using materials for controlling the level of pressure, contaminants or moisture inside of the package

Industry

CPC
B81B7/0038

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B7/00Micro-structural systems; Auxiliary parts of micro-structural devices or systems

Current Industry

B81B7/0038using materials for controlling the level of pressure, contaminants or moisture inside of the package

Industries

Patents Grantslast 30 patents

Information Patent Grant
Outgassing material coated cavity for a micro-electro mechanical sy...
- Patent number 12,234,141
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package for device
- Patent number 12,209,012
- Issue date Jan 28, 2025
- Teknologian tutkimuskeskus VTT Oy
- Jae-Wung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for fabricating a MEMS device
- Patent number 12,180,069
- Issue date Dec 31, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Resonator and resonance device including same
- Patent number 12,170,514
- Issue date Dec 17, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihisa Inoue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical device with perforated membrane
- Patent number 12,030,021
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Abidin Güçlü Onaran
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Protective cover member and member supplying sheet including the same
- Patent number 11,969,975
- Issue date Apr 30, 2024
- Nitto Denko Corporation
- Yuichi Abe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded structures
- Patent number 11,948,847
- Issue date Apr 2, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for providing getters in microelectromechanical...
- Patent number 11,945,713
- Issue date Apr 2, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device and corresponding method
- Patent number 11,945,714
- Issue date Apr 2, 2024
- STMicroelectronics S.r.l.
- Alex Gritti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multiaxis sensing system for detection of airborne molecules and ra...
- Patent number 11,940,576
- Issue date Mar 26, 2024
- National Technology & Engineering Solutions of Sandia, LLC
- Mark D. Allendorf
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device having a connection portion formed of a eutectic alloy
- Patent number 11,909,379
- Issue date Feb 20, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihisa Inoue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-opto-mechanical system sensor, arrangement and manufacturing...
- Patent number 11,898,899
- Issue date Feb 13, 2024
- MIRAEX SA
- Mitchell Anderson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Resonance device and manufacturing method of resonance device
- Patent number 11,881,838
- Issue date Jan 23, 2024
- Murata Manufacturing Co., Ltd.
- Kentarou Dehara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezoelectric microelectromechanical resonator device and correspon...
- Patent number 11,855,604
- Issue date Dec 26, 2023
- STMicroelectronics S.r.l.
- Federico Vercesi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Outgassing material coated cavity for a micro-electro mechanical sy...
- Patent number 11,827,513
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed optically transparent wafer-level packages and...
- Patent number 11,764,117
- Issue date Sep 19, 2023
- Corning Incorporated
- Robert Alan Bellman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Resonance device and method for producing resonance device
- Patent number 11,757,425
- Issue date Sep 12, 2023
- Murata Manufacturing Co., Ltd.
- Masakazu Fukumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS with small-molecule barricade
- Patent number 11,731,869
- Issue date Aug 22, 2023
- SiTime Corporation
- Charles I. Grosjean
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS with small-molecule barricade
- Patent number 11,718,518
- Issue date Aug 8, 2023
- SiTime Corporation
- Charles I. Grosjean
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capping plate for panel scale packaging of MEMS products
- Patent number 11,685,649
- Issue date Jun 27, 2023
- OBSIDIAN SENSORS, INC.
- John Hong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electromechanical system and method for producing same
- Patent number 11,685,645
- Issue date Jun 27, 2023
- LYNRED
- Sylvain Lemettre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Detachable MEMS package top cover
- Patent number 11,673,795
- Issue date Jun 13, 2023
- BEIJING VOYAGER TECHNOLOGY CO., LTD.
- Anan Pan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication techniques and structures for gettering materials in ul...
- Patent number 11,655,141
- Issue date May 23, 2023
- BFLY OPERATIONS, INC.
- Jianwei Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Getter technology for micromachined ultrasonic transducer cavities
- Patent number 11,638,931
- Issue date May 2, 2023
- BFLY OPERATIONS, INC.
- Keith G. Fife
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMs using outgassing material to adjust the pressure level in a ca...
- Patent number 11,634,318
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor with chamber
- Patent number 11,618,670
- Issue date Apr 4, 2023
- AINOS, INC.
- Yu-Fen Tzeng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package
- Patent number 11,565,933
- Issue date Jan 31, 2023
- Infineon Technologies AG
- Michael Kandler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin film getter and manufacturing method therefor
- Patent number 11,524,271
- Issue date Dec 13, 2022
- Industry-University Cooperation Foundation Hanyang University Erica Campus
- Yongho Choa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a micromechanical device having a damper struc...
