3466510

Information

• Patent Grant
• 3466510

• References
• Source

• Patent Number

  3,466,510

• Date Filed

  Not available

• Date Issued

  Tuesday, September 9, 1969
  55 years ago

• CPC

  • H01L27/0814 - Diodes only
  • H01L21/82 - to produce devices
  • H01L24/80 - Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01023 - Vanadium [V]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01042 - Molybdenum [Mo]
  • H01L2924/01047 - Silver [Ag]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01078 - Platinum [Pt]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/12036 - PN diode
  • H01L2924/14 - Integrated circuits
  • Y10S148/037 - Diffusion-deposition
  • Y10S148/051 - Etching
  • Y10S148/085 - Isolated-integrated
  • Y10S148/142 - Semiconductor-metal-semiconductor
  • Y10S257/909 - Macrocell arrays

• US Classifications

  • 257 - Active solid-state devices
  • 148 - Metal treatment
  • 438 - Semiconductor device manufacturing: process