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Via connections through the substrates
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last 30 patents
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Patent Grant
Stacked via structure
Patent number
11,973,023
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer
Patent number
11,973,013
Issue date
Apr 30, 2024
AMOSENSE CO., LTD.
Changwoo Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
Patent number
11,972,995
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Dahee Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices and methods of vertical integrations of semiconductor chips...
Patent number
11,973,029
Issue date
Apr 30, 2024
Suzhou Qing Xin Fang Electronics Technology Co., Ltd.
Jerry Zhijun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density pillar interconnect conversion with stack to substrate...
Patent number
11,973,062
Issue date
Apr 30, 2024
Micron Technology, Inc.
Owen R. Fay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silica-containing substrates with vias having an axially variable s...
Patent number
11,972,993
Issue date
Apr 30, 2024
Corning Incorporated
Rachel Eileen Dahlberg
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Packaging substrate, and semiconductor device comprising same
Patent number
11,967,542
Issue date
Apr 23, 2024
ABSOLICS INC.
Sungjin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Assembly including plural through wafer vias, method of cooling the...
Patent number
11,967,548
Issue date
Apr 23, 2024
International Business Machines Corporation
Kerry Bernstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated semiconductor device and method for manufacturing the same
Patent number
11,967,519
Issue date
Apr 23, 2024
INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
Kai Cao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,961,742
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3DIC packaging with hot spot thermal management features
Patent number
11,961,779
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a molded substrate electronic package and structure
Patent number
11,961,794
Issue date
Apr 16, 2024
Amikor Technology Singapore Holding Pte. Ltd.
Won Bae Bang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and fabricating method thereof
Patent number
11,961,797
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Keun Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device package and fabricating method thereof
Patent number
11,961,867
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jin Young Kim
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Chip socket, testing fixture and chip testing method thereof
Patent number
11,959,939
Issue date
Apr 16, 2024
NANYA TECHNOLOGY CORPORATION
Shih-Ting Lin
G11 - INFORMATION STORAGE
Information
Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
Patent number
11,961,805
Issue date
Apr 16, 2024
Skyworks Solutions, Inc.
Howard E. Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including a redistribution substrate and a me...
Patent number
11,961,793
Issue date
Apr 16, 2024
Samsung Electronics Co., Ltd.
Sang-uk Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,960,127
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device having substrate with electrically floating vias
Patent number
11,955,417
Issue date
Apr 9, 2024
Industrial Technology Research Institute
Tsung-Yi Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,955,399
Issue date
Apr 9, 2024
Samsung Electronics Co., Ltd.
Ae-Nee Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure
Patent number
11,955,401
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Hui Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package stacking using chip to wafer bonding
Patent number
11,955,462
Issue date
Apr 9, 2024
Intel Corporation
Georg Seidemann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method for manufacturing the same
Patent number
11,955,416
Issue date
Apr 9, 2024
Macronix International Co., Ltd.
Cheng-Hsien Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vertically spaced intra-level interconnect line metallization for i...
Patent number
11,948,874
Issue date
Apr 2, 2024
Intel Corporation
Kevin L. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure with through vias
Patent number
11,948,876
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ling-Wei Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-embedded board
Patent number
11,948,849
Issue date
Apr 2, 2024
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Koo Woong Jeong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including high thermal conductivity layer
Patent number
11,948,851
Issue date
Apr 2, 2024
Samsung Electronics Co., Ltd.
Sunjae Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatuses and systems having ball grid arrays and associated micr...
Patent number
11,942,404
Issue date
Mar 26, 2024
Micron Technology, Inc.
Matthew B. Leslie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip packages having bond over active circuit (BOAC)...
Patent number
11,942,407
Issue date
Mar 26, 2024
Texas Instruments Incorporated
Jeffrey Salvacion Solas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
11,942,408
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Shuo-Mao Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC ASSEMBLY WITH POWER MODULE INTERPOSER AND METHODS OF FOR...
Publication number
20240145368
Publication date
May 2, 2024
Intel Corporation
Jackson Chung Peng KONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-MOLD VIA
Publication number
20240145346
Publication date
May 2, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Dong Joo PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20240145366
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Dongjoon Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RF AMPLIFIERS WITH IMPROVED STABILITY BY SOURCE INDUCTANCE ADJUSTMENT
Publication number
20240145414
Publication date
May 2, 2024
Wolfspeed, Inc.
Gerard Bouisse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND ELECTRONIC APPARATUS
Publication number
20240145415
Publication date
May 2, 2024
PanelSemi Corporation
HSIEN-TE CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20240136255
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Bongwee YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITE COMPONENT
Publication number
20240136268
Publication date
Apr 25, 2024
Murata Manufacturing Co., Ltd.
Yoshiaki SATAKE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240136267
Publication date
Apr 25, 2024
LG Innotek Co., Ltd.
Hyun Sun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE
Publication number
20240136269
Publication date
Apr 25, 2024
Intel Corporation
Bok Eng CHEAH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240136251
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Jung Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...
Publication number
20240136326
Publication date
Apr 25, 2024
Intel Corporation
Wei LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20240128178
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Hung LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES
Publication number
20240128255
Publication date
Apr 18, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE WITH SELF SHIELDING
Publication number
20240121884
Publication date
Apr 11, 2024
Avago Technologies International Sales Pte. Limited
Hongya Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STIFFENER PACKAGE AND METHOD OF FABRICATING STIFFENER PACKAGE
Publication number
20240120211
Publication date
Apr 11, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Jin Young Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE
Publication number
20240120281
Publication date
Apr 11, 2024
Ping-Jung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTONICALLY STEERED IMPEDANCE SURFACE ANTENNAS
Publication number
20240120651
Publication date
Apr 11, 2024
Intel Corporation
Zhen Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE
Publication number
20240114623
Publication date
Apr 4, 2024
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION
Publication number
20240113048
Publication date
Apr 4, 2024
Intel Corporation
Srinivasan Raman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES WITH ANTENNAS
Publication number
20240113052
Publication date
Apr 4, 2024
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS
Publication number
20240112973
Publication date
Apr 4, 2024
Intel Corporation
Jeremy D. Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240113003
Publication date
Apr 4, 2024
Samsung Electronics Co., Ltd.
Yun Seok CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BO...
Publication number
20240113000
Publication date
Apr 4, 2024
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS
Publication number
20240113046
Publication date
Apr 4, 2024
Intel Corporation
Jason Scott Steill
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION
Publication number
20240105572
Publication date
Mar 28, 2024
Intel Corporation
Zhiguo Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Forming a Semiconductor Device Having TSV Formed Through...
Publication number
20240105632
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Pin Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRANSISTOR PACKAGE AND PROCESS OF IMPLEMENTING THE TRANSISTOR PACKAGE
Publication number
20240105570
Publication date
Mar 28, 2024
WOLFSPEED, INC.
Eng Wah WOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUD...
Publication number
20240105680
Publication date
Mar 28, 2024
Samsung Electronics Co., Ltd.
Junyoung Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH...
Publication number
20240105571
Publication date
Mar 28, 2024
Intel Corporation
Brandon C. MARIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MAKING AN ELECTRONIC PACKAGE
Publication number
20240105538
Publication date
Mar 28, 2024
JCET STATS ChipPAC Korea Limited
SangHo SONG
H01 - BASIC ELECTRIC ELEMENTS