This application is based on and claims priority of Japanese Patent Application (JPA) No. 2005-229505 filed on Aug. 8, 2005, the entire contents of which are incorporated herein by reference.
1. Field of the Invention
The present invention relates to an apparatus and methods for measuring shapes of both sides of a plate which can measure shapes of both sides, that is, a surface and a back surface of a plate to be measured in which the shapes of both sides of the plate are important elements, for example, a plate such as a photomask made of aquartzglass for a large-sized liquid crystal with high precision.
2. Related Art
For example, in the manufacturing of a TFT (thin film transistor) array of a liquid crystal display plate, a mask pattern formed by a shielding film formed on a surface of a photomask is exposed and projected by a photolithographic technique and is transferred onto a mother glass. Then, the TFT array is formed on the mother glass by the photolithographic technique and a so-called process technique. Similarly, a color filter of a liquid crystal display plate is also manufactured by a method using a lithography referred to as a dye impregnating method. Also in the manufacturing of both the TFT array side and the color filter side, a large-sized photomask is required. In order to execute a pattern transformation with high precision, a synthetic quartz glass having a small coefficient of linear expansion is mainly used for a material of the large-sized photomask.
A size of the mother glass for manufacturing the liquid crystal display plate has been increased more and more. Accordingly, a further increase in a size of the photomask made of the quartz glass has been demanded. At present, a large-sized photomask having a dimension of 1500 mm×1500 mm or more has been used. A plate thickness of the large-sized photomask is 10 mm 20 mm.
In the photomask having the size increased, a degree of flatness of a surface on which the mask pattern is formed over the entire surface of the photomask is an important element. In each photomask, a degree of flatness of a surface thereof is measured, and a strict quality management for selecting the photomask within a standard range is essential. Therefore, various apparatuses for measuring the degree of flatness of the surface of the large-sized photomask have been proposed so far (for example, Japanese Patent Application, Publication No. H03-90805 and 2000 -55641). A part of them has already been used practically and is used for managing the degree of flatness of the plate to be measured such as the large-sized photomask.
On the other hand, in the liquid crystal display plate, resolution has been highly developed from VGA to SVGA, XGA, SXGA, UXGA and QXGA. Furthermore, there has been practically utilized a method of forming the TFT by using low-temperature polysilicon and forming an IC for a driver in an outer peripheral portion of a mother glass separately from a pixel of a display. Accordingly, an improvement in precision in a pattern transformation on the TFT array side, particularly, precision in alignment in the exposure and projection of the pattern has increasingly been demanded.
An enhancement in the precision in the pattern transformation in the photolithography has required a strict quality management for the degree of flatness of the surface of the photomask over the entire surface of the photomask and the degree of flatness of a photomask surface (referred to as a back surface of the photomask) which is opposed thereto. This will be described with reference to
As shown in
Also in
If an improvement in the resolution of the liquid crystal display is required or an improvement in the precision of the pattern transformation is required due to the embedding of an IC for a driver, the positional shift of the pattern transformation caused by the concavo-convex shape of the back surface of the photomask becomes obvious as a drawback. For this reason, an increase in the degree of flatness of the back surface of the photomask has been demanded to approximate to the ideal optical path and the strict quality management for the degree of flatness has been required.
However, there has not been developed an apparatus for measuring shapes of both sides which can measure the shapes of a surface and a back surface of the photomask for a large-sized liquid crystal with high precision at the same time or a method of easily measuring the shapes of both sides or the degree of flatness of both sides with high precision.
In consideration of the above-described circumstances, it is an object of the present invention to provide an apparatus and methods for measuring shapes of both sides of a plate, that is, a surface and a back surface with high precision. And the apparatus and the methods are for those plates in which the shapes of both sides of the plate are important elements in addition to the photomask for a liquid crystal.
An apparatus for measuring shapes of both sides of a plate according to an embodiment of the present invention comprises:
In the above embodiment of the invention, the first displacement gauge and the second displacement gauge are mounted on a first Y-axis moving mechanism which can be moved in a vertical axis direction in the reference plane, the third displacement gauge is mounted on a second Y-axis moving mechanism which can be moved in the vertical axis direction in the reference plane independently of the first Y-axis moving mechanism, and the first Y-axis moving mechanism and the second Y-axis moving mechanism are mounted on an X-axis moving mechanism which can be moved in a horizontal axis direction in the reference plane.
With the above-described configuration, it is possible to obtain a very high linearity and very high positioning precision in the movement of the X-axis moving mechanism and the two Y-axis moving mechanism. Accordingly, the first displacement gauge, the second displacement gauge and the third displacement gauge can be accurately scanned with high precision with respect to the reference plane of a surface plate. By setting the reference plane as a reference surface, it is possible to measure the shapes of one of surfaces and the other surface of the plate to be measured at the same time with high precision.
In an embodiment of the present invention, the first Y-axis moving mechanism and the second Y-axis moving mechanism comprise a ball screw and a slide coupled thereto, and the X-axis moving mechanism comprises a V-V rolling guide or a V-V slip guide. By employing an air slide as the slide, it is possible to prevent deterioration in precision from being caused by a vibration in positioning by means of the ball screw.
In an embodiment of the present invention, moreover, the first displacement gauge, the second displacement gauge and the third displacement gauge comprise non-contact laser displacement gauges.
In a method of measuring shapes of both sides of a plate according to another embodiment of the present invention, a reference plane of a surface plate is disposed in an almost vertical state,
a plate to be measured is supported in such a manner that a plate surface of the plate to be measured is set in almost parallel with the reference plane, and
a first displacement gauge disposed opposite to the reference plane and a second displacement gauge disposed opposite to one side of the plate surfaces of the plate to be measured are scanned in a vertical plane between the reference plane and one side of the plate surfaces of the plate to be measured, a distance between the surface of the plate surface and the reference plane is measured, and at the same time, a third displacement gauge disposed opposite to one surface side which is opposed to the other surface of the plate surface is scanned, and a distance between the other side of the plate surfaces and the reference plane is measured and surface shapes of one of the surfaces of the plate to be measured and the other surface are measured.
In the method of measuring shapes of both sides of a plate according to the above embodiment the invention, a reference block having a predetermined plate thickness is previously disposed between the second displacement gauge and the third displacement gauge, a distance (A1+A2+L0) between one surface of the reference block and the reference plane of the surface plate is measured by the first displacement gauge and the second displacement gauge, a distance (A3) from the other surface of the reference block is measured by the third displacement gauge and a distance (A0) between the third displacement gauge and the reference plane of the surface plate is measured.
With the configuration described above, it is possible to easily measure the shapes of both sides of a large-sized plate to as the photomask for a large-sized liquid crystal in a short time with high precision. Moreover, it is possible to obtain the degree of flatness of both sides, that is, one of surfaces and the other surface of the plate with high precision.
In an embodiment of the present invention, the first displacement gauge, the second displacement gauge and the third displacement gauge are scanned synchronously.
According to an embodiment of the present invention for the method of measuring shapes of both sides of a plate, moreover, it is possible to easily measure the shape of the plate by measuring a distance between one plane of the plate and the reference plane by means of the first displacement gauge and the second displacement gauge and measuring a distance between the other plane of the plate and the reference plane by means of the third displacement gauge.
According to an embodiment of the present invention, it is possible to measure the shapes of both sides, that is, the surface and the back surface with high precision in the plate in which the shapes of both sides of the plate are important elements. It is possible to measure the degree of flatness of both sides of the plate easily in a short time.
An embodiment of the present invention will be described with reference to
As shown in
In front of the longitudinal surface plate 3 on the bed 2, there is a holding mechanism 5 for holding a plate P to be measured, for example, a photomask made of a quartz glass for a large-sized liquid crystal which has a width and length of approximately 1500 mm×1500 mm or less and a plate thickness of approximately 15 mm. The holding mechanism 5 has a holding member 6 made of a metal or ceramics. A cross beam 6b driven by means of a motor 6c and laid to be vertically movable is respectively provided between a pair of side columns 6a of the holding member 6. And a support and regulation can be carried out corresponding to a size of the plate P by the vertical movement of the cross beam 6b.
Moreover, there are provided a pair of lower support members 7a disposed apart from each other in a longitudinal direction in a lower part of the holding member 6. And there is provided an upper support member 7b disposed in almost a central part in a longitudinal direction of the cross beam 6b in an upper part of the holding member 6.
These support members 7a and 7b are provided with a gripping mechanism 8 for fixing the plate P. The gripping mechanism 8 is driven by means of a servomotor and can be moved in a vertical direction to the reference plane 4 of the longitudinal surface plate 3. By driving the servomotor, the surface of the plate P be disposed vertically with high precision.
A distance between the lower support members 7a can be regulated automatically or manually.
On the bed 2, there is disposed a displacement gauge scanning column 9 (an X-axis moving mechanism). The displacement gauge scanning column 9 has such a moving structure in an X-axis direction (a horizontal axis direction) in the reference plane 4 of the longitudinal surface plate 3. The displacement gauge scanning column 9 can be moved with high precision in the X-axis direction shown in
The V-V rolling guide has a high degree of straightness which is equal to or lower than 2 μm in a stroke of 2300 mm in the horizontal axis direction over the upper surface of the bed 2. Moreover, positioning accuracy is high, that is, 0.1 μm or less.
As shown in
Similarly, the second air slide 13 has another guide rail 18 and another ball screw 19 which are attached onto the table 11 vertically, and is held by the fixed board 16 in an upper part thereof. A second slider 20 of the second air slide 13 is moved with high precision in the Y-axis direction in the reference plane 4. The second slider 20 moves along the guide rail 18 by means of the build-in motor-driven ball screw 19 which is provided in the table 11. It is suitable that materials of the guide rails 14 and 18, the first slider 17 and the second slider 20 should be, for example, aluminum or ceramics which are light weight and highly rigid.
As shown in
As shown in
As described above, the degree of straightness in the air slide guide is greatly increased and is equal to or lower than 2 μm in a stroke of 1600 mm inavertical axis direction. Moreover, positioning accuracy is high, that is, 0.1 μm or less.
As shown in
The displacement gauge scanning column 9 has a relatively large weight so as to be formed into the integral structure as described above. By its own weight, a movement in an X-axis direction is made smooth. Thus, an unevenness of a moving speed is greatly reduced. Consequently, positioning accuracy can be enhanced.
As shown in
As shown in
Next, description will be given to a main manipulation and operation of an apparatus for measuring shapes of both sides of a plate. In
The gripping mechanism 8 provided on the support members 7a and 7b is moved in a vertical direction to the reference plane 4 of the longitudinal surface plate 3. Accordingly, the plate P to be measured is set into an almost vertical state in the same manner as the reference plane 4 of the longitudinal surface plate 3 and is disposed in almost parallel with the reference plane 4.
As shown in
The moving control in the X-axis and Y-axis directions is carried out by sending a command signal from the control unit 26 based on a program input from the computer 28 and controlling the X-axis driving mechanism of the displacement gauge scanning column 9, the Y-axis driving mechanism of the first slider 17 and the Y-axis driving mechanism of the second slider 20. A surface shape and a change in a plate thickness on both sides are obtained over the entire surface of the plate P through a measurement of a distance from the reference plane 4 of the longitudinal surface plate 3. As will be describedbelow, the measurement will be done by means of the first displacement gauge 23, the second displacement gauge 24 and the third displacement gauge 25 which are attached to the first slider 17 and the second slider 20 that carry out a scanning movement in the almost vertical plane constituted in the X-axis direction and the Y-axis direction.
In the configuration of the apparatus for measuring shapes of both sides of a plate according to the embodiment, the measuring apparatus body 1 has the reference plane 4 of the longitudinal surface plate 3 disposed in an almost vertical state at one endon the strong metallic bed 2, the holding mechanism 5 for holding the plate P to be measured in almost parallel therewith and the displacement gauge scanning column 9, for example. The displacement gauge scanning column 9 includes the first air slide 17 having the first displacement gauge 23 and the second displacement gauge 24 mounted thereon, the second air slide 20 having the third displacement gauge 25 mountedthereon, andthepairof struts 22 so as to have an integral structure, and can be moved in the horizontal axis direction over the reference plane 4 along the pair of V grooves 10 over the bed 2. Moreover, the first air slide 17 and the second air slide 20 on the displacement gauge scanning column 9 are moved in the vertical axis direction over the reference plane 4.
Therefore, it is possible to obtain a very high degree of straightness and very high positioning accuracy in the linear movement in the horizontal axis direction of the displacement gauge scanning column 9. In the linear movement in the vertical axis direction of the first air slide 17 and the second air slide 20, similarly, it is possible to obtain a very high degree of straightness and very high positioning accuracy.
Accordingly, the first displacement gauge 23 and the second displacement gauge 24 which are mounted on the first air slide 17 and the third displacement gauge 25 mounted on the second air slide 20 can carry out a scannig with high precision with respect to the reference plane 4.
By means of the first displacement gauge 23 and the second displacement gauge 24, it is possible to precisely measure the shape of the surface over the entire surface of the plate P to be measured by setting the reference plane 4 of the longitudinal surface plate 3 to be a reference surface. At the same time, it is possible to precisely measure the shape of the other surface of the plate P to be measured by setting the reference plane 4 to be a reference surface by means of the third displacement gauge 25. Precision in the measurement of these surface shapes is equal to or smaller than 1 μm.
From the foregoing, in the case in which the shapes of both sides of the plate P such as a photomask for a large-sized liquid crystal are measured, it is possible to carry out a measurement with very high precision.
With reference to
The first displacement gauge 23 and the second displacement gauge 24 are scanned in almost a vertical plane constituted in the horizontal axis direction and the vertical axis direction in the reference plane 4 and measure the distances L1 and L2 in each portion of the first plate surface S1 of the plate P. At the same time, the third displacement gauge 25 is scanned synchronously with the first displacement gauge 23 and the second displacement gauge 24 and measures the distance L3 in each portion of the second plate surface S2 of the plate P. It is assumed that an optical axis of a laser beam emitted from the second displacement gauge 24 and that of a laser beam emitted from the third displacement gauge 25 are disposed to be identical to each other. Data on the distance in each portion of the plate P are stored in the computer 28.
In
In
From the distance A0 data and the distance L3 data, as shown in
In
The method of measuring the shapes of both sides of the plate described with reference to
In the same manner, the distribution of the distance R2 between the second plate surface S1 of the plate P and the reference plane 4 of the longitudinal surface plate 3 is obtained by the scan of the third displacement gauge 25 and the measurement of the distance as shown in
In case of
Next, a method of evaluating the degree of flatness of the plate P will be described with reference to
A second method is as follows. Although the plate P is held in an almost vertical state by means of the holding mechanism 5, the plate surface is not always set in a parallel state with the reference plane 4 of the longitudinal surface plate 3 in many cases. The second method considers such a situation.
The computer 28 executes a computation processing of obtaining the degree of flatness of the plate P by the distances R1 and R2 computed based on the distances L1, L2 and L3 in each portion which are measured in such a state. In this case, there are some techniques for the processing of computing the degree of flatness of the plate P to be measured. A simple technique is as follows.
More specifically, a difference between maximum and minimum values at this time is set to be the degree of flatness of the first plate surface S1 (or the second plate surface S2) by setting, as a reference, measured values on two diagonal points of the plate P to be measured in the distance R1 (or the distance R2) in each portion.
More specifically, (a) the distance data R1 in each portion are corrected in such a manner that the distance R1 on first two diagonal points is equal with respect to the reference plane, (2) the distance data R1 corrected in the (1) are corrected again in such a manner that the distance R1 on second two diagonal points is equal with respect to the reference plane, and (3) a difference between maximum and minimum values of the distance data R1 corrected as described above is set to be the degree of flatness of the first plate surface S1.
Similarly, the distance data R2 are corrected by carrying out entirely the same computation processing as that of the distance data R1. A difference between maximum and minimum values thus corrected is set to be the degree of flatness of the second plane S2.
For the first plate surface S1 and the second plate surface S2, the degree of flatness of the plate P to be measured is evaluated by setting predetermined differences to be a reference degree of flatness, respectively. Moreover, the degree of flatness thus obtained by the computation processing is output from the display 29 and/or the printer 30 immediately after the measurement of the plate P to be measured, for example.
By the method of measuring the shapes of both sides of a plate, it is possible to easily measure the shapes of both sides of a large-sized plate to be measured such as a photomask for a large-sized liquid crystal in a short time with high precision. The degree of flatness of the plate to be measured can be obtained with high precision.
The present invention is not restricted to the embodiment but various changes can be made without departing from the scope of the present invention. For example, the displacement gauge scanning column 9 having such a structure as to be moved in the horizontal axis direction in the reference plane 4 of the longitudinal surface plate 3 over the bed 2 may have such a configuration as to be moved through a V-V slip guide.
Moreover, the first air slide 12 and the second air slide 13 which are provided on the table 11 may have such a configuration as to be moved in the vertical axis direction by means of a linear motor.
The present invention can also be applied to a plate to be measured in which the shapes of both sides of the plate are important elements in addition to the photomask made of a quartz glass for a liquid crystal as the plate P to be processed. For example, the present invention can also be effectively applied to the measurement of the shapes of both sides of a semiconductor wafer as the plate to be processed.
For the displacement gauge, moreover, an air scale sensor method, an eddy current method, an electrostatic capacity method and the like have been known. These can be properly selected corresponding to a substance constituting the plate to be measured.
Number | Date | Country | Kind |
---|---|---|---|
2005-229505 | Aug 2005 | JP | national |