TREA

Vertically aligned vias, holes or stacked vias

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Industry

  • CPC
  • H05K2201/096
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/096Vertically aligned vias, holes or stacked vias
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250132224
    • Publication date Apr 24, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Jung Chul GONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD ASSEMBLY
    • Publication number 20250133652
    • Publication date Apr 24, 2025
    • Cisco Technology, Inc.
    • Yuqing Zhu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250126718
    • Publication date Apr 17, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Jae Ho Shin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20250126712
    • Publication date Apr 17, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Young Kuk Ko
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250126715
    • Publication date Apr 17, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Byung Hak KANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    NON-COPLANAR PARALLEL RESISTANCE-REDUCING CIRCUIT STRUCTURE
    • Publication number 20250126706
    • Publication date Apr 17, 2025
    • AAC MICROTECH (CHANGZHOU) CO., LTD.
    • Guohui Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20250120010
    • Publication date Apr 10, 2025
    • Shinko Electric Industries Co., Ltd.
    • Tatsuki Sumi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Contact Hole Assembly and Electronic Device
    • Publication number 20250120017
    • Publication date Apr 10, 2025
    • LG Display Co., Ltd.
    • Hyeon-Sik Cho
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD DEVICE AND ITS CIRCUIT MODULE
    • Publication number 20250113432
    • Publication date Apr 3, 2025
    • Global Unichip Corporation
    • Huan-Yi LIAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
    • Publication number 20250113433
    • Publication date Apr 3, 2025
    • Amphenol Corporation
    • Marc Robert Charbonneau
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD AND SEMICONDUCTOR DEVICE
    • Publication number 20250113438
    • Publication date Apr 3, 2025
    • Shinko Electric Industries Co., Ltd.
    • Tomoyuki SHIMODAIRA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT,...
    • Publication number 20250106998
    • Publication date Mar 27, 2025
    • Canon Kabushiki Kaisha
    • TAKASHI NUMAGI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Source Printed Circuit Board and Display Device
    • Publication number 20250104652
    • Publication date Mar 27, 2025
    • LG Display Co., Ltd.
    • ChulWoo Park
    • G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
  • Information Patent Application

    PACKAGE COMPRISING A SUBSTRATE WITH AN INTERCONNECT BLOCK
    • Publication number 20250098066
    • Publication date Mar 20, 2025
    • QUALCOMM Incorporated
    • Hong Bok WE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER SUBSTRATE
    • Publication number 20250089160
    • Publication date Mar 13, 2025
    • Murata Manufacturing Co., Ltd.
    • Tomoki YAMAMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250089172
    • Publication date Mar 13, 2025
    • LG Innotek Co., Ltd.
    • Eom Ji KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20250089167
    • Publication date Mar 13, 2025
    • IBIDEN CO., LTD.
    • Shunsuke SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20250081338
    • Publication date Mar 6, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Ho JEONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20250081358
    • Publication date Mar 6, 2025
    • Shinko Electric Industries Co., Ltd.
    • Takashi NISHIYAMA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250081337
    • Publication date Mar 6, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Young Kuk KO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250071897
    • Publication date Feb 27, 2025
    • LG Innotek Co., Ltd.
    • Dong Hun JOUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250071898
    • Publication date Feb 27, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Eun LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTILAYER SUBSTRATE AND JIG
    • Publication number 20250063660
    • Publication date Feb 20, 2025
    • NIDEC ADVANCE TECHNOLOGY CORPORATION
    • Shigeki SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    REUSABLE MODULAR SUBSTRATE
    • Publication number 20250063657
    • Publication date Feb 20, 2025
    • NXP USA, Inc.
    • Kabir Mirpuri
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MANUFACTURING METHOD OF CIRCUIT BOARD
    • Publication number 20250056712
    • Publication date Feb 13, 2025
    • Unimicron Technology Corp.
    • Jun-Rui Huang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20250056718
    • Publication date Feb 13, 2025
    • IBIDEN CO., LTD.
    • Atsushi ISHIDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250048557
    • Publication date Feb 6, 2025
    • LG Innotek Co., Ltd.
    • Soo Min LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER BOARD, MULTILAYER BOARD MODULE, AND ELECTRONIC DEVICE
    • Publication number 20250048533
    • Publication date Feb 6, 2025
    • Murata Manufacturing Co., Ltd.
    • Nobuo IKEMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20250048562
    • Publication date Feb 6, 2025
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD WITH REDUCED VIA STRIPING
    • Publication number 20250040045
    • Publication date Jan 30, 2025
    • Dell Products L.P.
    • Sandor FARKAS
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR