2789258

Information

• Patent Grant
• 2789258

• References
• Source

• Patent Number

  2,789,258

• Date Filed

  Not available

• Date Issued

  Tuesday, April 16, 1957
  68 years ago

• CPC

  • H01L23/3171 - the coating being directly applied to the semiconductor body
  • H01L21/314 - Inorganic layers
  • H01L23/298 - Semiconductor material
  • H01L23/3157 - Partial encapsulation or coating
  • H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
  • Y10S148/043 - Dual dielectric
  • Y10S148/049 - Equivalence and options
  • Y10S148/085 - Isolated-integrated
  • Y10S148/125 - Polycrystalline passivation
  • Y10S438/958 - Passivation layer

• US Classifications

  • 257 - Active solid-state devices
  • 148 - Metal treatment
  • 438 - Semiconductor device manufacturing: process