- Patent number 11,505,455
- Issue date Nov 22, 2022
- Robert Bosch GmbH
- Holger Hoefer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical sensor device with improved liquid tightness protec...
- Patent number 11,401,157
- Issue date Aug 2, 2022
- Robert Bosch GmbH
- Christian Doering
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
COMBINED SOUND TRANSDUCER AND PRESSURE SENSOR PACKAGE
- Publication number 20240425363
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Bernhard Rieder
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING
- Publication number 20240409395
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Chung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
RESONANCE DEVICE AND RESONANCE DEVICE MANUFACTURING METHOD
- Publication number 20240375940
- Publication date Nov 14, 2024
- Murata Manufacturing Co., Ltd.
- Masakazu FUKUMITSU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...
- Publication number 20240367964
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS
- Publication number 20240272004
- Publication date Aug 15, 2024
- STMicroelectronics International N.V.
- Enri DUQI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EMBEDDED PERMEABLE POLYSILICON LAYER IN MEMS DEVICE FOR MULTIPLE CA...
- Publication number 20240199415
- Publication date Jun 20, 2024
- STMicroelectronics International N.V.
- Federico VERCESI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC DEVICE MANUFACTURING APPARATUS, AND M...
- Publication number 20240182294
- Publication date Jun 6, 2024
- Kabushiki Kaisha Toshiba
- Hiroki HIRAGA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Systems of Getters for Microelectronics and Methods for Production...
- Publication number 20240174515
- Publication date May 30, 2024
- Mesoline Inc.
- Marnix P. Rebergen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED STRUCTURES
- Publication number 20240162102
- Publication date May 16, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC MICROELECTROMECHANICAL RESONATOR DEVICE AND CORRESPON...
- Publication number 20240154599
- Publication date May 9, 2024
- STMicroelectronics S.r.l.
- Federico VERCESI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL DEVICE COMPRISING A HYDROGEN DRAINAGE LAYER
- Publication number 20240124296
- Publication date Apr 18, 2024
- ROBERT BOSCH GmbH
- Johannes Boy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED STRUCTURES
- Publication number 20240120245
- Publication date Apr 11, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...
- Publication number 20230365398
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
3D DOME WAFER-LEVEL PACKAGE FOR OPTICAL MEMS MIRROR WITH REDUCED FO...
- Publication number 20230288695
- Publication date Sep 14, 2023
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20230249961
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- YUAN-CHIH HSIEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INERTIAL SENSOR, METHOD FOR MANUFACTURING INERTIAL SENSOR, AND INER...
- Publication number 20230221346
- Publication date Jul 13, 2023
- SEIKO EPSON CORPORATION
- Teruo TAKIZAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTROMECHANICAL SYSTEM AND METHOD FOR PRODUCING SAME
- Publication number 20230123544
- Publication date Apr 20, 2023
- LYNRED
- Sylvain Lemettre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROTECTIVE COVER MEMBER AND MEMBER SUPPLYING SHEET
- Publication number 20230108896
- Publication date Apr 6, 2023
- Nitto Denko Corporation
- Hiroki KIGAMI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Waterproof MEMS Pressure Sensor Package With A Metal Lid And An Emb...
- Publication number 20230087021
- Publication date Mar 23, 2023
- InvenSense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level package for device
- Publication number 20230050181
- Publication date Feb 16, 2023
- Teknologian Tutkimuskeskus VTT Oy
- Jae-Wung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP
- Publication number 20230045563
- Publication date Feb 9, 2023
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED STRUCTURES
- Publication number 20220367302
- Publication date Nov 17, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL...
- Publication number 20220348455
- Publication date Nov 3, 2022
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20220340413
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YUAN-CHIH HSIEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Thin film getter structure having miniature heater and manufacturin...
- Publication number 20220340412
- Publication date Oct 27, 2022
- SHANGHAI INDUSTRIAL µTECHNOLOGY RESEARCH INSTITUTE
- Shinan WANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROTECTIVE COVER MEMBER AND MEMBER SUPPLYING SHEET INCLUDING THE SAME
- Publication number 20220266575
- Publication date Aug 25, 2022
- Nitto Denko Corporation
- Yuichi ABE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BARRIER STRUCTURE WITHIN A MICROELECTRONIC ENCLOSURE
- Publication number 20220212919
- Publication date Jul 7, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jennifer Lynne HOLM
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LIQUID-RESISTANT AIR INLET PASSIVE DEVICE AND METHODS OF MAKING SAME
- Publication number 20220212920
- Publication date Jul 7, 2022
- Kathirgamasundaram SOORIAKUMAR
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Enclosures for Microphone Assemblies Including a Fluoropolymer Insu...
- Publication number 20220201387
- Publication date Jun 23, 2022
- KNOWLES ELECTRONICS, LLC
- Adam Ariffin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220153573
- Publication date May 19, 2022
- Murata Manufacturing Co., Ltd.
- Yoshiyuki Higuchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY

using materials for controlling the level of pressure, contaminants or moisture inside of the package

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Outgassing material coated cavity for a micro-electro mechanical sy...

Wafer level package for device

Method and system for fabricating a MEMS device

Resonator and resonance device including same

Micromechanical device with perforated membrane

Protective cover member and member supplying sheet including the same

Bonded structures

Systems and methods for providing getters in microelectromechanical...

Electronic device and corresponding method

Multiaxis sensing system for detection of airborne molecules and ra...

MEMS device having a connection portion formed of a eutectic alloy

Micro-opto-mechanical system sensor, arrangement and manufacturing...

Resonance device and manufacturing method of resonance device

Piezoelectric microelectromechanical resonator device and correspon...

Outgassing material coated cavity for a micro-electro mechanical sy...

Hermetically sealed optically transparent wafer-level packages and...

Resonance device and method for producing resonance device

MEMS with small-molecule barricade

MEMS with small-molecule barricade

Capping plate for panel scale packaging of MEMS products

Micro-electromechanical system and method for producing same

Detachable MEMS package top cover

Fabrication techniques and structures for gettering materials in ul...

Getter technology for micromachined ultrasonic transducer cavities

MEMs using outgassing material to adjust the pressure level in a ca...

Sensor with chamber

Sensor package

Thin film getter and manufacturing method therefor

Method for producing a micromechanical device having a damper struc...

Micromechanical sensor device with improved liquid tightness protec...

Patents Applicationslast 30 patents

COMBINED SOUND TRANSDUCER AND PRESSURE SENSOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MAKING

RESONANCE DEVICE AND RESONANCE DEVICE MANUFACTURING METHOD

OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...

PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS

EMBEDDED PERMEABLE POLYSILICON LAYER IN MEMS DEVICE FOR MULTIPLE CA...

ELECTRONIC DEVICE, ELECTRONIC DEVICE MANUFACTURING APPARATUS, AND M...

Systems of Getters for Microelectronics and Methods for Production...

BONDED STRUCTURES

PIEZOELECTRIC MICROELECTROMECHANICAL RESONATOR DEVICE AND CORRESPON...

MICROMECHANICAL DEVICE COMPRISING A HYDROGEN DRAINAGE LAYER

BONDED STRUCTURES

OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...

3D DOME WAFER-LEVEL PACKAGE FOR OPTICAL MEMS MIRROR WITH REDUCED FO...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

INERTIAL SENSOR, METHOD FOR MANUFACTURING INERTIAL SENSOR, AND INER...

MICRO-ELECTROMECHANICAL SYSTEM AND METHOD FOR PRODUCING SAME

PROTECTIVE COVER MEMBER AND MEMBER SUPPLYING SHEET

Waterproof MEMS Pressure Sensor Package With A Metal Lid And An Emb...

Wafer level package for device

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP

BONDED STRUCTURES

SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

Thin film getter structure having miniature heater and manufacturin...

PROTECTIVE COVER MEMBER AND MEMBER SUPPLYING SHEET INCLUDING THE SAME

BARRIER STRUCTURE WITHIN A MICROELECTRONIC ENCLOSURE

LIQUID-RESISTANT AIR INLET PASSIVE DEVICE AND METHODS OF MAKING SAME

Enclosures for Microphone Assemblies Including a Fluoropolymer Insu...

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME