Vertically aligned vias, holes or stacked vias

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CPC
H05K2201/096

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/096Vertically aligned vias, holes or stacked vias

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device including stacked printed circuit boards
- Patent number 12,156,326
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Seungbo Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and configuration for stacking multiple printed circuit boards
- Patent number 12,156,333
- Issue date Nov 26, 2024
- Mellanox Technologies, Ltd.
- Xiuzhuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and procedure for miniaturing a multi-layer PCB
- Patent number 12,150,237
- Issue date Nov 19, 2024
- VEEA INC.
- Robert Migliorino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,133,329
- Issue date Oct 29, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Su Min Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit board and method for producing circuit board
- Patent number 12,133,328
- Issue date Oct 29, 2024
- Murata Manufacturing Co., Ltd.
- Tomoki Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 12,133,330
- Issue date Oct 29, 2024
- Shinko Electric Industries Co., Ltd.
- Akihiro Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-flex component carrier with dielectric material surrounding an...
- Patent number 12,127,338
- Issue date Oct 22, 2024
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protection of electronics in negative pressure wound therapy systems
- Patent number 12,127,333
- Issue date Oct 22, 2024
- Smith & Nephew PLC
- Ben Alan Askem
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Printed circuit board and printed circuit board package
- Patent number 12,108,535
- Issue date Oct 1, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kwang Yun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid flexible printed circuit board and electronic device includin...
- Patent number 12,101,874
- Issue date Sep 24, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 12,101,894
- Issue date Sep 24, 2024
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,101,878
- Issue date Sep 24, 2024
- LG Innotek Co., Ltd
- Dong Hwa Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor memory system
- Patent number 12,094,866
- Issue date Sep 17, 2024
- Kioxia Corporation
- Hayato Masubuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Trans-vacuum printed flexible wiring apparatus
- Patent number 12,096,551
- Issue date Sep 17, 2024
- EQUAL 1 LABORATORIES IRELAND LIMITED
- Hans Haenlein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Waveguide launch system for coupling to a waveguide channel through...
- Patent number 12,087,990
- Issue date Sep 10, 2024
- Saab AB
- Sten Gunnarsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board comprising via portions
- Patent number 12,089,329
- Issue date Sep 10, 2024
- LG Innotek Co., Ltd
- Sung Wuk Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-level printed circuit boards and memory modules including the...
- Patent number 12,075,560
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jong-Hyun Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and electronic device including the same
- Patent number 12,069,803
- Issue date Aug 20, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Hong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board
- Patent number 12,063,737
- Issue date Aug 13, 2024
- LG Innotek Co., Ltd
- Hae Sik Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit board
- Patent number 12,048,095
- Issue date Jul 23, 2024
- LG Innotek Co., Ltd
- Min Young Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer board
- Patent number 12,046,838
- Issue date Jul 23, 2024
- Murata Manufacturing Co., Ltd.
- Koji Kamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,010,796
- Issue date Jun 11, 2024
- Ibiden Co., Ltd.
- Yoshinori Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,004,296
- Issue date Jun 4, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jin Uk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,004,292
- Issue date Jun 4, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Man Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resonant-coupled transmission line
- Patent number 12,004,288
- Issue date Jun 4, 2024
- Teradyne, Inc.
- Andrew Westwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,997,788
- Issue date May 28, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for removing undesired metal within vias from p...
- Patent number 11,997,800
- Issue date May 28, 2024
- TTM Technologies, Inc.
- Mace Lehrer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redistribution plate
- Patent number 11,997,789
- Issue date May 28, 2024
- Dominik Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,979,985
- Issue date May 7, 2024
- LG Innotek Co., Ltd
- Won Suk Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CARRIER STRUCTURE
- Publication number 20240407079
- Publication date Dec 5, 2024
- Siliconware Precision Industries Co., Ltd.
- Chien-Sheng CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MEMORY SYSTEM
- Publication number 20240405010
- Publication date Dec 5, 2024
- KIOXIA Corporation
- Hayato MASUBUCHI
- G11 - INFORMATION STORAGE
Information Patent Application
BURIED PATCH ANTENNA FOR LOW COST MMWAVE PHASED ARRAY DESIGN
- Publication number 20240405435
- Publication date Dec 5, 2024
- Jabil Inc.
- Ian Jeffery Timmins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240397619
- Publication date Nov 28, 2024
- LG Innotek Co., Ltd.
- Sung Wuk RYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD DEVICE
- Publication number 20240397621
- Publication date Nov 28, 2024
- Unimicron Technology Corp.
- Chin-Hsun WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE COMPRISING INTERPOSER PRINTED CIRCUIT BOARD
- Publication number 20240397625
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Myungkyoon CHUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY
- Publication number 20240389230
- Publication date Nov 21, 2024
- NVIDIA Corporation
- Mingyi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR, CONNECTOR ASSEMBLY, CONNECTING STRUCTURE, AND CONNECTING...
- Publication number 20240388027
- Publication date Nov 21, 2024
- Japan Aviation Electronics Industry, Limited
- Kenta Ashibu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240389231
- Publication date Nov 21, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thick Film Single Layer Capacitor
- Publication number 20240379649
- Publication date Nov 14, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240365467
- Publication date Oct 31, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF
- Publication number 20240357730
- Publication date Oct 24, 2024
- Harman Becker Automotive Systems GmbH
- Paul-Alexandru BILIGA-NISIPEANU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240341034
- Publication date Oct 10, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240341033
- Publication date Oct 10, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SUPPLY UNIT OF AEROSOL GENERATING DEVICE
- Publication number 20240324104
- Publication date Sep 26, 2024
- Japan Tobacco Inc.
- Keiji MARUBASHI
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Application
SUBSTRATE AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321711
- Publication date Sep 26, 2024
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME
- Publication number 20240324094
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Okgyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional (3D) Copper in Printed Circuit Boards
- Publication number 20240306297
- Publication date Sep 12, 2024
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPLIT PAD WITH TEST LINE
- Publication number 20240304503
- Publication date Sep 12, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240298413
- Publication date Sep 5, 2024
- Nan Ya Printed Circuit Board Corporation
- Cheng-An WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATCHING CIRCUIT BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20240292520
- Publication date Aug 29, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER BOARD
- Publication number 20240292535
- Publication date Aug 29, 2024
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240276643
- Publication date Aug 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DECOUPLING CAPACITOR BOOSTER MODULE
- Publication number 20240260193
- Publication date Aug 1, 2024
- Intel Corporation
- Herh Nan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION
- Publication number 20240260188
- Publication date Aug 1, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Brian Mark Hostetler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240260189
- Publication date Aug 1, 2024
- LG Innotek Co., Ltd.
- Won Suk JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD FOR A POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR...
- Publication number 20240260168
- Publication date Aug 1, 2024
- VITESCO TECHNOLOGIES GMBH
- Detlev Bagung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR SURFACE MOUNT CONNECTIONS
- Publication number 20240243496
- Publication date Jul 18, 2024
- CIENA CORPORATION
- Russell Mays
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA...
- Publication number 20240237208
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- REMI PERRIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME
- Publication number 20240237189
- Publication date Jul 11, 2024
- Meiko Electronics Co., Ltd.
- Tohru MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Vertically aligned vias, holes or stacked vias

