3184831

Information

• Patent Grant
• 3184831

• References
• Source

• Patent Number

  3,184,831

• Date Filed

  Not available

• Date Issued

  Tuesday, May 25, 1965
  59 years ago

• CPC

  • H05K3/328 - by welding
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L24/80 - Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01047 - Silver [Ag]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/014 - Solder alloys
  • H01L2924/09701 - Low temperature co-fired ceramic [LTCC]
  • H01L2924/10157 - at the active surface
  • H05K2203/0495 - Cold welding

• US Classifications

  • 228 - Metal fusion bonding
  • 174 - Electricity: conductors and insulators
  • 257 - Active solid-state devices