Vertical connections

Industry

CPC
H01L2223/6616

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/6616Vertical connections

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
RF amplifier devices including top side contacts and methods of man...
- Patent number 12,166,003
- Issue date Dec 10, 2024
- MACOM Technology Solutions Holdings, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with integrated passive components
- Patent number 12,159,845
- Issue date Dec 3, 2024
- NXP USA, INC.
- Humayun Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave integrated circuit
- Patent number 12,154,871
- Issue date Nov 26, 2024
- Sumitomo Electric Device Innovations, Inc.
- Kenshi Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platforms including microelectronic packages therein coupled to a c...
- Patent number 12,150,271
- Issue date Nov 19, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and antenna module comprising the same
- Patent number 12,148,708
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Yong Koon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency module and communication apparatus
- Patent number 12,136,614
- Issue date Nov 5, 2024
- Murata Manufacturing Co., Ltd.
- Yukiya Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus including antennas and directors
- Patent number 12,136,593
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and antenna device using the same
- Patent number 12,119,541
- Issue date Oct 15, 2024
- Innolux Corporation
- I-Yin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral escape using triangular structure of transceivers
- Patent number 12,095,494
- Issue date Sep 17, 2024
- MARVELL ASIA PTE. LTD.
- Aatreya Chakravarti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride integrated circuits including non-gold-based metall...
- Patent number 12,087,713
- Issue date Sep 10, 2024
- Analog Devices, Inc.
- Daniel Piedra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures with antenna elements and IC chips employing...
- Patent number 12,080,661
- Issue date Sep 3, 2024
- Viasat, Inc.
- Steven J. Franson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package assemblies and processes for making
- Patent number 12,074,099
- Issue date Aug 27, 2024
- Materion Corporation
- Ramesh Kothandapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etching process for SiGe and doped epitaxial silicon
- Patent number 12,062,571
- Issue date Aug 13, 2024
- Qorvo US, Inc.
- Krishna Chetry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 12,046,523
- Issue date Jul 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged module with ball grid array and grounding pins for signal...
- Patent number 12,033,954
- Issue date Jul 9, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and antenna structure thereof
- Patent number 12,027,753
- Issue date Jul 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Chia-Chu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components for millimeter-wave communication
- Patent number 12,021,289
- Issue date Jun 25, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection and wiring layers, package structures,...
- Patent number 12,015,003
- Issue date Jun 18, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,009,575
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Nan-Chin Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous antenna in fan-out package
- Patent number 11,996,606
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yao Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etching process for SiGe and doped epitaxial silicon
- Patent number 11,996,318
- Issue date May 28, 2024
- Qorvo US, Inc.
- Krishna Chetry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amplifier modules with power transistor die and peripheral ground c...
- Patent number 11,990,384
- Issue date May 21, 2024
- Elie A. Maalouf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die with embedded communication cavity
- Patent number 11,978,948
- Issue date May 7, 2024
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip semiconductor-on-insulator transistor layout
- Patent number 11,973,033
- Issue date Apr 30, 2024
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module and electronic device including the same
- Patent number 11,967,752
- Issue date Apr 23, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ho Kyung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing loss in stacked quantum devices
- Patent number 11,955,465
- Issue date Apr 9, 2024
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for packaging an integrated circuit (IC) package with embedd...
- Patent number 11,929,300
- Issue date Mar 12, 2024
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,908,787
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP, CHIP PREPARATION METHOD, RADIO FREQUENCY POWER AMPLIFIER, AND...
- Publication number 20240421108
- Publication date Dec 19, 2024
- Huawei Technologies Co., Ltd
- Shuiming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT
- Publication number 20240404952
- Publication date Dec 5, 2024
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lateral escape using triangular structure of transceivers
- Publication number 20240405795
- Publication date Dec 5, 2024
- Marvell Asia Pte Ltd.
- Aatreya Chakravarti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METH...
- Publication number 20240395739
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387417
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC APPARATUS
- Publication number 20240387367
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND IMAGE CAPTURING...
- Publication number 20240379591
- Publication date Nov 14, 2024
- Canon Kabushiki Kaisha
- TATSUYA MURAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379590
- Publication date Nov 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Chia-Chu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371711
- Publication date Nov 7, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Millimeter-Wave Passive Circuit Designs with Wafer-Level Chip-Scale...
- Publication number 20240363461
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsieh-Hung Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING DEVICE AND MANUFACTURING METHOD FOR SEMICON...
- Publication number 20240347484
- Publication date Oct 17, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...
- Publication number 20240347476
- Publication date Oct 17, 2024
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR WITH SOURCE MANIFOLD IN NON-ACTIVE DIE REGION
- Publication number 20240339409
- Publication date Oct 10, 2024
- NXP USA, Inc.
- Humayun Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Antenna-in-Package St...
- Publication number 20240321664
- Publication date Sep 26, 2024
- JCET STATS ChipPAC Korea Limited
- YeJin PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITOR INTERCONNECT FOR HIGH-QUALITY...
- Publication number 20240321724
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Doosoub SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRACKER MODULE, RADIO FREQUENCY SYSTEM, AND COMMUNICATION DEVICE
- Publication number 20240313714
- Publication date Sep 19, 2024
- Murata Manufacturing Co., Ltd.
- Tatsuya BANNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Antenna in Fan-Out Package
- Publication number 20240297432
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yao Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND C...
- Publication number 20240282654
- Publication date Aug 22, 2024
- NXP USA, Inc.
- Elie A. Maalouf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE ASSEMBLY AND MANUFACTURING METHOD THEREFOR
- Publication number 20240274571
- Publication date Aug 15, 2024
- Tadatomo SUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHIELDING STRUCTURE, MANUFACTURING METHOD, AND COMM...
- Publication number 20240234337
- Publication date Jul 11, 2024
- VANCHIP (TIANJIN) TECHNOLOGY CO., LTD
- Ying YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH HIGH PEAK BANDWIDTH I/O CHANNELS
- Publication number 20240223283
- Publication date Jul 4, 2024
- L. Pierre de Rochemont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY DEVICE PACKAGES
- Publication number 20240213188
- Publication date Jun 27, 2024
- Analog Devices, Inc.
- Santosh Anil Kudtarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULE WITH TRANSISTOR DIES FOR MULTIPLE AMPLIFIER...
- Publication number 20240186212
- Publication date Jun 6, 2024
- NXP USA, Inc.
- Stephen Reza Hiemstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER ST...
- Publication number 20240178162
- Publication date May 30, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240170386
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...
- Publication number 20240154639
- Publication date May 9, 2024
- Skyworks Solutions, Inc.
- James Phillip YOUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME
- Publication number 20240120289
- Publication date Apr 11, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES
- Publication number 20240113049
- Publication date Apr 4, 2024
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER
- Publication number 20240113006
- Publication date Apr 4, 2024
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH TH...
- Publication number 20240096817
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS

Vertical connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

RF amplifier devices including top side contacts and methods of man...

Transistor with integrated passive components

Microwave integrated circuit

Platforms including microelectronic packages therein coupled to a c...

Semiconductor package and antenna module comprising the same

Power amplifier modules including semiconductor resistor and tantal...

Radio frequency module and communication apparatus

Electronic apparatus including antennas and directors

Package structure and antenna device using the same

Lateral escape using triangular structure of transceivers

Gallium nitride integrated circuits including non-gold-based metall...

Integrated structures with antenna elements and IC chips employing...

Microelectronics package assemblies and processes for making

Selective etching process for SiGe and doped epitaxial silicon

Semiconductor device packages and methods of manufacturing the same

Packaged module with ball grid array and grounding pins for signal...

Electronic package and antenna structure thereof

Components for millimeter-wave communication

High density interconnection and wiring layers, package structures,...

Package structure

Heterogeneous antenna in fan-out package

Selective etching process for SiGe and doped epitaxial silicon

Amplifier modules with power transistor die and peripheral ground c...

Die with embedded communication cavity

Flip-chip semiconductor-on-insulator transistor layout

Antenna module and electronic device including the same

Devices and methods related to dual-sided radio-frequency package w...

Reducing loss in stacked quantum devices

Method for packaging an integrated circuit (IC) package with embedd...

Package structure and method of manufacturing the same

Patents Applicationslast 30 patents

CHIP, CHIP PREPARATION METHOD, RADIO FREQUENCY POWER AMPLIFIER, AND...

FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT

Lateral escape using triangular structure of transceivers

CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METH...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND IMAGE CAPTURING...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

Millimeter-Wave Passive Circuit Designs with Wafer-Level Chip-Scale...

SEMICONDUCTOR PACKAGING DEVICE AND MANUFACTURING METHOD FOR SEMICON...

METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...

TRANSISTOR WITH SOURCE MANIFOLD IN NON-ACTIVE DIE REGION

Semiconductor Device and Method of Forming an Antenna-in-Package St...

METAL-INSULATOR-METAL (MIM) CAPACITOR INTERCONNECT FOR HIGH-QUALITY...

TRACKER MODULE, RADIO FREQUENCY SYSTEM, AND COMMUNICATION DEVICE

Heterogeneous Antenna in Fan-Out Package

AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND C...

SEMICONDUCTOR SUBSTRATE ASSEMBLY AND MANUFACTURING METHOD THEREFOR

ELECTROMAGNETIC SHIELDING STRUCTURE, MANUFACTURING METHOD, AND COMM...

MODULE WITH HIGH PEAK BANDWIDTH I/O CHANNELS

HIGH FREQUENCY DEVICE PACKAGES

POWER AMPLIFIER MODULE WITH TRANSISTOR DIES FOR MULTIPLE AMPLIFIER...

INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER ST...

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...

ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME

PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES

PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER

ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH TH...