3500139

Information

• Patent Grant
• 3500139

• References
• Source

• Patent Number

  3,500,139

• Date Filed

  Not available

• Date Issued

  Tuesday, March 10, 1970
  54 years ago

• CPC

  • H03F3/347 - in integrated circuits
  • H01L21/76 - Making of isolation regions between components
  • H01L21/76224 - using trench refilling with dielectric materials
  • H01L21/763 - Polycristalline semiconductor regions
  • H01L27/0647 - Bipolar transistors in combination with diodes, or capacitors, or resistors
  • Y10S148/036 - Diffusion, nonselective
  • Y10S148/043 - Dual dielectric
  • Y10S148/049 - Equivalence and options
  • Y10S148/05 - Etch and refill
  • Y10S148/085 - Isolated-integrated
  • Y10S148/122 - Polycrystalline

• US Classifications

  • 257 - Active solid-state devices
  • 148 - Metal treatment
  • 438 - Semiconductor device manufacturing: process