Vacuum

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CPC
H01L2224/8109

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8109Vacuum

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 12,148,725
- Issue date Nov 19, 2024
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,113,044
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a protection mechanism and associated sys...
- Patent number 11,756,844
- Issue date Sep 12, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 11,710,718
- Issue date Jul 25, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for superconducting multi-chip module
- Patent number 11,711,985
- Issue date Jul 25, 2023
- SeeQC Inc.
- Daniel Yohannes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting system
- Patent number 11,587,804
- Issue date Feb 21, 2023
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for temporarily fastening a semiconductor chip to a surface,...
- Patent number 11,521,946
- Issue date Dec 6, 2022
- OSRAM OLED GmbH
- Klaus Müller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 11,476,291
- Issue date Oct 18, 2022
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,476,229
- Issue date Oct 18, 2022
- Kioxia Corporation
- Chikara Miyazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing joined structure
- Patent number 11,446,752
- Issue date Sep 20, 2022
- KOKI COMPANY LIMITED
- Satoshi Ootani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Batch processing oven and method
- Patent number 11,444,053
- Issue date Sep 13, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding with pre-deoxide process and apparatus for performing the same
- Patent number 11,342,302
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow oven for batch processing
- Patent number 11,335,662
- Issue date May 17, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 11,201,138
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 11,166,351
- Issue date Nov 2, 2021
- Samsung Electronics Co., Ltd.
- Sin-Yeob Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packaging with low-force thermocompression bonding of oxidizable...
- Patent number 11,134,598
- Issue date Sep 28, 2021
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for superconducting multi-chip module
- Patent number 11,121,302
- Issue date Sep 14, 2021
- Daniel Yohannes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a protection mechanism and associated sys...
- Patent number 10,943,842
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 10,937,757
- Issue date Mar 2, 2021
- Semigear, Inc.
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,892,246
- Issue date Jan 12, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,886,250
- Issue date Jan 5, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 10,811,305
- Issue date Oct 20, 2020
- International Business Machines Corporation
- Li-Wen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 10,796,958
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing solder bump by vacuum annealing
- Patent number 10,784,221
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 10,777,454
- Issue date Sep 15, 2020
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting device and circuit chip connecting method using connecti...
- Patent number 10,756,045
- Issue date Aug 25, 2020
- Samsung Display Co., Ltd.
- Seung Hwa Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging through pre-formed metal pins
- Patent number 10,734,345
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 10,651,086
- Issue date May 12, 2020
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312868
- Publication date Sep 19, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...
- Publication number 20240186280
- Publication date Jun 6, 2024
- Intel Corporation
- Minglu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240170449
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- HYOUNGJOO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CONNECTION STRUCTURE, ROOM-TEMPERATURE FLIP CONNECTION STRUCTU...
- Publication number 20240145428
- Publication date May 2, 2024
- Sony Semiconductor Solutions Corporation
- KAZUHIDE TERAHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRAFINE-PITCH ALL-COPPER INTERCONNECT STRUCTURE AND FORMING METHO...
- Publication number 20240113068
- Publication date Apr 4, 2024
- Guangdong University of Technology
- Yu ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20240047410
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS FOR FLUXLESS BONDING USING AN ATMOSPHERIC PRESSURE PLASMA A...
- Publication number 20230378123
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE
- Publication number 20230380302
- Publication date Nov 23, 2023
- Daniel Yohannes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230335531
- Publication date Oct 19, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230268314
- Publication date Aug 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING THE SAME, AND MET...
- Publication number 20230197666
- Publication date Jun 22, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Compensation for BGA Package
- Publication number 20230147273
- Publication date May 11, 2023
- Apple Inc.
- Brett W. Degner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEMS FOR BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES...
- Publication number 20230133526
- Publication date May 4, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230132060
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230132054
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Wooram MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20230005979
- Publication date Jan 5, 2023
- SONY GROUP CORPORATION
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Assembly Packaging Method, Semiconductor Assembly and...
- Publication number 20220216176
- Publication date Jul 7, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE
- Publication number 20210408355
- Publication date Dec 30, 2021
- Daniel Yohannes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH PROCESSING OVEN AND METHOD
- Publication number 20210265301
- Publication date Aug 26, 2021
- Yield Engineering Systems, Inc.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20210225801
- Publication date Jul 22, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING M...
- Publication number 20210227735
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Gold Contacting Metal
- Publication number 20210227734
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Tin-Based Contacting Metal
- Publication number 20210227732
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Copper-Based Contacting M...
- Publication number 20210227733
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding Using Metastable Gas Atoms
- Publication number 20210219474
- Publication date Jul 15, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Nickel-Based Contacting M...
- Publication number 20210219475
- Publication date Jul 15, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...
- Publication number 20210183716
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Temporarily Fastening a Semiconductor Chip to a Surface,...
- Publication number 20210183800
- Publication date Jun 17, 2021
- OSRAM OLED GmbH
- Klaus Müller
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding structures and methods for forming the same

Semiconductor package and manufacturing method thereof

Structures for low temperature bonding using nanoparticles

Methods for low temperature bonding using nanoparticles

Semiconductor device with a protection mechanism and associated sys...

Structures and methods for low temperature bonding using nanoparticles

System and method for superconducting multi-chip module

Component mounting system

Method for temporarily fastening a semiconductor chip to a surface,...

Semiconductor device and method of manufacturing thereof

Semiconductor device manufacturing method

Method for producing joined structure

Batch processing oven and method

Bonding with pre-deoxide process and apparatus for performing the same

Solder reflow oven for batch processing

Wafer level integration including design/co-design, structure proce...

Solder reflow apparatus and method of manufacturing an electronic d...

3D packaging with low-force thermocompression bonding of oxidizable...

System and method for superconducting multi-chip module

Semiconductor device with a protection mechanism and associated sys...

Device packaging facility and method, and device processing apparat...

Structures and methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Wafer level integration including design/co-design, structure proce...

3D integration method using SOI substrates and structures produced...

Method of processing solder bump by vacuum annealing

3D integration method using SOI substrates and structures produced...

Connecting device and circuit chip connecting method using connecti...

Packaging through pre-formed metal pins

3D integration method using SOI substrates and structures produced...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

FLIP CONNECTION STRUCTURE, ROOM-TEMPERATURE FLIP CONNECTION STRUCTU...

ULTRAFINE-PITCH ALL-COPPER INTERCONNECT STRUCTURE AND FORMING METHO...

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

SYSTEMS FOR FLUXLESS BONDING USING AN ATMOSPHERIC PRESSURE PLASMA A...

SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING THE SAME, AND MET...

Warpage Compensation for BGA Package

BONDING SYSTEMS FOR BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES...

METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

Semiconductor Assembly Packaging Method, Semiconductor Assembly and...

SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE

BATCH PROCESSING OVEN AND METHOD

Structures And Methods For Low Temperature Bonding Using Nanoparticles

THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING M...

Thermocompression Bonding with Passivated Gold Contacting Metal

Thermocompression Bonding with Passivated Tin-Based Contacting Metal

Thermocompression Bonding with Passivated Copper-Based Contacting M...

Thermocompression Bonding Using Metastable Gas Atoms

Thermocompression Bonding with Passivated Nickel-Based Contacting M...

SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...

Method for Temporarily Fastening a Semiconductor Chip to a Surface,...