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Method and device for providing through-openings in a substrate and...
Patent number
12,365,051
Issue date
Jul 22, 2025
LPKF LASER & ELECTRONICS SE
Robin Alexander Krueger
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Structures for providing electrical isolation in semiconductor devices
Patent number
12,368,139
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company Limited
Chan-Hong Chern
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package and manufacturing method thereof
Patent number
12,368,116
Issue date
Jul 22, 2025
Siliconware Precision Industries Co., Ltd.
Feng Kao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of manufacturing semiconductor device including passivation...
Patent number
12,368,090
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor packages with antennas
Patent number
12,362,297
Issue date
Jul 15, 2025
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
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Method for manufacturing semiconductor device, semiconductor device...
Patent number
12,362,248
Issue date
Jul 15, 2025
Goki Toshima
H01 - BASIC ELECTRIC ELEMENTS
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Electronic package and method of fabricating the same
Patent number
12,362,263
Issue date
Jul 15, 2025
Siliconware Precision Industries Co., Ltd.
Pin-Jing Su
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for fabricating a chip package
Patent number
12,362,178
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
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Apparatus including direct-contact heat paths and methods of manufa...
Patent number
12,362,255
Issue date
Jul 15, 2025
Micron Technology, Inc.
Kelvin Tan Aik Boo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Planar magnetic radial inductors to enable VR disaggregation
Patent number
12,362,295
Issue date
Jul 15, 2025
Intel Corporation
Kaladhar Radhakrishnan
H01 - BASIC ELECTRIC ELEMENTS
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Interposer including stepped surfaces and methods of forming the same
Patent number
12,362,246
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company Limited
Yu-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
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Component-incorporated substrate and method for manufacturing same
Patent number
12,356,556
Issue date
Jul 8, 2025
Fujikura Ltd.
Masahiro Okamoto
H01 - BASIC ELECTRIC ELEMENTS
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Integrated device and integrated passive device comprising magnetic...
Patent number
12,354,948
Issue date
Jul 8, 2025
QUALCOMM Incorporated
Kai Liu
H01 - BASIC ELECTRIC ELEMENTS
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Integrated circuit package and method
Patent number
12,354,924
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chien-Hsun Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Standard cell layout for better routability
Patent number
12,354,962
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Company Limited
Tigran Zohrabyan
G06 - COMPUTING CALCULATING COUNTING
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Reconstituted substrate structure and fabrication methods for heter...
Patent number
12,354,968
Issue date
Jul 8, 2025
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
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Method for making a packaging substrate
Patent number
12,354,884
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Company Limited
Kuo-Ching Hsu
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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Electronic package, electronic structure and manufacturing method t...
Patent number
12,354,885
Issue date
Jul 8, 2025
Siliconware Precision Industries Co., Ltd.
Yi-Ling Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated circuit package with decoupling capacitors
Patent number
12,347,816
Issue date
Jul 1, 2025
NVIDIA Corporation
Naly Guo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor apparatus with an alignment moat
Patent number
12,347,713
Issue date
Jul 1, 2025
Micron Technology, Inc.
Andrew D. Carswell
H01 - BASIC ELECTRIC ELEMENTS
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Magnetic planar spiral and high aspect ratio inductors for power de...
Patent number
12,347,761
Issue date
Jul 1, 2025
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
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Method and apparatus for through interposer die level interconnect...
Patent number
12,347,762
Issue date
Jul 1, 2025
Rockwell Collin Inc.
Reginald D. Bean
H01 - BASIC ELECTRIC ELEMENTS
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Packaging of three-dimensional integrated circuit by encapsulation...
Patent number
12,347,763
Issue date
Jul 1, 2025
Rockley Photonics Limited
Seungjae Lee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated circuit having vertical routing to bond pads
Patent number
12,349,475
Issue date
Jul 1, 2025
Raytheon Company
Eric Miller
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Glass substrates having signal shielding for use with semiconductor...
Patent number
12,347,788
Issue date
Jul 1, 2025
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor circuit structure with direct die heat removal structure
Patent number
12,341,077
Issue date
Jun 24, 2025
INVENTION AND COLLABORATION LABORATORY, INC.
Chao-Chun Lu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
12,341,081
Issue date
Jun 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chung-Jung Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and semiconductor device
Patent number
12,341,087
Issue date
Jun 24, 2025
Kioxia Corporation
Takuya Okishima
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Manufacturing method of semiconductor package
Patent number
12,341,072
Issue date
Jun 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Hao Tseng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor circuit structure with direct die heat removal structure
Patent number
12,341,076
Issue date
Jun 24, 2025
INVENTION AND COLLABORATION LABORATORY, INC.
Chao-Chun Lu
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
HIGH CAPACITY HIGH BANDWIDTH NON-VOLATILE MEMORY DEVICE
Publication number
20250239510
Publication date
Jul 24, 2025
SANDISK TECHNOLOGIES, INC.
Nagesh Vodrahalli
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20250239511
Publication date
Jul 24, 2025
Unimicron Technology Corp.
Chin-Sheng Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20250239449
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Kun-Yen Liao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
DISTANCE MEASURING DEVICE
Publication number
20250237763
Publication date
Jul 24, 2025
Sony Semiconductor Solutions Corporation
Yoshiki EBIKO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
OPTICAL CONTROLLER PACKAGE AND OPTOELECTRONIC MEMORY MODULE INCLUDI...
Publication number
20250239576
Publication date
Jul 24, 2025
Samsung Electronics Co., Ltd.
Hyunsoo Chung
G02 - OPTICS
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Patent Application
Interposer
Publication number
20250233062
Publication date
Jul 17, 2025
TE Connecitivity Japan G. K.
Shinichi Hashimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages and Methods of Forming Same
Publication number
20250233115
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND TEST METHOD OF THE SAME
Publication number
20250233029
Publication date
Jul 17, 2025
Samsung Electronics Co., Ltd.
Jungwoo JANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH GLASS SUBSTRATE AND PACKAGING...
Publication number
20250233060
Publication date
Jul 17, 2025
Yangtze Memory Technologies Co., Ltd.
Xinru Zeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20250233112
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
HsiaoYun Lo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR EMBEDDING ELECTRONIC COMPONENTS IN SUBSTRATES
Publication number
20250233087
Publication date
Jul 17, 2025
ADVANCED MICRO DEVICES, INC.
Arsalan Alam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT WITH A PROTECTIVE LAYER
Publication number
20250233036
Publication date
Jul 17, 2025
TEXAS INSTRUMENTS INCORPORATED
GUANGXU LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY DEVICE WITH ENHANCED THERMAL CONDUCTIVITY
Publication number
20250233044
Publication date
Jul 17, 2025
Micron Technology, Inc.
Eiichi Nakano
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Interposer
Publication number
20250233061
Publication date
Jul 17, 2025
TE Connectivity Japan G.K.
Shinichi Hashimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CAPACITOR SHEET, INTERPOSER, AND SEMICONDUCTOR ELEMENT
Publication number
20250233064
Publication date
Jul 17, 2025
MURATA MANUFACTURING CO., LTD.
Tomoyuki ASHIMINE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20250233119
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20250226306
Publication date
Jul 10, 2025
Innolux Corporation
Chia-Ping Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTROLYTIC INDIUM-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMBEDDED...
Publication number
20250219002
Publication date
Jul 3, 2025
Intel Corporation
Shruti Sharma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENVIRONMENTAL SEALING FOR ELECTRONICS CHIP PACKAGE SOCKETS
Publication number
20250218909
Publication date
Jul 3, 2025
Intel Corporation
Donald Tiendung TRAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20250218918
Publication date
Jul 3, 2025
RENESAS ELECTRONICS CORPORATION
Ryuichi OIKAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LDMOS EDGE TERMINATION FOR IMPROVED SAFE OPERATING AREA
Publication number
20250220953
Publication date
Jul 3, 2025
TEXAS INSTRUMENTS INCORPORATED
Jingjing Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLOW ENHANCED DUMMY STRUCTURE TO ENABLE CAPILLARY FLOW BASED SIDEWA...
Publication number
20250220818
Publication date
Jul 3, 2025
Intel Corporation
Bohan SHAN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
WIRING SUBSTRATE
Publication number
20250216614
Publication date
Jul 3, 2025
IBIDEN CO., LTD.
Masatoshi KUNIEDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Technologies for Components Embedded in a Substrate Core
Publication number
20250219040
Publication date
Jul 3, 2025
Intel Corporation
Tolga ACIKALIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20250218772
Publication date
Jul 3, 2025
Taiwan Semiconductor Manufacturing company Ltd.
JOHNNY CHIAHAO LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE WITHIN A HOLE IN A SUBSTRATE CORE ATTACHED TO METAL FEATURES OV...
Publication number
20250218678
Publication date
Jul 3, 2025
Intel Corporation
Hiroki Tanaka
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
COMPONENT EMBEDDED IN MOLD MATERIAL FOR MITIGATING THICKNESS MISMAT...
Publication number
20250220819
Publication date
Jul 3, 2025
Intel Corporation
Pratyasha MOHAPATRA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20250210489
Publication date
Jun 26, 2025
Innolux Corporation
Ker-Yih Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRE-FABRICATED COMPONENT-HYBRIDS FOR EMBEDDING IN A CORE
Publication number
20250210268
Publication date
Jun 26, 2025
Intel Corporation
Srinivasan RAMAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
Publication number
20250210571
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Fang Cheng
H01 - BASIC ELECTRIC ELEMENTS