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device including stacked printed circuit boards

Method and configuration for stacking multiple printed circuit boards

Method and procedure for miniaturing a multi-layer PCB

Printed circuit board and method for manufacturing the same

Hermetic metallized via with improved reliability

Circuit board and method for producing circuit board

Wiring substrate and semiconductor device

Semi-flex component carrier with dielectric material surrounding an...

Protection of electronics in negative pressure wound therapy systems

Printed circuit board and printed circuit board package

Rigid flexible printed circuit board and electronic device includin...

Wiring board

Circuit board

Semiconductor memory system

Trans-vacuum printed flexible wiring apparatus

Waveguide launch system for coupling to a waveguide channel through...

Printed circuit board comprising via portions

Multi-level printed circuit boards and memory modules including the...

Interposer and electronic device including the same

Circuit board

Circuit board

Multilayer board

Wiring substrate and method for manufacturing wiring substrate

Printed circuit board

Printed circuit board

Resonant-coupled transmission line

Printed circuit board and method of manufacturing the same

Systems and methods for removing undesired metal within vias from p...

Redistribution plate

Printed circuit board

Patents Applicationslast 30 patents

CARRIER STRUCTURE

SEMICONDUCTOR MEMORY SYSTEM

BURIED PATCH ANTENNA FOR LOW COST MMWAVE PHASED ARRAY DESIGN

PRINTED CIRCUIT BOARD

CIRCUIT BOARD DEVICE

ELECTRONIC DEVICE COMPRISING INTERPOSER PRINTED CIRCUIT BOARD

BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY

CONNECTOR, CONNECTOR ASSEMBLY, CONNECTING STRUCTURE, AND CONNECTING...

PRINTED WIRING BOARD

Thick Film Single Layer Capacitor

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF

WIRING SUBSTRATE

WIRING SUBSTRATE

POWER SUPPLY UNIT OF AEROSOL GENERATING DEVICE

SUBSTRATE AND A METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME

Three-Dimensional (3D) Copper in Printed Circuit Boards

SPLIT PAD WITH TEST LINE

CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME

MATCHING CIRCUIT BOARD AND SEMICONDUCTOR DEVICE

MULTILAYER BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

DECOUPLING CAPACITOR BOOSTER MODULE

VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION

PRINTED CIRCUIT BOARD

CIRCUIT BOARD FOR A POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR...

METHOD AND APPARATUS FOR SURFACE MOUNT CONNECTIONS

THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA...

DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME