Conductive vias through the substrate with or without pins

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H01L23/5384

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/5384Conductive vias through the substrate with or without pins

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for delivering power to semiconductors
- Patent number 12,289,050
- Issue date Apr 29, 2025
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 12,283,549
- Issue date Apr 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical bridge package with integrated off-bridge photonic chann...
- Patent number 12,283,584
- Issue date Apr 22, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator and passive components
- Patent number 12,278,215
- Issue date Apr 15, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid embedded packaging structure and manufacturing method thereof
- Patent number 12,278,227
- Issue date Apr 15, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packaging with galvanic isolation
- Patent number 12,278,169
- Issue date Apr 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Cristina Estacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer interconnect structure and method for integrated circuits
- Patent number RE50384
- Issue date Apr 15, 2025
- Tessera Advanced Technologies, Inc.
- Ryoung-Han Kim
Information Patent Grant
System on chip (SOC) current profile model for integrated voltage r...
- Patent number 12,271,667
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Haohua Zhou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heterogeneous nested interposer package for IC chips
- Patent number 12,272,656
- Issue date Apr 8, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,272,678
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method for manufacturing the same
- Patent number 12,266,610
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Yencheng Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Waveguide interconnects for semiconductor packages and related methods
- Patent number 12,266,840
- Issue date Apr 1, 2025
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 12,266,619
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct bonded and interconnected stack
- Patent number 12,266,640
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable clock macro circuits and methods
- Patent number 12,265,417
- Issue date Apr 1, 2025
- Altera Corporation
- Alexander Rusakov
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package device method of manufacturing the same
- Patent number 12,266,644
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chang-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-gate field-effect transistors in integrated circuits
- Patent number 12,267,991
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhon Jhy Liaw
- G11 - INFORMATION STORAGE
Information Patent Grant
Embedded die architecture and method of making
- Patent number 12,261,124
- Issue date Mar 25, 2025
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with circuit active elements and dummy active...
- Patent number 12,261,171
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Seonah Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having integrated magnetic core inductors
- Patent number 12,249,584
- Issue date Mar 11, 2025
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC with gap-fill structures and the method of manufacturing the same
- Patent number 12,249,566
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ping-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including penetration via structure
- Patent number 12,249,558
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,243,824
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure having raised via...
- Patent number 12,243,826
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebondable interposer for flip chip packaged integrated circuit die
- Patent number 12,243,840
- Issue date Mar 4, 2025
- Samtec, Inc.
- Edwin Loy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package including core die stacked over a controller die
- Patent number 12,243,853
- Issue date Mar 4, 2025
- SK hynix Inc.
- Bok Kyu Choi
- G11 - INFORMATION STORAGE
Information Patent Grant
Hybrid conductive vias for electronic substrates
- Patent number 12,243,825
- Issue date Mar 4, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out packaging pop mechanical attach method
- Patent number 12,243,856
- Issue date Mar 4, 2025
- Intel Corporation
- David O'Sullivan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit
- Patent number 12,237,332
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Guo-Huei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method
- Patent number 12,237,238
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE INCLUDING CONDUCTIVE STUD ON PAD STRUCTURE
- Publication number 20250140700
- Publication date May 1, 2025
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE, ELECTRONIC UNIT, METHOD FOR MANUFACTUR...
- Publication number 20250140703
- Publication date May 1, 2025
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi KUDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20250132259
- Publication date Apr 24, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20250132260
- Publication date Apr 24, 2025
- Ping-Jung Yang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Package And Method Of Fabricating The Same
- Publication number 20250132263
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Hae-Jung YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250125298
- Publication date Apr 17, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CIRCUIT BOARD
- Publication number 20250126723
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS
- Publication number 20250125275
- Publication date Apr 17, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250125224
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THEREOF
- Publication number 20250118575
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Publication number 20250120102
- Publication date Apr 10, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PHOTONICS CHIP
- Publication number 20250116810
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Daegon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES
- Publication number 20250112163
- Publication date Apr 3, 2025
- Intel Corporation
- Pratyush Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY AND HIGH-VOLTAGE DEVICES
- Publication number 20250112216
- Publication date Apr 3, 2025
- Intel Corporation
- Qiang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE THERMAL INTERPOSER FOR BACKSIDE COOLING OF DOUBLE-SIDED PA...
- Publication number 20250112106
- Publication date Apr 3, 2025
- Intel Corporation
- Tarek Gebrael
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20250105161
- Publication date Mar 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Hao-Chih HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPLET DEVICE AND INTERPOSER
- Publication number 20250105163
- Publication date Mar 27, 2025
- Global Unichip Corporation
- Liang-Kai CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME-LESS SEMICONDUCTOR DEVICE ASSEMBLIES WITH DUAL-SIDED COOLING
- Publication number 20250105164
- Publication date Mar 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jooyang EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS
- Publication number 20250105165
- Publication date Mar 27, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CONDUCTIVE BLOCKS, A SEMICONDUCTOR PACKAGE AND A...
- Publication number 20250105194
- Publication date Mar 27, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCELERATOR STRUCTURE, METHOD FOR GENERATING ACCELERATOR STRUCTURE,...
- Publication number 20250105225
- Publication date Mar 27, 2025
- Cambricon (Xi'an) Semiconductor Co., Ltd.
- Zhiwei QIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure and alignment method thereof
- Publication number 20250105166
- Publication date Mar 27, 2025
- UNITED MICROELECTRONICS CORP.
- Chiao-Yi Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105077
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE COUPLED TO A GLAS...
- Publication number 20250105156
- Publication date Mar 27, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...
- Publication number 20250105209
- Publication date Mar 27, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...
- Publication number 20250105222
- Publication date Mar 27, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR STRUCTURE WITH SAME
- Publication number 20250096144
- Publication date Mar 20, 2025
- Changxin Memory Technologies, Inc.
- Hailin WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA (TSV) TESTING
- Publication number 20250093404
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF FORMING THE SAME
- Publication number 20250087627
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250087588
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS

Conductive vias through the substrate with or without pins

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and apparatus for delivering power to semiconductors

High density interconnection using fanout interposer chiplet

Electrical bridge package with integrated off-bridge photonic chann...

Integrated voltage regulator and passive components

Hybrid embedded packaging structure and manufacturing method thereof

Electronic device packaging with galvanic isolation

Multilayer interconnect structure and method for integrated circuits

System on chip (SOC) current profile model for integrated voltage r...

Heterogeneous nested interposer package for IC chips

Semiconductor package and manufacturing method thereof

Semiconductor package device and method for manufacturing the same

Waveguide interconnects for semiconductor packages and related methods

Integrated devices in semiconductor packages and methods of forming...

Molded direct bonded and interconnected stack

Configurable clock macro circuits and methods

Semiconductor package device method of manufacturing the same

Multi-gate field-effect transistors in integrated circuits

Embedded die architecture and method of making

Semiconductor devices with circuit active elements and dummy active...

Microelectronic assemblies having integrated magnetic core inductors

3DIC with gap-fill structures and the method of manufacturing the same

Semiconductor device including penetration via structure

Semiconductor devices and methods of manufacture

Method for manufacturing semiconductor structure having raised via...

Wirebondable interposer for flip chip packaged integrated circuit die

Stack package including core die stacked over a controller die

Hybrid conductive vias for electronic substrates

Fan out packaging pop mechanical attach method

Integrated circuit

Package structure and method

Patents Applicationslast 30 patents

SUBSTRATE INCLUDING CONDUCTIVE STUD ON PAD STRUCTURE

THROUGH ELECTRODE SUBSTRATE, ELECTRONIC UNIT, METHOD FOR MANUFACTUR...

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

CHIP PACKAGE

Semiconductor Package And Method Of Fabricating The Same

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING CIRCUIT BOARD

MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THEREOF

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

SEMICONDUCTOR PACKAGE WITH PHOTONICS CHIP

THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY AND HIGH-VOLTAGE DEVICES

FLEXIBLE THERMAL INTERPOSER FOR BACKSIDE COOLING OF DOUBLE-SIDED PA...

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR CHIPLET DEVICE AND INTERPOSER

LEADFRAME-LESS SEMICONDUCTOR DEVICE ASSEMBLIES WITH DUAL-SIDED COOLING

SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS

METHOD FOR FORMING CONDUCTIVE BLOCKS, A SEMICONDUCTOR PACKAGE AND A...

ACCELERATOR STRUCTURE, METHOD FOR GENERATING ACCELERATOR STRUCTURE,...

Semiconductor structure and alignment method thereof

PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE COUPLED TO A GLAS...

HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...

HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...

PACKAGE SUBSTRATE AND SEMICONDUCTOR STRUCTURE WITH SAME

THROUGH-SILICON VIA (TSV) TESTING

SEMICONDUCTOR PACKAGES AND METHOD OF FORMING THE SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME