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H01L2223/6611

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/6611Wire connections

Industries

Patents Grantslast 30 patents

Information Patent Grant
Isolator with forward and return paths
- Patent number 12,149,389
- Issue date Nov 19, 2024
- RENESAS ELECTRONICS AMERICA INC.
- Tetsuo Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF amplifier package
- Patent number 12,142,583
- Issue date Nov 12, 2024
- Ampleon Netherlands B.V.
- Josephus Henricus Bartholomeus Van der Zanden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amplifier device
- Patent number 12,119,311
- Issue date Oct 15, 2024
- Sumitomo Electric Device Innovations, Inc.
- Naoyuki Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged RF power device with PCB routing outside protective member
- Patent number 12,100,630
- Issue date Sep 24, 2024
- MACOM Technology Solutions Holdings, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic molded package
- Patent number 12,087,678
- Issue date Sep 10, 2024
- Ampleon Netherlands B.V.
- Frans Meeuwsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doherty amplifier
- Patent number 12,081,174
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Katsuya Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier with decreased RF return current losses
- Patent number 12,009,792
- Issue date Jun 11, 2024
- Ampleon Netherlands B.V.
- Vittorio Cuoco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively shielded radio frequency modules
- Patent number 12,003,025
- Issue date Jun 4, 2024
- Skyworks Solutions, Inc.
- Hoang Mong Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency power transistor and high-frequency power amplifier
- Patent number 11,984,413
- Issue date May 14, 2024
- FERDINAND-BRAUN-INSTITUT GGMBH, LEIBNIZ-INSTITUT FÜR HÖCHSTFREQUENZTECHNIK
- Olof Bengtsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency transmission line with finish plating on conductive...
- Patent number 11,984,423
- Issue date May 14, 2024
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Output-integrated transistor device packages
- Patent number 11,967,936
- Issue date Apr 23, 2024
- MACOM Technology Solutions Holdings, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing loss in stacked quantum devices
- Patent number 11,955,465
- Issue date Apr 9, 2024
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High-frequency module and communication device
- Patent number 11,955,933
- Issue date Apr 9, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi Horita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light receiving module comprising stem and block on an upper surfac...
- Patent number 11,953,375
- Issue date Apr 9, 2024
- Mitsubishi Electric Corporation
- Kazuki Yamaji
- G01 - MEASURING TESTING
Information Patent Grant
Package for a semiconductor device
- Patent number 11,935,848
- Issue date Mar 19, 2024
- Sumitomo Electric Device Innovations, Inc.
- Ikuo Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance element with built-in odd-mode oscillation suppression
- Patent number 11,936,348
- Issue date Mar 19, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Rob Salmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Output-integrated transistor amplifier device packages incorporatin...
- Patent number 11,936,342
- Issue date Mar 19, 2024
- MACOM Technology Solutions Holdings, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal processing board and image forming apparatus
- Patent number 11,930,135
- Issue date Mar 12, 2024
- Kyocera Document Solutions Inc.
- Ken Maruhashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded radio-frequency devices
- Patent number 11,887,939
- Issue date Jan 30, 2024
- Skyworks Solutions, Inc.
- Pietro Natale Alessandro Chyurlia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with isolation and/or protection structures
- Patent number 11,887,945
- Issue date Jan 30, 2024
- Wolfspeed, Inc.
- Lei Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked RF circuit topology using transistor die with through silic...
- Patent number 11,881,464
- Issue date Jan 23, 2024
- Wolfspeed, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,869,867
- Issue date Jan 9, 2024
- Sumitomo Electric Industries, Ltd.
- Taizo Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III nitride-based radio frequency amplifiers having back side...
- Patent number 11,837,559
- Issue date Dec 5, 2023
- Wolfspeed, Inc.
- Michael E. Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency package
- Patent number 11,831,282
- Issue date Nov 28, 2023
- Sumitomo Electric Device Innovations, Inc.
- Tadashi Minami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmitter component, receiver component, transceiver circuit, and...
- Patent number 11,791,536
- Issue date Oct 17, 2023
- Infineon Technologies Austria AG
- Wolfgang Scherr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for a ground wire bonding attachment in MMIC d...
- Patent number 11,784,146
- Issue date Oct 10, 2023
- Scientific Components Corporation
- Fuad Haji Mokhtar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack assembly for radio-frequency applications
- Patent number 11,785,853
- Issue date Oct 10, 2023
- Skyworks Solutions, Inc.
- Hardik Bhupendra Modi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387416
- Publication date Nov 21, 2024
- Sumitomo Electric Industries, Ltd.
- Koji TSUKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...
- Publication number 20240347476
- Publication date Oct 17, 2024
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTROMAGNETIC WAVE DEVICE
- Publication number 20240332226
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Yosuke NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOHERTY POWER AMPLIFIER
- Publication number 20240291437
- Publication date Aug 29, 2024
- Ampleon Netherlands B.V.
- Yang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER
- Publication number 20240282725
- Publication date Aug 22, 2024
- Mitsubishi Electric Corporation
- Yoshinobu SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED RADIO-FREQUENCY DEVICES
- Publication number 20240250040
- Publication date Jul 25, 2024
- Skyworks Solutions, Inc.
- Pietro Natale Alessandro CHYURLIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR WITH FORWARD AND RETURN PATHS
- Publication number 20240243954
- Publication date Jul 18, 2024
- Renesas Electronics America Inc.
- Tetsuo SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20240234355
- Publication date Jul 11, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHIELDING STRUCTURE, MANUFACTURING METHOD, AND COMM...
- Publication number 20240234337
- Publication date Jul 11, 2024
- VANCHIP (TIANJIN) TECHNOLOGY CO., LTD
- Ying YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIER DEVICE WITH MULTI-STAGE AMPLIFIER PACKAGE
- Publication number 20240213927
- Publication date Jun 27, 2024
- NXP USA, Inc.
- Damien Scatamacchia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIER MODULES AND SYSTEMS WITH GROUND TERMINALS ADJACENT TO POW...
- Publication number 20240203912
- Publication date Jun 20, 2024
- NXP USA, Inc.
- Jeffrey Spencer Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULE WITH TRANSISTOR DIES FOR MULTIPLE AMPLIFIER...
- Publication number 20240186212
- Publication date Jun 6, 2024
- NXP USA, Inc.
- Stephen Reza Hiemstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER AND RADIO FREQUENCY MODULE
- Publication number 20240146262
- Publication date May 2, 2024
- Mitsubishi Electric Corporation
- Ko KANAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE INCLUDING INDUCTOR AND SEMICONDUCTOR...
- Publication number 20240120297
- Publication date Apr 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING MODULE
- Publication number 20240113667
- Publication date Apr 4, 2024
- KYOSAN ELECTRIC MFG. CO., LTD.
- Hiroshi Kunitama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO STACK ASSEMBLY
- Publication number 20240114794
- Publication date Apr 4, 2024
- Skyworks Solutions, Inc.
- Hardik Bhupendra MODI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENCY IMPROVEMENTS FOR MULTI-STAGE POWER AMPLIFIERS
- Publication number 20240113669
- Publication date Apr 4, 2024
- MACOM Technology Solutions Holdings, Inc.
- Gerard J.L Bouisse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Push-Pull Amplifying Unit and Doherty Amplifier Comprising the Same
- Publication number 20240106396
- Publication date Mar 28, 2024
- Technische Universiteit Delft
- Mohammad Reza BEIKMIRZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR AMPLIFIER WITH PCB ROUTING AND SURFACE MOUNTED TRANSISTO...
- Publication number 20240106397
- Publication date Mar 28, 2024
- Wolfspeed, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240096824
- Publication date Mar 21, 2024
- Murata Manufacturing Co., Ltd.
- Masao KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL PROCESSING BOARD AND IMAGE FORMING APPARATUS
- Publication number 20240089377
- Publication date Mar 14, 2024
- KYOCERA DOCUMENT SOLUTIONS INC.
- Ken Maruhashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED POWER AMPLIFIER DEVICE
- Publication number 20240071960
- Publication date Feb 29, 2024
- NXP USA, Inc.
- Kevin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED RF CIRCUIT TOPOLOGY USING TRANSISTOR DIE WITH THROUGH SILIC...
- Publication number 20240071962
- Publication date Feb 29, 2024
- Wolfspeed, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER DEVICE HAVING DIES WITH ELONGATED BONDPADS CONNECTE...
- Publication number 20240072740
- Publication date Feb 29, 2024
- NXP USA, Inc.
- Kevin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DIE INCLUDING MATCHING CIRCUIT
- Publication number 20240072732
- Publication date Feb 29, 2024
- Wolfspeed, Inc.
- Donald Farrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged power amplifier device with air cavity over die
- Publication number 20240072739
- Publication date Feb 29, 2024
- NXP USA, Inc.
- Kevin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOHERTY AMPLIFIERS
- Publication number 20240063756
- Publication date Feb 22, 2024
- NXP USA, Inc.
- Qi Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR ADJUSTING PHASE CHARACTERISTICS...
- Publication number 20240014150
- Publication date Jan 11, 2024
- Kabushiki Kaisha Toshiba
- Koji TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH EXPOSED HEAT DISSIPATING SURFACE...
- Publication number 20230421119
- Publication date Dec 28, 2023
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH BACKSIDE MOUNTED DIE AND EXPOSED DIE INTERCONNECTS AN...
- Publication number 20230421117
- Publication date Dec 28, 2023
- Wolfspeed, Inc.
- Michael DeVita
- H01 - BASIC ELECTRIC ELEMENTS

Wire connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Isolator with forward and return paths

RF amplifier package

Power amplifier modules including semiconductor resistor and tantal...

Amplifier device

Packaged RF power device with PCB routing outside protective member

Electronic molded package

Doherty amplifier

Impedance controlled electrical interconnection employing meta-mate...

Power amplifier with decreased RF return current losses

Selectively shielded radio frequency modules

High-frequency power transistor and high-frequency power amplifier

Radio frequency transmission line with finish plating on conductive...

Output-integrated transistor device packages

Devices and methods related to dual-sided radio-frequency package w...

Reducing loss in stacked quantum devices

High-frequency module and communication device

Light receiving module comprising stem and block on an upper surfac...

Package for a semiconductor device

Impedance element with built-in odd-mode oscillation suppression

Output-integrated transistor amplifier device packages incorporatin...

Signal processing board and image forming apparatus

Shielded radio-frequency devices

Semiconductor device with isolation and/or protection structures

Stacked RF circuit topology using transistor die with through silic...

Semiconductor device

Group III nitride-based radio frequency amplifiers having back side...

High frequency package

Transmitter component, receiver component, transceiver circuit, and...

Method and apparatus for a ground wire bonding attachment in MMIC d...

Stack assembly for radio-frequency applications

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...

SEMICONDUCTOR DEVICE AND ELECTROMAGNETIC WAVE DEVICE

DOHERTY POWER AMPLIFIER

POWER AMPLIFIER

SHIELDED RADIO-FREQUENCY DEVICES

ISOLATOR WITH FORWARD AND RETURN PATHS

MODULE

ELECTROMAGNETIC SHIELDING STRUCTURE, MANUFACTURING METHOD, AND COMM...

AMPLIFIER DEVICE WITH MULTI-STAGE AMPLIFIER PACKAGE

AMPLIFIER MODULES AND SYSTEMS WITH GROUND TERMINALS ADJACENT TO POW...

POWER AMPLIFIER MODULE WITH TRANSISTOR DIES FOR MULTIPLE AMPLIFIER...

POWER AMPLIFIER AND RADIO FREQUENCY MODULE

MICROELECTRONIC DEVICE PACKAGE INCLUDING INDUCTOR AND SEMICONDUCTOR...

SWITCHING MODULE

DEVICES AND METHODS RELATED TO STACK ASSEMBLY

EFFICIENCY IMPROVEMENTS FOR MULTI-STAGE POWER AMPLIFIERS

Push-Pull Amplifying Unit and Doherty Amplifier Comprising the Same

TRANSISTOR AMPLIFIER WITH PCB ROUTING AND SURFACE MOUNTED TRANSISTO...

SEMICONDUCTOR DEVICE

SIGNAL PROCESSING BOARD AND IMAGE FORMING APPARATUS

PACKAGED POWER AMPLIFIER DEVICE

STACKED RF CIRCUIT TOPOLOGY USING TRANSISTOR DIE WITH THROUGH SILIC...

POWER AMPLIFIER DEVICE HAVING DIES WITH ELONGATED BONDPADS CONNECTE...

TRANSISTOR DIE INCLUDING MATCHING CIRCUIT

Packaged power amplifier device with air cavity over die

DOHERTY AMPLIFIERS

SEMICONDUCTOR DEVICE AND METHOD FOR ADJUSTING PHASE CHARACTERISTICS...

SEMICONDUCTOR DEVICE PACKAGES WITH EXPOSED HEAT DISSIPATING SURFACE...

PACKAGES WITH BACKSIDE MOUNTED DIE AND EXPOSED DIE INTERCONNECTS AN...