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H01L2223/6616

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/6616Vertical connections

Industries

Patents Grantslast 30 patents

Information Patent Grant
Cavity resonator for enhancing radio-frequency performance and meth...
- Patent number 12,237,280
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to radio-frequency filters on silicon-o...
- Patent number 12,237,861
- Issue date Feb 25, 2025
- Skyworks Solutions, Inc.
- James Phillip Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter-wave antenna chip and terminal device
- Patent number 12,224,254
- Issue date Feb 11, 2025
- Huawei Technologies Co., Ltd.
- Weixi Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,218,044
- Issue date Feb 4, 2025
- Renesas Electronics Corporation
- Nobuhiro Kinoshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, electronic device, and method for manufacturing substrate
- Patent number 12,218,085
- Issue date Feb 4, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hirofumi Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,211,765
- Issue date Jan 28, 2025
- Advanced Semiconductor Engineering, Inc.
- Wei-Tung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and multi-level interposer with RF sloped via and...
- Patent number 12,205,880
- Issue date Jan 21, 2025
- Eagle Technology, LLC
- Matt Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die to die high-speed communication without discrete amplifiers bet...
- Patent number 12,205,908
- Issue date Jan 21, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna with graded dielectirc and method of making the same
- Patent number 12,191,571
- Issue date Jan 7, 2025
- Intel Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with logic circuits and memor...
- Patent number 12,183,699
- Issue date Dec 31, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, having via wiring, method of manufacturing se...
- Patent number 12,176,265
- Issue date Dec 24, 2024
- Fujitsu Limited
- Naoya Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF amplifier devices including top side contacts and methods of man...
- Patent number 12,166,003
- Issue date Dec 10, 2024
- MACOM Technology Solutions Holdings, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with integrated passive components
- Patent number 12,159,845
- Issue date Dec 3, 2024
- NXP USA, INC.
- Humayun Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave integrated circuit
- Patent number 12,154,871
- Issue date Nov 26, 2024
- Sumitomo Electric Device Innovations, Inc.
- Kenshi Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platforms including microelectronic packages therein coupled to a c...
- Patent number 12,150,271
- Issue date Nov 19, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and antenna module comprising the same
- Patent number 12,148,708
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Yong Koon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency module and communication apparatus
- Patent number 12,136,614
- Issue date Nov 5, 2024
- Murata Manufacturing Co., Ltd.
- Yukiya Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus including antennas and directors
- Patent number 12,136,593
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and antenna device using the same
- Patent number 12,119,541
- Issue date Oct 15, 2024
- Innolux Corporation
- I-Yin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral escape using triangular structure of transceivers
- Patent number 12,095,494
- Issue date Sep 17, 2024
- MARVELL ASIA PTE. LTD.
- Aatreya Chakravarti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride integrated circuits including non-gold-based metall...
- Patent number 12,087,713
- Issue date Sep 10, 2024
- Analog Devices, Inc.
- Daniel Piedra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures with antenna elements and IC chips employing...
- Patent number 12,080,661
- Issue date Sep 3, 2024
- Viasat, Inc.
- Steven J. Franson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package assemblies and processes for making
- Patent number 12,074,099
- Issue date Aug 27, 2024
- Materion Corporation
- Ramesh Kothandapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etching process for SiGe and doped epitaxial silicon
- Patent number 12,062,571
- Issue date Aug 13, 2024
- Qorvo US, Inc.
- Krishna Chetry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 12,046,523
- Issue date Jul 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged module with ball grid array and grounding pins for signal...
- Patent number 12,033,954
- Issue date Jul 9, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and antenna structure thereof
- Patent number 12,027,753
- Issue date Jul 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Chia-Chu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components for millimeter-wave communication
- Patent number 12,021,289
- Issue date Jun 25, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection and wiring layers, package structures,...
- Patent number 12,015,003
- Issue date Jun 18, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20250079374
- Publication date Mar 6, 2025
- Fujitsu Limited
- Shinya SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DIODE INTEGRATION WITH BACKSIDE BACK END OF THE LINE NETWORK
- Publication number 20250079349
- Publication date Mar 6, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structures for Dual-Thickness Active Area SOI FETS
- Publication number 20250063822
- Publication date Feb 20, 2025
- pSemi Corporation
- Jagar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250062209
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Sheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY
- Publication number 20250054876
- Publication date Feb 13, 2025
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE
- Publication number 20250055175
- Publication date Feb 13, 2025
- PanelSemi Corporation
- Ching-Kuang Clive TZUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFFLE-SHAPED RADIO FREQUENCY (RF) SWITCH
- Publication number 20250046736
- Publication date Feb 6, 2025
- QUALCOMM Incorporated
- Woojin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK
- Publication number 20250040028
- Publication date Jan 30, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Patrick LENHARDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF MODULE
- Publication number 20250022815
- Publication date Jan 16, 2025
- INFINEON TECHNOLOGIES AG
- Ernst SELER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER SEMICONDUCTOR DEVICE
- Publication number 20250015768
- Publication date Jan 9, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Akihiko NISHIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH TRANSMISSION LINE AND METHOD FOR MANUFACTURI...
- Publication number 20250006669
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP, CHIP PREPARATION METHOD, RADIO FREQUENCY POWER AMPLIFIER, AND...
- Publication number 20240421108
- Publication date Dec 19, 2024
- Huawei Technologies Co., Ltd
- Shuiming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT
- Publication number 20240404952
- Publication date Dec 5, 2024
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lateral escape using triangular structure of transceivers
- Publication number 20240405795
- Publication date Dec 5, 2024
- Marvell Asia Pte Ltd.
- Aatreya Chakravarti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METH...
- Publication number 20240395739
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387417
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC APPARATUS
- Publication number 20240387367
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND IMAGE CAPTURING...
- Publication number 20240379591
- Publication date Nov 14, 2024
- Canon Kabushiki Kaisha
- TATSUYA MURAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379590
- Publication date Nov 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Chia-Chu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371711
- Publication date Nov 7, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Millimeter-Wave Passive Circuit Designs with Wafer-Level Chip-Scale...
- Publication number 20240363461
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsieh-Hung Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING DEVICE AND MANUFACTURING METHOD FOR SEMICON...
- Publication number 20240347484
- Publication date Oct 17, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...
- Publication number 20240347476
- Publication date Oct 17, 2024
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR WITH SOURCE MANIFOLD IN NON-ACTIVE DIE REGION
- Publication number 20240339409
- Publication date Oct 10, 2024
- NXP USA, Inc.
- Humayun Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Antenna-in-Package St...
- Publication number 20240321664
- Publication date Sep 26, 2024
- JCET STATS ChipPAC Korea Limited
- YeJin PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITOR INTERCONNECT FOR HIGH-QUALITY...
- Publication number 20240321724
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Doosoub SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRACKER MODULE, RADIO FREQUENCY SYSTEM, AND COMMUNICATION DEVICE
- Publication number 20240313714
- Publication date Sep 19, 2024
- Murata Manufacturing Co., Ltd.
- Tatsuya BANNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Antenna in Fan-Out Package
- Publication number 20240297432
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yao Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND C...
- Publication number 20240282654
- Publication date Aug 22, 2024
- NXP USA, Inc.
- Elie A. Maalouf
- H01 - BASIC ELECTRIC ELEMENTS

Vertical connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cavity resonator for enhancing radio-frequency performance and meth...

Devices and methods related to radio-frequency filters on silicon-o...

Millimeter-wave antenna chip and terminal device

Semiconductor device

Substrate, electronic device, and method for manufacturing substrate

Semiconductor device package

Electronic device and multi-level interposer with RF sloped via and...

Die to die high-speed communication without discrete amplifiers bet...

Antenna with graded dielectirc and method of making the same

3D semiconductor device and structure with logic circuits and memor...

Semiconductor device, having via wiring, method of manufacturing se...

RF amplifier devices including top side contacts and methods of man...

Transistor with integrated passive components

Microwave integrated circuit

Platforms including microelectronic packages therein coupled to a c...

Semiconductor package and antenna module comprising the same

Power amplifier modules including semiconductor resistor and tantal...

Radio frequency module and communication apparatus

Electronic apparatus including antennas and directors

Package structure and antenna device using the same

Lateral escape using triangular structure of transceivers

Gallium nitride integrated circuits including non-gold-based metall...

Integrated structures with antenna elements and IC chips employing...

Microelectronics package assemblies and processes for making

Selective etching process for SiGe and doped epitaxial silicon

Semiconductor device packages and methods of manufacturing the same

Packaged module with ball grid array and grounding pins for signal...

Electronic package and antenna structure thereof

Components for millimeter-wave communication

High density interconnection and wiring layers, package structures,...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

ANTENNA DIODE INTEGRATION WITH BACKSIDE BACK END OF THE LINE NETWORK

Contact Structures for Dual-Thickness Active Area SOI FETS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE

SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY

ANTENNA DEVICE

WAFFLE-SHAPED RADIO FREQUENCY (RF) SWITCH

RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

RF MODULE

POWER AMPLIFIER SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE WITH TRANSMISSION LINE AND METHOD FOR MANUFACTURI...

CHIP, CHIP PREPARATION METHOD, RADIO FREQUENCY POWER AMPLIFIER, AND...

FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT

Lateral escape using triangular structure of transceivers

CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METH...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND IMAGE CAPTURING...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

Millimeter-Wave Passive Circuit Designs with Wafer-Level Chip-Scale...

SEMICONDUCTOR PACKAGING DEVICE AND MANUFACTURING METHOD FOR SEMICON...

METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...

TRANSISTOR WITH SOURCE MANIFOLD IN NON-ACTIVE DIE REGION

Semiconductor Device and Method of Forming an Antenna-in-Package St...

METAL-INSULATOR-METAL (MIM) CAPACITOR INTERCONNECT FOR HIGH-QUALITY...

TRACKER MODULE, RADIO FREQUENCY SYSTEM, AND COMMUNICATION DEVICE

Heterogeneous Antenna in Fan-Out Package

AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND C...