TREA

Vertically aligned vias, holes or stacked vias

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  • CPC
  • H05K2201/096
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/096Vertically aligned vias, holes or stacked vias
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRING BOARD
    • Publication number 20250240876
    • Publication date Jul 24, 2025
    • KYOCERA CORPORATION
    • Daichi SHIMIZU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTI-LAMINATION STRUCTURE THAT ELIMINATES MICRO CAVITY RESONANCE
    • Publication number 20250240873
    • Publication date Jul 24, 2025
    • Cisco Technology, Inc.
    • Wenbin Ma
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    OPTICAL TRANSCEIVER EQUIPPED WITH GROUND VIA
    • Publication number 20250220804
    • Publication date Jul 3, 2025
    • Prime World International Holdings Ltd.
    • Chao-Hung TSAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250220810
    • Publication date Jul 3, 2025
    • LG Innotek Co., Ltd.
    • Han Sang KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD
    • Publication number 20250212324
    • Publication date Jun 26, 2025
    • TOPPAN Holdings Inc.
    • Tomoyuki Ishii
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE PRINTED CIRCUIT, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DE...
    • Publication number 20250212330
    • Publication date Jun 26, 2025
    • Huawei Technologies Co., Ltd
    • Tong Zhang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250212335
    • Publication date Jun 26, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Tae Kyung LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250212336
    • Publication date Jun 26, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Ki Ran PARK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
    • Publication number 20250203761
    • Publication date Jun 19, 2025
    • LG Innotek Co., Ltd.
    • Duck Hoon PARK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250203774
    • Publication date Jun 19, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Deok Hong Jo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20250203766
    • Publication date Jun 19, 2025
    • IBIDEN CO., LTD.
    • Jun SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD, ELECTRONIC MODULE, ELECTRONIC EQUIPMENT AND V...
    • Publication number 20250194012
    • Publication date Jun 12, 2025
    • Canon Kabushiki Kaisha
    • SHOJI MATSUMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20250194010
    • Publication date Jun 12, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Jun Ki Min
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250193994
    • Publication date Jun 12, 2025
    • LG Innotek Co., Ltd.
    • Won Suk JUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20250194008
    • Publication date Jun 12, 2025
    • KYOCERA CORPORATION
    • Tomoya NAGASE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250183186
    • Publication date Jun 5, 2025
    • Samsung Electronics Co., Ltd.
    • Sungoh Ahn
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD
    • Publication number 20250185157
    • Publication date Jun 5, 2025
    • KYOCERA CORPORATION
    • Suguru KADOWAKI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RIGID-FLEXIBLE PCB, POWER MODULE INCLUDING THE PCB, AND MANUFACTURI...
    • Publication number 20250176113
    • Publication date May 29, 2025
    • STMicroelectronics International N.V.
    • Luciano ZIZZA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250176099
    • Publication date May 29, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Tae Hong MIN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC COMPONENT MOUNTING SUBSTRATE
    • Publication number 20250168972
    • Publication date May 22, 2025
    • IBIDEN CO., LTD.
    • Haruhiko MORITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME
    • Publication number 20250168981
    • Publication date May 22, 2025
    • InnoLux Corporation
    • Cheng-Chi WANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20250151195
    • Publication date May 8, 2025
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20250142724
    • Publication date May 1, 2025
    • KYOCERA CORPORATION
    • Toshifumi HIGASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Stamping Surface Profile in Design Layer and Filling an Indentation...
    • Publication number 20250142736
    • Publication date May 1, 2025
    • AT&S Austria Technologie & Systemtechnik AG
    • Heinrich TRISCHLER
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Component Carrier With Embedded Electronic Switch Components and a...
    • Publication number 20250142713
    • Publication date May 1, 2025
    • AT&S Austria Technologie & Systemtechnik AG
    • Gerald WEIS
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE CIRCUIT BOARD AND PAD CONNECTING SYSTEM
    • Publication number 20250142725
    • Publication date May 1, 2025
    • SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
    • Huali ZHOU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250132224
    • Publication date Apr 24, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Jung Chul GONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD ASSEMBLY
    • Publication number 20250133652
    • Publication date Apr 24, 2025
    • Cisco Technology, Inc.
    • Yuqing Zhu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250126718
    • Publication date Apr 17, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Jae Ho Shin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20250126712
    • Publication date Apr 17, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Young Kuk Ko
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR