3688018

Information

• Patent Grant
• 3688018

• References
• Source

• Patent Number

  3,688,018

• Date Filed

  Not available

• Date Issued

  Tuesday, August 29, 1972
  52 years ago

• CPC

  • H01L23/5384 - Conductive vias through the substrate with or without pins
  • H01L24/80 - Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
  • H01L2924/01014 - Silicon [Si]
  • H01L2924/01023 - Vanadium [V]
  • H01L2924/01024 - Chromium [Cr]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01039 - Yttrium [Y]
  • H01L2924/01041 - Niobium [Nb]
  • H01L2924/01042 - Molybdenum [Mo]
  • H01L2924/01073 - Tantalum [Ta]
  • H01L2924/01322 - Eutectic Alloys
  • H01L2924/10329 - Gallium arsenide [GaAs]
  • H01L2924/14 - Integrated circuits
  • H01L2924/3011 - Impedance
  • Y10S438/929 - Eutectic semiconductor
  • Y10T428/12465 - having magnetic properties, or preformed fiber orientation coordinate with shape

• US Classifications

  • 174 - Electricity: conductors and insulators
  • 148 - Metal treatment
  • 257 - Active solid-state devices
  • 361 - Electricity: electrical systems and devices
  • 420 - Alloys or metallic compositions
  • 428 - Stock material or miscellaneous articles
  • 438 - Semiconductor device manufacturing: process