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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2223/00
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H01L2223/6616
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Patents Grants
last 30 patents
Information
Patent Grant
Flip-chip semiconductor-on-insulator transistor layout
Patent number
11,973,033
Issue date
Apr 30, 2024
Skyworks Solutions, Inc.
Yang Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna module and electronic device including the same
Patent number
11,967,752
Issue date
Apr 23, 2024
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Ho Kyung Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
Patent number
11,961,805
Issue date
Apr 16, 2024
Skyworks Solutions, Inc.
Howard E. Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reducing loss in stacked quantum devices
Patent number
11,955,465
Issue date
Apr 9, 2024
Google LLC
Theodore Charles White
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method for packaging an integrated circuit (IC) package with embedd...
Patent number
11,929,300
Issue date
Mar 12, 2024
Qorvo US, Inc.
Kevin J. Anderson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of manufacturing the same
Patent number
11,908,787
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chuei-Tang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flat panel substrate with integrated antennas and wireless power tr...
Patent number
11,901,366
Issue date
Feb 13, 2024
Ossia Inc.
Hatem Ibrahim Munir Zeine
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Module with high peak bandwidth I/O channels
Patent number
11,901,956
Issue date
Feb 13, 2024
L. Pierre de Rochemont
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Launch structures for radio frequency integrated device packages
Patent number
11,894,322
Issue date
Feb 6, 2024
Analog Devices, Inc.
Bruce E. Wilcox
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna module and electronic device including the same
Patent number
11,888,212
Issue date
Jan 30, 2024
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Ho Kyung Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with isolation and/or protection structures
Patent number
11,887,945
Issue date
Jan 30, 2024
Wolfspeed, Inc.
Lei Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with directing structure and method therefor
Patent number
11,876,059
Issue date
Jan 16, 2024
NXP USA, INC.
Robert Joseph Wenzel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna package using ball attach array to connect antenna and base...
Patent number
11,870,163
Issue date
Jan 9, 2024
Intel Corporation
Jimin Yao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vertical interconnection structure of a multi-layer substrate
Patent number
11,864,315
Issue date
Jan 2, 2024
Mediatek Inc.
Yi-Chieh Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective etching process for SiGe and doped epitaxial silicon
Patent number
11,854,865
Issue date
Dec 26, 2023
Qorvo US, Inc.
Krishna Chetry
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,855,013
Issue date
Dec 26, 2023
Samsung Electronics Co., Ltd.
Se-Ho You
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cavity resonator for enhancing radio-frequency performance and meth...
Patent number
11,848,291
Issue date
Dec 19, 2023
Taiwan Semiconductor Manufacturing Company Limited
Jheng-Hong Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate with gradiated dielectric for reducing impedance mismatch
Patent number
11,837,458
Issue date
Dec 5, 2023
Intel Corporation
Jackson Chung Peng Kong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Group III nitride-based radio frequency amplifiers having back side...
Patent number
11,837,559
Issue date
Dec 5, 2023
Wolfspeed, Inc.
Michael E. Watts
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods related to radio-frequency filters on silicon-on-insulator...
Patent number
11,817,895
Issue date
Nov 14, 2023
Skyworks Solutions, Inc.
James Phillip Young
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged integrated circuit device with built-in baluns
Patent number
11,810,875
Issue date
Nov 7, 2023
NXP B.V.
Waqas Hassan Syed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,804,457
Issue date
Oct 31, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor-on-insulator transistor layout for radio frequency po...
Patent number
11,804,435
Issue date
Oct 31, 2023
Skyworks Solutions, Inc.
Yang Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna package for signal transmission
Patent number
11,791,534
Issue date
Oct 17, 2023
Tawian Semiconductor Manufacturing Co., Ltd.
Feng-Wei Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
11,791,293
Issue date
Oct 17, 2023
Advanced Semiconductor Engineering, Inc.
Wen Hung Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices comprising planar waveguide transmission lines
Patent number
11,784,144
Issue date
Oct 10, 2023
Infineon Technologies AG
Horst Theuss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal management in integrated circuit packages
Patent number
11,784,108
Issue date
Oct 10, 2023
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and method of manufacturing the same
Patent number
11,756,904
Issue date
Sep 12, 2023
Advanced Semiconductor Engineering, Inc.
