3264525

Information

• Patent Grant
• 3264525

• References
• Source

• Patent Number

  3,264,525

• Date Filed

  Not available

• Date Issued

  Tuesday, August 2, 1966
  58 years ago

• CPC

  • H05K7/10 - Plug-in assemblages of components
  • H01R13/514 - composed as a modular blocks or assembly
  • H01R23/68 - for connection to or between printed circuits; Non printed connecting arrangements of printed circuit boards (PCB's)
  • H02B1/207 - Cross-bar layouts
  • H02B15/04 - consisting of building blocks
  • H05K1/0284 - Details of three-dimensional rigid printed circuit boards
  • H05K1/144 - Stacked arrangements of planar printed circuit boards
  • H05K7/02 - Arrangements of circuit components or wiring on supporting structure
  • H05K7/023 - Stackable modules
  • H05K7/1444 - Complex or three-dimensional-arrangements; Stepped or dual mother boards
  • H05K1/0289 - having a matrix lay-out
  • H05K3/107 - by filling grooves in the support with conductive material
  • H05K2201/09036 - Recesses or grooves in insulating substrate
  • H05K2201/09118 - Moulded substrate
  • H05K2201/0999 - Circuit printed on or in housing
  • Y10S439/928 - Modular electrically interengaging parts

• US Classifications

  • 361 - Electricity: electrical systems and devices
  • 439 - Electrical connectors