number
11,393,787
Issue date
Jul 19, 2022
Texas Instruments Incorporated
Dok Won Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and method of manufacturing the same
Patent number
11,362,052
Issue date
Jun 14, 2022
Advanced Semiconductor Engineering, Inc.
Chi-Chang Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with air gap and manufacturing method thereof
Patent number
11,302,662
Issue date
Apr 12, 2022
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding pads including interfacial electromigration barrier layers...
Patent number
11,270,963
Issue date
Mar 8, 2022
SanDisk Technologies LLC
Chen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing wafer level low melting temperature interco...
Patent number
11,222,813
Issue date
Jan 11, 2022
Raytheon Company
Sean P. Kilcoyne
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond pad structure for bonding improvement
Patent number
11,158,591
Issue date
Oct 26, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Chia-Chan Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro-connection structure and manufacturing method thereof
Patent number
11,152,319
Issue date
Oct 19, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Wen-Hsiung Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure containing reentrant shaped bonding pads an...
Patent number
11,145,628
Issue date
Oct 12, 2021
SanDisk Technologies LLC
Rahul Sharangpani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding pads with thermal pathways
Patent number
11,139,258
Issue date
Oct 5, 2021
Micron Technology, Inc.
Jaspreet S Gandhi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip packaging rework
Patent number
11,121,101
Issue date
Sep 14, 2021
International Business Machines Corporation
Charles Leon Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices
Patent number
10,978,655
Issue date
Apr 13, 2021
Samsung Electronics Co., Ltd.
Yi-Koan Hong
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Methods of forming microelectronic devices having a patterned surfa...
Patent number
10,950,564
Issue date
Mar 16, 2021
Micron Technology, Inc.
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacture thereof
Patent number
10,910,332
Issue date
Feb 2, 2021
Semiconductor Manufacturing International (Shanghai) Corporation
You Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit (IC) device including a force mitigation system...
Patent number
10,896,888
Issue date
Jan 19, 2021
Microchip Technology Incorporated
Justin Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure, 3DIC structure and method of fabricating t...
Patent number
10,886,245
Issue date
Jan 5, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with solder regions aligned to recesses
Patent number
10,879,198
Issue date
Dec 29, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Jung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal pillar in a film-type seconductor package
Patent number
10,867,948
Issue date
Dec 15, 2020
Samsung Electronics Co., Ltd.
Jung-woo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solid-state image pickup element and electronic apparatus
Patent number
10,854,657
Issue date
Dec 1, 2020
Sony Corporation
Keishi Inoue
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...
Publication number
20240128219
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company Limited
Hui-Min HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS
Publication number
20240113055
Publication date
Apr 4, 2024
International Business Machines Corporation
Nicholas Alexander Polomoff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR REDUCING DIE SLIP DURING GROUP BONDING
Publication number
20240079358
Publication date
Mar 7, 2024
Micron Technology, Inc.
Siva Sai Kishore Palli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
Publication number
20230387051
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Yu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY BACKBOARD AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
Publication number
20230378414
Publication date
Nov 23, 2023
BOE TECHNOLOGY GROUP CO., LTD.
Zhiwei LIANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION
Publication number
20230378106
Publication date
Nov 23, 2023
NXP USA, Inc.
Namrata Kanth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE WITH A POROUS STRUCTURE
Publication number
20230369243
Publication date
Nov 16, 2023
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
Publication number
20230361062
Publication date
Nov 9, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Huan Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
Publication number
20230360946
Publication date
Nov 9, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hsin YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
Publication number
20230352351
Publication date
Nov 2, 2023
Taiwan Semiconductor Manufacturing company Ltd.
PEI-LUM MA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BASIN-SHAPED UNDERBUMP PLATES AND METHODS OF FORMING THE SAME
Publication number
20230352428
Publication date
Nov 2, 2023
Taiwan Semiconductor Manufacturing Company Limited
Yen-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPROACH TO PREVENT PLATING AT V-GROOVE ZONE IN PHOTONICS SILICON D...
Publication number
20230314735
Publication date
Oct 5, 2023
Intel Corporation
Santosh SHAW
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
Publication number
20230299023
Publication date
Sep 21, 2023
NANYA TECHNOLOGY CORPORATION
Teng-Yen HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUT...
Publication number
20230299026
Publication date
Sep 21, 2023
Magnachip Semiconductor, Ltd.
Myungho PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method
Publication number
20230260941
Publication date
Aug 17, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Chia Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SLOTTED BOND PAD IN STACKED WAFER STRUCTURE
Publication number
20230245987
Publication date
Aug 3, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Harry-Hak-Lay Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THICK BONDING PAD STRUCTURE FOR WIRE BOND STRESS REDUCTION
Publication number
20230238341
Publication date
Jul 27, 2023
STMicroelectronics Pte Ltd
Churn Weng YIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING SAME
Publication number
20230207501
Publication date
Jun 29, 2023
Changxin Memory Technologies, Inc.
Liang WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY PANEL AND DISPLAY APPARATUS
Publication number
20230197648
Publication date
Jun 22, 2023
Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
Xiaobo HU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND PACKAGING METHOD
Publication number
20230197652
Publication date
Jun 22, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
Xiaoxuan CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ARRAY SUBSTRATE, METHOD FOR FABRICATING SAME, AND DISPLAY DEVICE
Publication number
20230163146
Publication date
May 25, 2023
Shenzhen china Star Optoelectronics Semiconductor Display Technology Co., Ltd.
Xiaobo HU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY BACKBOARD AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
Publication number
20230097502
Publication date
Mar 30, 2023
BOE TECHNOLOGY GROUP CO., LTD.
Zhiwei LIANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20230091325
Publication date
Mar 23, 2023
Kabushiki Kaisha Toshiba
Emiko INOUE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...
Publication number
20230065797
Publication date
Mar 2, 2023
Taiwan Semiconductor Manufacturing Company Limited
Hui-Min HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE
Publication number
20230027391
Publication date
Jan 26, 2023
SAMSUNG DISPLAY CO., LTD.
Na Hyeon CHA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230021655
Publication date
Jan 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Hung Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20230021152
Publication date
Jan 19, 2023
Samsung Electronics Co., Ltd.
Hyun Su HWANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP BONDING METHOD AND SEMICONDUCTOR CHIP STRUCTURE
Publication number
20230011840
Publication date
Jan 12, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
CHIH-WEI CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20220399292
Publication date
Dec 15, 2022
Rohm Co., Ltd.
Shoji TAKEI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER AND METHOD FOR MANUFACTURING...
Publication number
20220367398
Publication date
Nov 17, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Hung CHEN
H01 - BASIC ELECTRIC ELEMENTS