Yuanhao Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic module and method of manufacturing electronic module
Patent number
11,756,906
Issue date
Sep 12, 2023
Murata Manufacturing Co., Ltd.
Takashi Iwamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package interface with improved impedance continuity
Patent number
11,756,905
Issue date
Sep 12, 2023
CREDO TECHNOLOGY GROUP LIMITED
Mengying Ma
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME
Publication number
20240120289
Publication date
Apr 11, 2024
JCET STATS ChipPAC Korea Limited
SeungHyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES
Publication number
20240113049
Publication date
Apr 4, 2024
Intel Corporation
Kristof Kuwawi Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER
Publication number
20240113006
Publication date
Apr 4, 2024
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH TH...
Publication number
20240096817
Publication date
Mar 21, 2024
QUALCOMM Incorporated
Ranadeep DUTTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Packages and Methods of Forming the Same
Publication number
20240079356
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER AMPLIFIER DEVICE HAVING DIES WITH ELONGATED BONDPADS CONNECTE...
Publication number
20240072740
Publication date
Feb 29, 2024
NXP USA, Inc.
Kevin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MAKING ELECTRONIC PACKAGE
Publication number
20240071991
Publication date
Feb 29, 2024
JCET STATS ChipPAC Korea Limited
SeungHyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...
Publication number
20240063544
Publication date
Feb 22, 2024
Intel Corporation
Jimin Yao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
Publication number
20240063126
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Lin-Chen Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20240055365
Publication date
Feb 15, 2024
Advanced Semiconductor Engineering, Inc.
Po-I WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D PACKAGING WITH SILICON DIE AS THERMAL SINK FOR HIGH-POWER LOW TH...
Publication number
20240047295
Publication date
Feb 8, 2024
Qorvo US, Inc.
George Maxim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Publication number
20240038692
Publication date
Feb 1, 2024
Murata Manufacturing Co., Ltd.
Takashi YAMADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRAPPING LAYER FOR A RADIO FREQUENCY DIE AND METHODS OF FORMATION
Publication number
20240030222
Publication date
Jan 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Hung CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES
Publication number
20240030098
Publication date
Jan 25, 2024
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING TWO OR MORE STACKED SEMICONDUCTOR ST...
Publication number
20240021553
Publication date
Jan 18, 2024
SK HYNIX INC.
Choung Ki SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRELESS CHIP-TO-CHIP HIGH-SPEED DATA TRANSPORT
Publication number
20240021522
Publication date
Jan 18, 2024
Intel Corporation
Tolga ACIKALIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240014151
Publication date
Jan 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE WITH PSEUDO-STRIPLINE ARCHITECTURE
Publication number
20230420379
Publication date
Dec 28, 2023
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20230402398
Publication date
Dec 14, 2023
Siliconware Precision Industries Co., Ltd.
Che-Chi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20230402409
Publication date
Dec 14, 2023
Siliconware Precision Industries Co., Ltd.
Chung-Yu Ke
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Mixed Dielectric Materials for Improving Signal Integrity of Integr...
Publication number
20230395444
Publication date
Dec 7, 2023
Avago Technologies International Sales Pte. Limited
Mayank Mayukh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE
Publication number
20230395536
Publication date
Dec 7, 2023
Murata Manufacturing Co., Ltd.
Naohide TOMITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER AMPLIFIER CIRCUIT
Publication number
20230378105
Publication date
Nov 23, 2023
MURATA MANUFACTURING CO., LTD.
Shohei IMAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METH...
Publication number
20230378104
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Company Limited
Jheng-Hong JIANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Antenna Package For Signal Transmission
Publication number
20230378636
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Feng-Wei KUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI CHIP FRONT END MODULE WITH SHIELDING VIAS
Publication number
20230378103
Publication date
Nov 23, 2023
Skyworks Solutions, Inc.
Abdulhadi Ebrahim Abdulhadi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230369258
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsiu-Ying Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Devices in Semiconductor Packages and Methods of Forming...
Publication number
20230369259
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE TO REDUCE SIGNAL LOSS IN A TRANSMISSION LINE
Publication number
20230361020
Publication date
Nov 9, 2023
ALLEGRO MICROSYSTEMS, LLC
Pablo Jesús Gardella
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE-INTEGRATED WAVEGUIDE
Publication number
20230352315
Publication date
Nov 2, 2023
TEXAS INSTRUMENTS INCORPORATED
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS