Patent Grant
11116695
The present invention relates to the technical field of thermoplastic blood collection vessels, for example such vessels in which blood samples are collected and transported to a medical laboratory for testing.
Blood sample collection vessels, commonly tubes, are used for drawing blood from a patient for medical analysis. The tubes are commonly sold stoppered and evacuated. The patient's blood is communicated to the interior of a tube by inserting one end of a double-ended hypodermic needle into the patient's blood vessel and impaling the closure of the evacuated blood collection tube on the other end of the double-ended needle. The vacuum in the evacuated blood collection tube draws the blood (or more precisely, the blood pressure of the patient pushes the blood) through the needle into the evacuated blood collection tube, increasing the pressure within the tube and thus decreasing the pressure difference causing the blood to flow. The blood flow typically continues until the tube is removed from the needle or the pressure difference is too small to support flow.
Evacuated blood collection tubes should have a substantial shelf life to facilitate efficient and convenient distribution and storage of the tubes prior to use. For example, a one-year shelf life is desirable, and progressively longer shelf lives, such as 18 months, 24 months, or 36 months, are also desired in some instances. The tube desirably remains essentially fully evacuated, at least to the degree necessary to draw enough blood for analysis (a common standard is that the tube retains at least 90% of the original draw volume), for the full shelf life, with very few (optimally no) defective tubes being provided.
A tube having a lower-than-standard vacuum level at the time of use is likely to cause the phlebotomist using the tube to fail to draw sufficient blood. The phlebotomist might then need to obtain and use one or more additional tubes to obtain an adequate blood sample.
To meet this shelf-life requirement, evacuated blood collection tubes have typically been made of glass. Glass vessels have been favored because glass is more gas tight and inert to pre-filled contents than untreated plastics. Also, due to its traditional use, glass is well accepted, as it is known to be relatively innocuous when contacted with blood or other medical samples.
Glass vessels, however, have several serious disadvantages when used as blood tubes. They can break, and if broken form sharp shards from remnants of the vessel that can injure workers or patients, both due to the direct effects of laceration and by transmitting infections via lacerated skin. Breakage after a sample is collected can also cause the sample to be compromised or lost. Glass vessels also are expensive to manufacture, as glass cannot be injection molded.
Thermoplastic blood collection tubes have been developed to overcome the disadvantages of glass vessels. Plastic vessels are rarely broken in normal use, and if broken do not form sharp shards from remnants of the vessel, like a glass tube would. As-molded thermoplastic blood collection tubes previously have not had gas barrier properties adequate to provide a commercially desirable shelf life when used as evacuated blood collection tubes. Plastic has allowed small molecule gases to permeate into (or out of) the article. The permeability of plastics to gases has been significantly greater than that of glass. Many plastics have allowed water vapor to pass through articles to a greater degree than glass. Some plastic vessels contain organic or inorganic metal compounds in the plastic that can leach out or be extracted into the sample vessel.
U.S. Pat. No. 7,985,188 discloses barrier-coated thermoplastic blood collection tubes including a barrier coating or layer applied by plasma-enhanced chemical vapor deposition (PECVD) to improve their gas barrier and leaching properties. An example of a suitable barrier coating disclosed by U.S. Pat. No. 7,985,188 is SiOx, in which x in this formula is from about 1.5 to about 2.9 as characterized by x-ray photoelectron spectroscopy (XPS).
Some blood collection tubes, as sold, contain an aqueous reagent, for example EDTA, heparin or sodium citrate, to preserve the blood between the times of collection and analysis. Some such reagents can attack and dissolve the barrier coating over time, leading to increased permeation of external atmospheric gas, reduction in the vacuum level, and thus a shorter shelf life of the barrier-coated thermoplastic evacuated blood collection tubes.
Since many of these blood collection vessels are inexpensive and used in large quantities, for certain applications it will be useful to reliably obtain the necessary shelf life without increasing the manufacturing cost to a prohibitive level.
Thus, there is a desire for plastic pharmaceutical packages or other vessels, in particular plastic vessels, with gas and solute barrier properties which approach the properties of glass without unduly increasing the manufacturing cost.
A first embodiment is a blood sample collection tube comprising a wall and a coating set on the surface. The wall has an interior surface comprising a cyclic olefin polymer (COP) or a cyclic olefin copolymer (COC). The coating set on the surface comprises a tie coating or layer, a barrier coating or layer, and a pH protective coating or layer.
In this first embodiment, the tie coating or layer comprises SiOxCy or SiNxCy wherein x is from about 0.5 to about 2.4 and y is from about 0.6 to about 3. The tie coating or layer has an outer surface facing the wall surface, and the tie coating or layer has an interior surface.
In this first embodiment, the barrier coating or layer comprises SiOx, wherein x is from 1.5 to 2.9, and is from 2 to 1000 nm thick. The barrier coating or layer of SiOx has an outer surface facing the interior surface of the tie coating or layer, and the barrier coating or layer of SiOx has an interior surface. The barrier coating or layer is effective to reduce the ingress of atmospheric gas through the wall compared to an uncoated wall.
In this first embodiment, the pH protective coating or layer comprises SiOxCy or SiNxCy wherein x is from about 0.5 to about 2.4 and y is from about 0.6 to about 3. The pH protective coating or layer can be formed on the barrier coating or layer. The pH protective coating or layer is formed by chemical vapor deposition of a precursor selected from an acyclic siloxane, a monocyclic siloxane, a polycyclic siloxane, a polysilsesquioxane, a monocyclic silazane, a polycyclic silazane, a polysilsesquiazane, a silatrane, a silquasilatrane, a silproatrane, an azasilatrane, an azasilquasiatrane, an azasilproatrane, or a combination of any two or more of these precursors.
In this first embodiment, the rate of erosion of the pH protective coating or layer, if directly contacted by a fluid composition having a pH at some point between 5 and 9, is less than the rate of erosion of the barrier coating or layer, if directly contacted by the fluid composition.
A second embodiment is a blood sample collection tube comprising a vessel having a lumen defined at least in part by a wall. The wall has an interior surface comprising a cyclic olefin polymer (COP) or a cyclic olefin copolymer (COC) facing the lumen, and the wall has an outer surface. A coating set on the interior surface comprises a tie coating or layer, a barrier coating or layer, and a pH protective coating or layer.
In this second embodiment, the tie coating or layer comprises SiOxCy or SiNxCy wherein x is from about 0.5 to about 2.4 and y is from about 0.6 to about 3. The tie coating or layer has an interior surface facing the lumen and an outer surface facing the wall interior surface.
In this second embodiment, the barrier coating or layer comprises SiOx, wherein x is from 1.5 to 2.9, from 2 to 1000 nm thick. The barrier coating or layer of SiOx has an interior surface facing the lumen and an outer surface facing the interior surface of the tie coating or layer. The barrier coating or layer is effective to reduce the ingress of atmospheric gas into the lumen compared to an vessel without a barrier coating or layer.
In this second embodiment, the pH protective coating or layer comprises SiOxCy or SiNxCy wherein x is from about 0.5 to about 2.4 and y is from about 0.6 to about 3. The pH protective coating or layer has an interior surface facing the lumen and an outer surface facing the interior surface of the barrier coating or layer.
In this second embodiment, the combination of the tie coating or layer and the pH protective coating or layer is effective to increase the calculated shelf life of the package (total Si/Si dissolution rate).
In this second embodiment, a fluid composition is contained in the lumen and has a pH between 5 and 9.
In this second embodiment, the calculated shelf life of the package is more than six months at a storage temperature of 4° C.
A third embodiment is a blood sample collection tube comprising a thermoplastic wall, a fluid composition, a tie coating or layer, a barrier coating or layer, and a pH protective coating or layer.
In this third embodiment, the thermoplastic wall has an interior surface comprising a cyclic olefin polymer (COP) or a cyclic olefin copolymer (COC) and encloses a lumen.
In this third embodiment, the fluid composition contained in the lumen has a pH greater than 5 and is disposed in the lumen.
In this third embodiment, the tie coating or layer comprises SiOxCy or SiNxCy wherein x is from about 0.5 to about 2.4 and y is from about 0.6 to about 3. The tie coating or layer has an outer surface facing the wall surface, and the tie coating or layer has an interior surface.
In this third embodiment, in the barrier coating or layer of SiOx, x is between 1.5 and 2.9. The barrier coating or layer is applied by plasma-enhanced chemical vapor deposition (PECVD). The barrier coating or layer is positioned between the interior surface of the tie coating or layer and the fluid composition, and the barrier coating or layer is supported by the thermoplastic wall. The barrier coating or layer has the characteristic of being subject to being measurably diminished in barrier improvement factor in less than six months as a result of attack by the fluid composition.
In this third embodiment, in the pH protective coating or layer of SiOxCy, x is between 0.5 and 2.4 and y is between 0.6 and 3. The pH protective coating or layer is applied by PECVD, and the pH protective coating or layer is positioned between the barrier coating or layer and the fluid composition and supported by the thermoplastic wall. The pH protective coating or layer and the tie coating or layer together are effective to keep the barrier coating or layer at least substantially undissolved as a result of attack by the fluid composition for a period of at least six months.
