Voltage regulator [VR]

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CPC
H01L2924/1427

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1427Voltage regulator [VR]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package embedded magnetic inductor structures and manufacturing tec...
- Patent number 12,132,015
- Issue date Oct 29, 2024
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package
- Patent number 12,132,074
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two stage multi-input multi-output regulator
- Patent number 12,074,514
- Issue date Aug 27, 2024
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,996,398
- Issue date May 28, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,967,528
- Issue date Apr 23, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,955,442
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator and passive components
- Patent number 11,894,345
- Issue date Feb 6, 2024
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory
- Patent number 11,869,573
- Issue date Jan 9, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Shuliang Ning
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor devices including power connection lines
- Patent number 11,830,813
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Jisoo Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power distribution for stacked memory
- Patent number 11,804,257
- Issue date Oct 31, 2023
- Micron Technology, Inc.
- Anthony D. Veches
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit package with integrated voltage regulator
- Patent number 11,715,691
- Issue date Aug 1, 2023
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermals for packages with inductors
- Patent number 11,699,630
- Issue date Jul 11, 2023
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core layer with fully encapsulated co-axial magnetic material aroun...
- Patent number 11,696,407
- Issue date Jul 4, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package
- Patent number 11,670,670
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,670,548
- Issue date Jun 6, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip embedded integrated voltage regulator
- Patent number 11,652,062
- Issue date May 16, 2023
- Faraday Semi, Inc.
- Parviz Parto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing semiconductor having double-sided substrate
- Patent number 11,631,627
- Issue date Apr 18, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Switched power stage with integrated passive components
- Patent number 11,605,580
- Issue date Mar 14, 2023
- CHAOYANG SEMICONDUCTOR (SHANGHAI) CO., LTD
- Taner Dosluoglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,594,498
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power distribution for stacked memory
- Patent number 11,532,349
- Issue date Dec 20, 2022
- Micron Technology, Inc.
- Anthony D. Veches
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package including fully integrated voltage regulator circuitry with...
- Patent number 11,527,483
- Issue date Dec 13, 2022
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die integrated with package voltage regulators
- Patent number 11,515,289
- Issue date Nov 29, 2022
- QUALCOMM Incorporated
- Bharani Chava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator and passive components
- Patent number 11,515,291
- Issue date Nov 29, 2022
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,482,516
- Issue date Oct 25, 2022
- Samsung Electronics Co., Ltd.
- Eunseok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dies with integrated voltage regulators
- Patent number 11,417,593
- Issue date Aug 16, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch manufacture of component carriers
- Patent number 11,380,650
- Issue date Jul 5, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded thin-film magnetic inductor design for integrated voltage...
- Patent number 11,373,966
- Issue date Jun 28, 2022
- Huawei Technologies Co., Ltd.
- Tae Hong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package inductor having thermal solution structures
- Patent number 11,335,620
- Issue date May 17, 2022
- Intel Corporation
- Michael J. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,335,767
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED INTEGRATED CIRCUIT, BIDIRECTIONAL DATA TRANSMISSION METHOD...
- Publication number 20250029958
- Publication date Jan 23, 2025
- NUVOTON TECHNOLOGY CORPORATION
- Chih-Hsien YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE EMBEDDED MAGNETIC INDUCTOR STRUCTURES AND MANUFACTURING TEC...
- Publication number 20250022814
- Publication date Jan 16, 2025
- Intel Corporation
- William J. LAMBERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250015033
- Publication date Jan 9, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250015065
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIPLETS WITH BACKSIDE POWER DELIVERY NETWORK
- Publication number 20250006617
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Xu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COOLING HEAT SPREADER WITH PHASE CHANGE MATERIAL INFUSED MESH
- Publication number 20250006588
- Publication date Jan 2, 2025
- Intel Corporation
- Jiun Hann SIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240429213
- Publication date Dec 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Syu-Tang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED STRUCTURE WITH MULTI-HEIGHT COMPONENTS COMPRISING BACK...
- Publication number 20240421017
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWE...
- Publication number 20240387345
- Publication date Nov 21, 2024
- QUALCOMM Incorporated
- Venkatesh Sadineni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE
- Publication number 20240371916
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSED OVERHANG MEMORY ON PACKAGE (MOP) ARCHITECTURE
- Publication number 20240355792
- Publication date Oct 24, 2024
- Intel Corporation
- Poh Boon Khoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE
- Publication number 20240319455
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBS...
- Publication number 20240321759
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED VOLTAGE REGULATOR AND PASSIVE COMPONENTS
- Publication number 20240312957
- Publication date Sep 19, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL CHIP WITH VARIABLE PACKAGING
- Publication number 20240312892
- Publication date Sep 19, 2024
- Meta Platforms Technologies, LLC
- Rajendra D. PENDSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DEFINED COUPLED INDUCTORS WITH EMBEDDED SOLID FERRITE CORE
- Publication number 20240274549
- Publication date Aug 15, 2024
- ADVANCED MICRO DEVICES, INC.
- Alexander Helmut Pfeiffenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20240243012
- Publication date Jul 18, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH CORE EMBEDDED CHIPLET
- Publication number 20240234304
- Publication date Jul 11, 2024
- ADVANCED MICRO DEVICES, INC.
- Deepak Vasant KULKARNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES WITH THERMAL INTERFACE STRUCTURE
- Publication number 20240234243
- Publication date Jul 11, 2024
- Tesla, Inc.
- Aydin Nabovati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240234261
- Publication date Jul 11, 2024
- Fuji Electric Co., Ltd.
- Masaharu Yamaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED C...
- Publication number 20240213235
- Publication date Jun 27, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240203907
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manfacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED TOP SIDE POWER DELIVERY THERMAL TECHNOLOGY
- Publication number 20240186206
- Publication date Jun 6, 2024
- Intel Corporation
- Satish PRATHABAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER DELIVERY NETWORK
- Publication number 20240186248
- Publication date Jun 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem HABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT
- Publication number 20240162192
- Publication date May 16, 2024
- International Business Machines Corporation
- Arvind Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE AND ELECTRONIC APPARATUS
- Publication number 20240128193
- Publication date Apr 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE
- Publication number 20240096775
- Publication date Mar 21, 2024
- Analog Devices, Inc.
- Hien Minh Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSE EMBEDDED POWER STRUCTURE FOR GRAPHICAL PROCESSING UNIT CHIP...
- Publication number 20240096802
- Publication date Mar 21, 2024
- NVIDIA Corporation
- Shawn Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240071952
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH INTEGRATED EMBEDDED OFF-DIE INDUCTORS
- Publication number 20240071958
- Publication date Feb 29, 2024
- Xilinx, Inc.
- Hong SHI
- H01 - BASIC ELECTRIC ELEMENTS

Voltage regulator [VR]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package embedded magnetic inductor structures and manufacturing tec...

Package

Two stage multi-input multi-output regulator

Multi-die fine grain integrated voltage regulation

Semiconductor package and method of manufacturing the same

Structure and method for fabricating a computing system with an int...

Semiconductor package and method

Integrated voltage regulator and passive components

Semiconductor memory

Semiconductor devices including power connection lines

Power distribution for stacked memory

Integrated circuit package with integrated voltage regulator

Thermals for packages with inductors

Core layer with fully encapsulated co-axial magnetic material aroun...

Manufacturing method of package

Structure and method for fabricating a computing system with an int...

Chip embedded integrated voltage regulator

Method of manufacturing semiconductor having double-sided substrate

Switched power stage with integrated passive components

Semiconductor package and method

Power distribution for stacked memory

Package including fully integrated voltage regulator circuitry with...

Stacked die integrated with package voltage regulators

Integrated voltage regulator and passive components

Semiconductor package and method of manufacturing the same

Dies with integrated voltage regulators

Batch manufacture of component carriers

Embedded thin-film magnetic inductor design for integrated voltage...

Package inductor having thermal solution structures

Package structure and method of fabricating the same

Patents Applicationslast 30 patents

PACKAGED INTEGRATED CIRCUIT, BIDIRECTIONAL DATA TRANSMISSION METHOD...

PACKAGE EMBEDDED MAGNETIC INDUCTOR STRUCTURES AND MANUFACTURING TEC...

Multi-Die Fine Grain Integrated Voltage Regulation

SEMICONDUCTOR PACKAGE

EMBEDDED CHIPLETS WITH BACKSIDE POWER DELIVERY NETWORK

PASSIVE COOLING HEAT SPREADER WITH PHASE CHANGE MATERIAL INFUSED MESH

ELECTRONIC DEVICE

FULLY MOLDED STRUCTURE WITH MULTI-HEIGHT COMPONENTS COMPRISING BACK...

CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWE...

PACKAGE

REVERSED OVERHANG MEMORY ON PACKAGE (MOP) ARCHITECTURE

PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE

PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBS...

INTEGRATED VOLTAGE REGULATOR AND PASSIVE COMPONENTS

UNIVERSAL CHIP WITH VARIABLE PACKAGING

SUBSTRATE DEFINED COUPLED INDUCTORS WITH EMBEDDED SOLID FERRITE CORE

Structure and Method for Fabricating a Computing System with an Int...

CHIP PACKAGE WITH CORE EMBEDDED CHIPLET

ELECTRONIC ASSEMBLIES WITH THERMAL INTERFACE STRUCTURE

SEMICONDUCTOR DEVICE

ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED C...

SEMICONDUCTOR PACKAGE AND METHOD

INTEGRATED TOP SIDE POWER DELIVERY THERMAL TECHNOLOGY

BACKSIDE POWER DELIVERY NETWORK

STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT

ELECTRONIC MODULE AND ELECTRONIC APPARATUS

ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE

REVERSE EMBEDDED POWER STRUCTURE FOR GRAPHICAL PROCESSING UNIT CHIP...

INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME

CHIP PACKAGE WITH INTEGRATED EMBEDDED OFF-DIE INDUCTORS