3025439

Information

• Patent Grant
• 3025439

• References
• Source

• Patent Number

  3,025,439

• Date Filed

  Not available

• Date Issued

  Tuesday, March 13, 1962
  62 years ago

• CPC

  • H01L24/32 - of an individual layer connector
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L24/83 - using a layer connector
  • H01L2224/04026 - Bonding areas specifically adapted for layer connectors
  • H01L2224/32245 - the item being metallic
  • H01L2224/83101 - as prepeg comprising a layer connector
  • H01L2224/8319 - Arrangement of the layer connectors prior to mounting
  • H01L2224/83801 - Soldering or alloying
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/0105 - Tin [Sn]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/014 - Solder alloys
  • H01L2924/10253 - Silicon [Si]
  • H01L2924/12036 - PN diode
  • Y10S148/031 - Diffusion at an edge

• US Classifications

  • 257 - Active solid-state devices
  • 065 - Glass manufacturing
  • 148 - Metal treatment
  • 228 - Metal fusion bonding
  • 438 - Semiconductor device manufacturing: process