3588632

Information

• Patent Grant
• 3588632

• References
• Source

• Patent Number

  3,588,632

• Date Filed

  Not available

• Date Issued

  Monday, June 28, 1971
  53 years ago

• CPC

  • H01L23/36 - Selection of materials, or shaping, to facilitate cooling or heating
  • H01L24/80 - Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01023 - Vanadium [V]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01042 - Molybdenum [Mo]
  • H01L2924/01047 - Silver [Ag]
  • H01L2924/01073 - Tantalum [Ta]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/014 - Solder alloys
  • H01L2924/12036 - PN diode
  • H01L2924/12043 - Photo diode
  • H01L2924/1301 - Thyristor
  • Y10S148/054 - Flat sheets-substrates

• US Classifications

  • 257 - Active solid-state devices
  • 148 - Metal treatment