Vertically aligned vias, holes or stacked vias

Industry

CPC
H05K2201/096

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/096Vertically aligned vias, holes or stacked vias

Industries

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 11,979,985
- Issue date May 7, 2024
- LG Innotek Co., Ltd
- Won Suk Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,963,311
- Issue date Apr 16, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Woong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D) copper in printed circuit boards
- Patent number 11,956,898
- Issue date Apr 9, 2024
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wideband routing techniques for PCB layout
- Patent number 11,937,373
- Issue date Mar 19, 2024
- Hewlett Packard Enterprise Development LP
- Melvin K. Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board preparation method
- Patent number 11,937,377
- Issue date Mar 19, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure and manufacturing method thereof, electronic de...
- Patent number 11,917,758
- Issue date Feb 27, 2024
- PANELSEMI CORPORATION
- Ya-Che Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate integrated waveguide (SIW) including fences with wall str...
- Patent number 11,909,089
- Issue date Feb 20, 2024
- VAYYAR IMAGING LTD.
- Naftali Chayat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-interference circuit board and terminal
- Patent number 11,903,122
- Issue date Feb 13, 2024
- Huawei Technologies Co., Ltd.
- Dong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering printed circuits using radiant heat
- Patent number 11,903,143
- Issue date Feb 13, 2024
- Microsoft Technology Licensing, LLC
- David Christopher Perna
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 11,903,128
- Issue date Feb 13, 2024
- Ibiden Co., Ltd.
- Shigeto Iyoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,895,771
- Issue date Feb 6, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jin Uk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques for high-speed signal layer transition
- Patent number 11,889,617
- Issue date Jan 30, 2024
- BAIDU USA LLC
- Zhenwei Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,882,656
- Issue date Jan 23, 2024
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate
- Patent number 11,871,513
- Issue date Jan 9, 2024
- Murata Manufacturing Co., Ltd.
- Masao Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated metallization structures
- Patent number 11,862,518
- Issue date Jan 2, 2024
- Analog Devices International Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composite wiring board, package, and electronic device
- Patent number 11,849,538
- Issue date Dec 19, 2023
- NGK Electronics Devices, Inc.
- Noboru Kubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic substrate
- Patent number 11,844,174
- Issue date Dec 12, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shinkuro Fujino
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wiring board
- Patent number 11,832,388
- Issue date Nov 28, 2023
- Shinko Electric Industries Co., Ltd.
- Masahiro Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 11,818,833
- Issue date Nov 14, 2023
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light sensing module and display apparatus
- Patent number 11,815,391
- Issue date Nov 14, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Jiahua Wang
- G01 - MEASURING TESTING
Information Patent Grant
High-frequency circuit
- Patent number 11,812,546
- Issue date Nov 7, 2023
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,805,595
- Issue date Oct 31, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection of electronics in negative pressure wound therapy systems
- Patent number 11,800,638
- Issue date Oct 24, 2023
- Smith & Nephew PLC
- Ben Alan Askem
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,792,916
- Issue date Oct 17, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Han Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in wiring substrate
- Patent number 11,792,937
- Issue date Oct 17, 2023
- Ibiden Co., Ltd.
- Takahiro Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier having dielectric layer with conductively filled...
- Patent number 11,784,115
- Issue date Oct 10, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Roland Wilfing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 11,785,720
- Issue date Oct 10, 2023
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240155771
- Publication date May 9, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240155776
- Publication date May 9, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240147634
- Publication date May 2, 2024
- Samsung Electro-Mechanics Co., Ltd.
- In Gun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME
- Publication number 20240138053
- Publication date Apr 25, 2024
- Meiko Electronics Co., Ltd.
- Tohru MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CONNECTING STRUCTURE
- Publication number 20240128665
- Publication date Apr 18, 2024
- Min Di Consultants Ltd.
- Chi-Di LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD
- Publication number 20240121897
- Publication date Apr 11, 2024
- NXP B.V.
- Abdellatif Zanati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL PROCESSING BOARD AND IMAGE FORMING APPARATUS
- Publication number 20240107661
- Publication date Mar 28, 2024
- KYOCERA DOCUMENT SOLUTIONS INC.
- Shotaro Ikegami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240107668
- Publication date Mar 28, 2024
- LG Innotek Co., Ltd.
- Jinhak LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240098896
- Publication date Mar 21, 2024
- PanelSemi Corporation
- Chin-Tang LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240098897
- Publication date Mar 21, 2024
- IBIDEN CO., LTD.
- Yoshio MIZUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTION OF ELECTRONICS IN NEGATIVE PRESSURE WOUND THERAPY SYSTEMS
- Publication number 20240080969
- Publication date Mar 7, 2024
- Smith & Nephew PLC
- Ben Alan Askem
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT
- Publication number 20240080994
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Gun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BASE AND ELECTRONIC DEVICE
- Publication number 20240074035
- Publication date Feb 29, 2024
- KYOCERA CORPORATION
- Yoshiki KAWAZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH CONTINUOUS SLOT VIAS
- Publication number 20240074055
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240074049
- Publication date Feb 29, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Tae Kyun Bae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240074057
- Publication date Feb 29, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Man Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...
- Publication number 20240064907
- Publication date Feb 22, 2024
- FICT LIMITED
- Taiji Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE...
- Publication number 20240055744
- Publication date Feb 15, 2024
- Murata Manufacturing Co., Ltd.
- Nobuo IKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS
- Publication number 20240049393
- Publication date Feb 8, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Xiuzhuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION CARRIER, OPTOELECTRONIC DEVICE AND METHOD FOR PRODUCING...
- Publication number 20240049383
- Publication date Feb 8, 2024
- ams-OSRAM International GmbH
- Sebastian WITTMANN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240040698
- Publication date Feb 1, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang Min AHN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, MULTILAYER RESONATOR, AND MULTILAYER FILTER
- Publication number 20240040693
- Publication date Feb 1, 2024
- KYOCERA CORPORATION
- Atsuo KAWAGOE
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
FRONT-END MODULE COMPRISING FRONT-END COMPONENTS AND A SUBSTRATE IN...
- Publication number 20240030575
- Publication date Jan 25, 2024
- ALLEN-VANGUARD CORPORATION
- Sulav ADHIKARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT EMBEDDED SUBSTRATE AND PHOTONIC INTEGRA...
- Publication number 20240032202
- Publication date Jan 25, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Yun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240030580
- Publication date Jan 25, 2024
- Innolux Corporation
- Chen-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20240023232
- Publication date Jan 18, 2024
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240023250
- Publication date Jan 18, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20240014536
- Publication date Jan 11, 2024
- Murata Manufacturing Co., Ltd.
- Hironobu TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240008191
- Publication date Jan 4, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240008178
- Publication date Jan 4, 2024
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Vertically aligned vias, holes or stacked vias

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board

Printed circuit board and method of manufacturing the same

Three-dimensional (3D) copper in printed circuit boards

Mating backplane for high speed, high density electrical connector

Wideband routing techniques for PCB layout

Circuit board preparation method

Substrate structure and manufacturing method thereof, electronic de...

Single-layer circuit board, multi-layer circuit board, and manufact...

Substrate integrated waveguide (SIW) including fences with wall str...

Anti-interference circuit board and terminal

Soldering printed circuits using radiant heat

Wiring substrate

Printed circuit board

Techniques for high-speed signal layer transition

Wiring substrate and method for manufacturing wiring substrate

Multilayer wiring substrate

Plated metallization structures

Composite wiring board, package, and electronic device

Electronic substrate

Wiring board

Circuit board structure

Light sensing module and display apparatus

High-frequency circuit

Backplane footprint for high speed, high density electrical connectors

Protection of electronics in negative pressure wound therapy systems

Circuit board structure and method for manufacturing a circuit boar...

Printed circuit board

Component built-in wiring substrate

Component carrier having dielectric layer with conductively filled...

Multilayer ceramic capacitor

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD

DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME

FLEXIBLE CONNECTING STRUCTURE

VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD

SIGNAL PROCESSING BOARD AND IMAGE FORMING APPARATUS

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

WIRING SUBSTRATE

PROTECTION OF ELECTRONICS IN NEGATIVE PRESSURE WOUND THERAPY SYSTEMS

METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT

WIRING BASE AND ELECTRONIC DEVICE

SUBSTRATES WITH CONTINUOUS SLOT VIAS

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE...

METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS

CONNECTION CARRIER, OPTOELECTRONIC DEVICE AND METHOD FOR PRODUCING...

PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD, MULTILAYER RESONATOR, AND MULTILAYER FILTER

FRONT-END MODULE COMPRISING FRONT-END COMPONENTS AND A SUBSTRATE IN...

PHOTONIC INTEGRATED CIRCUIT EMBEDDED SUBSTRATE AND PHOTONIC INTEGRA...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

WIRING SUBSTRATE

MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE

WIRING SUBSTRATE

WIRING CIRCUIT BOARD