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Patents Grants
last 30 patents
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Patent Grant
Package assembly lid and methods for forming the same
Patent number
12,322,666
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company Limited
Yu-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package assembly including lid with additional stress mitigating fe...
Patent number
12,315,768
Issue date
May 27, 2025
Taiwan Semiconductor Manufacturing Company Limited
Yu-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Waferscale physiological characteristic sensor package with integra...
Patent number
12,232,842
Issue date
Feb 25, 2025
Medtronic MiniMed, Inc.
Daniel Hahn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
Patent number
12,218,098
Issue date
Feb 4, 2025
Infineon Technologies AG
Petteri Palm
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
Patent number
12,211,762
Issue date
Jan 28, 2025
Amkor Technology Singapore Holding Pte Ltd.
Sang Yun Ma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball grid array underfilling systems
Patent number
11,984,390
Issue date
May 14, 2024
Hamilton Sundstrand Corporation
Eileen A. Bartley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package, semiconductor device, semiconductor package-...
Patent number
11,984,380
Issue date
May 14, 2024
Murata Manufacturing Co., Ltd.
Masao Kondo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
Patent number
11,908,755
Issue date
Feb 20, 2024
Amkor Technology Singapore Holding Pte Ltd.
Sang Jae Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging substrate, packaging structure, electronic device, and ma...
Patent number
11,854,953
Issue date
Dec 26, 2023
Huawei Technologies Co., Ltd.
Zan Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process of package-then-etch three-dimensional package structure el...
Patent number
11,823,911
Issue date
Nov 21, 2023
Jiangsu Changjiang Electronics Technology Co., Ltd
Haishen Kong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Functional element housing package, and semiconductor device and LN...
Patent number
11,815,749
Issue date
Nov 14, 2023
Kyocera Corporation
Hiroyuki Nakamichi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic module and equipment
Patent number
11,798,855
Issue date
Oct 24, 2023
Canon Kabushiki Kaisha
Yu Katase
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package and semiconductor device
Patent number
11,784,201
Issue date
Oct 10, 2023
Canon Kabushiki Kaisha
Kazuya Notsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor component and method for producing same
Patent number
11,655,143
Issue date
May 23, 2023
Infineon Technologies AG
Mathias Vaupel
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor module
Patent number
11,610,826
Issue date
Mar 21, 2023
Fuji Electric Co., Ltd.
Naoyuki Kanai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High-performance integrated circuit packaging platform compatible w...
Patent number
11,605,583
Issue date
Mar 14, 2023
Keysight Technologies, Inc.
Philipp Pahl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with elastic coupler and related methods
Patent number
11,569,140
Issue date
Jan 31, 2023
Semiconductor Components Industries, LLC
Yusheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,562,970
Issue date
Jan 24, 2023
Fuji Electric Co., Ltd.
Tadahiko Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Encapsulated electronic circuit
Patent number
11,529,524
Issue date
Dec 20, 2022
Torsten Lehmann
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Grant
Waferscale physiological characteristic sensor package with integra...
Patent number
11,490,811
Issue date
Nov 8, 2022
Medtronic MiniMed, Inc.
Daniel Hahn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Enclosure for an electronic component
Patent number
11,488,880
Issue date
Nov 1, 2022
Intel Corporation
Vijay K. Nair
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,417,631
Issue date
Aug 16, 2022
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Yun Tae Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Gas sensor module and method of manufacturing gas sensor module
Patent number
11,415,536
Issue date
Aug 16, 2022
Nissha Co., Ltd.
Teppei Kimura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stem for semiconductor package
Patent number
11,373,961
Issue date
Jun 28, 2022
Shinko Electric Industries Co., Ltd.
Wataru Katayama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Case with a plurality of pair case components for a semiconductor d...
Patent number
11,348,851
Issue date
May 31, 2022
Mitsubishi Electric Corporation
Yasutaka Shimizu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer level packaging for semiconductor devices
Patent number
11,336,257
Issue date
May 17, 2022
Semiconductor Manufacturing International (Shanghai) Corporation
Liang Liang Guo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure for semiconductor device, and semiconductor device
Patent number
11,309,439
Issue date
Apr 19, 2022
He Bei Sinopack Electronic Tech Co., Ltd.
Yao Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
Patent number
11,309,277
Issue date
Apr 19, 2022
Infineon Technologies AG
Petteri Palm
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low profile integrated circuit
Patent number
11,257,726
Issue date
Feb 22, 2022
Global Circuit Innovations Incorporated
Timothy Mark Barry
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,251,101
Issue date
Feb 15, 2022
Fuji Electric Co., Ltd.
Taichi Itoh
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SUBSTRATE, PACKAGING STRUCTURE, AND ELECTRONIC DEVICE
Publication number
20250210483
Publication date
Jun 26, 2025
Huawei Technologies Co., Ltd
Dailiang FAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20250157865
Publication date
May 15, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Sang Yun MA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHODS OF FORMING THE SAME
Publication number
20250118697
Publication date
Apr 10, 2025
Taiwan Semiconductor Manufacturing Company Limited
Jui Shen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING...
Publication number
20250038126
Publication date
Jan 30, 2025
MEDIATEK INC.
De-Wei Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240194544
Publication date
Jun 13, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Sang Jae Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240021485
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuei-Sung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULAR POWER TRANSISTOR COMPONENT ASSEMBLIES WITH FLIP CHIP INTERC...
Publication number
20230420430
Publication date
Dec 28, 2023
Wolfspeed, Inc.
Qianli Mu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ASSEMBLY LID AND METHODS FOR FORMING THE SAME
Publication number
20230378007
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Company Limited
Yu-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED MODULE ARRANGEMENT
Publication number
20230230905
Publication date
Jul 20, 2023
Peter Luniewski
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUS BAR, POWER SEMICONDUCTOR MODULE ARRANGEMENT INCLUDING A BUS BAR...
Publication number
20230207511
Publication date
Jun 29, 2023
INFINEON TECHNOLOGIES AG
Marco Rasel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE
Publication number
20230187292
Publication date
Jun 15, 2023
Fuji Electric Co., Ltd.
Daisuke INOUE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Package and Electronic Device Comprising the Same
Publication number
20230178464
Publication date
Jun 8, 2023
Ampleon Netherlands B.V.
Jurgen Raben
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
Publication number
20230178443
Publication date
Jun 8, 2023
Fuji Electric Co., Ltd.
Hayato NAKANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20230078862
Publication date
Mar 16, 2023
Amkor Technology Singapore Holding Pte. Ltd.
Sang Yun MA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFERSCALE PHYSIOLOGICAL CHARACTERISTIC SENSOR PACKAGE WITH INTEGRA...
Publication number
20230063689
Publication date
Mar 2, 2023
Medtronic MiniMed, Inc.
Daniel Hahn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EXTREMELY HIGH FREQUENCY ELECTROMAGNETIC WAVE TRANSMIT/RECEIVE DEVICE
Publication number
20230029946
Publication date
Feb 2, 2023
STMicroelectronics S.A.
Victor FIORESE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package Assembly Including Lid With Additional Stress Mitigating Fe...
Publication number
20230018343
Publication date
Jan 19, 2023
Taiwan Semiconductor Manufacturing Company Limited
Yu-Sheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE AND SEMICONDUCTOR DEVICE
Publication number
20220278149
Publication date
Sep 1, 2022
Canon Kabushiki Kaisha
Kazuya Notsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...
Publication number
20220238481
Publication date
Jul 28, 2022
INFINEON TECHNOLOGIES AG
Petteri PALM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING SUBSTRATE, PACKAGING STRUCTURE, ELECTRONIC DEVICE, AND MA...
Publication number
20220093497
Publication date
Mar 24, 2022
Huawei Technologies Co., Ltd
Zan LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESS OF PACKAGE-THEN-ETCH THREE-DIMENSIONAL PACKAGE STRUCTURE EL...
Publication number
20220084841
Publication date
Mar 17, 2022
Jiangsu Changjiang Electronics Technology Co., Ltd
Haishen KONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE
Publication number
20220068733
Publication date
Mar 3, 2022
Fuji Electric Co., Ltd.
Naoyuki KANAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE-...
Publication number
20220059427
Publication date
Feb 24, 2022
Murata Manufacturing Co., Ltd.
Masao KONDO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Low Profile Integrated Circuit
Publication number
20220005741
Publication date
Jan 6, 2022
Global Circuit Innovations Inc.
Timothy Mark Barry
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20210358869
Publication date
Nov 18, 2021
Fuji Electric Co., Ltd.
Tadahiko SATO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Antenna Module
Publication number
20210234256
Publication date
Jul 29, 2021
Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
Christof LANDESBERGER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE FOR STORING FUNCTIONAL ELEMENT, SEMICONDUCTOR DEVICE AND LN...
Publication number
20210208428
Publication date
Jul 8, 2021
KYOCERA CORPORATION
Hiroyuki NAKAMICHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFERSCALE PHYSIOLOGICAL CHARACTERISTIC SENSOR PACKAGE WITH INTEGRA...
Publication number
20210106226
Publication date
Apr 15, 2021
Medtronic MiniMed, Inc.
Daniel Hahn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package Structure for Semiconductor Device, and Semiconductor Device
Publication number
20210111285
Publication date
Apr 15, 2021
HE BEI SINOPACK ELECTRONIC TECH CO., LTD.
Yao Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SAME
Publication number
20210087054
Publication date
Mar 25, 2021
INFINEON TECHNOLOGIES AG
Mathias VAUPEL
B81 - MICRO-STRUCTURAL TECHNOLOGY