The following reference characters are used in the drawing figures according to any embodiment:
In the context of the present invention, the following definitions and abbreviations are used:
The word “comprising” according to any embodiment does not exclude other elements or steps, and the indefinite article “a” or “an” does not exclude a plurality unless indicated otherwise. Whenever a parameter range is indicated, it is intended to disclose the parameter values given as limits of the range and all values of the parameter falling within said range.
“First” and “second” or similar references to, for example, deposits of coatings or layers, processing stations or processing devices according to any embodiment refer to the minimum number of deposits, processing stations or devices that are present, but do not necessarily represent the order or total number of deposits, processing stations and devices or require additional deposits, processing stations and devices beyond the stated number. These terms do not limit the number of processing stations or the particular processing carried out at the respective stations. For example, a “first” deposit in the context of this specification can be either the only deposit or any one of plural deposits, without limitation. In other words, recitation of a “first” deposit allows but does not require an embodiment that also has a second or further deposit.
For purposes of the present invention according to any embodiment, an “organosilicon precursor” is a compound having at least one of the linkages:
which is a tetravalent silicon atom connected to an oxygen or nitrogen atom and an organic carbon atom (an organic carbon atom being a carbon atom bonded to at least one hydrogen atom). A volatile organosilicon precursor, defined as such a precursor that can be supplied as a vapor in a PECVD apparatus, is an optional organosilicon precursor. Optionally, the organosilicon precursor is a linear siloxane or a monocyclic siloxane, or a combination of any two or more of these precursors.
A “vessel” in the context of the present invention can be any type of vessel with at least one opening and a wall defining an inner or interior surface, according to any embodiment. The substrate can be the wall of a vessel having a lumen, according to any embodiment.
The term “at least” in the context of the present invention according to any embodiment means “equal or more” than the integer following the term. Thus, a vessel in the context of the present invention has one or more openings. One or two openings, like the openings of a sample tube (one opening) or a vessel (two openings) are preferred. A vessel according to the present invention can be a sample tube, for example for collecting or storing biological fluids like blood according to any embodiment.
A vessel according to any embodiment can be of any shape, a vessel having a substantially cylindrical wall adjacent to at least one of its open ends being preferred. Generally, the interior wall of the vessel is cylindrically shaped, like, for example in a sample tube. Sample tubes are contemplated, according to any embodiment.
The values of w, x, y, and z according to any embodiment are applicable to the empirical composition SiwOxCyHz throughout this specification. The values of w, x, y, and z used throughout this specification should be understood as ratios or an empirical formula (for example for a coating or layer), rather than as a limit on the number or type of atoms in a molecule. For example, octamethylcyclotetrasiloxane, which has the molecular composition Si4O4C8H24, can be described by the following empirical formula, arrived at by dividing each of w, x, y, and z in the molecular formula by 4, the largest common factor: Si1O1C2H6. The values of w, x, y, and z are also not limited to integers according to any embodiment. For example, (acyclic) octamethyltrisiloxane, molecular composition Si3O2C8H24, is reducible to Si1O0.67C2.67H8. Also, although SiOxCyHz is described as equivalent to SiOxCy according to any embodiment, it is not necessary to show the presence of hydrogen in any proportion to show the presence of SiOxCy.
The atomic ratio according to any embodiment can be determined by XPS. Taking into account the H atoms, which are not measured by XPS, the coating or layer may thus in one aspect have the formula SiwOxCyHz (or its equivalent SiOxCy), for example where w is 1, x is from about 0.5 to about 2.4, y is from about 0.6 to about 3, and z is from about 2 to about 9.
The present invention will now be described more fully, with reference to the accompanying drawings, according to any embodiment. This invention can, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth here. Rather, these embodiments are examples, which has the full scope indicated by the language of the claims. Like numbers refer to like or corresponding elements throughout. The following disclosure relates to all embodiments unless specifically limited to a certain embodiment.
Vessels and Coating Sets
Every embodiment, illustrated most broadly by
The vessel 210 in any embodiment may also include a closure as shown generically in
The vessel in any embodiment is made of a thermoplastic material, for example cyclic olefin polymer (COP) or cyclic olefin copolymer (COC).
An embodiment of the vessel coating or layer set 285, 285a, or 285b in any embodiment is at least one tie coating or layer 289, at least one barrier coating or layer 288, and at least one pH protective coating or layer 286, illustrated in
The trilayer coating set 285 includes as a first layer an adhesion or tie coating or layer 289 that improves adhesion of the barrier coating or layer to the COP substrate. The adhesion or tie coating or layer 289 is also believed to relieve stress on the barrier coating or layer 288, making the barrier layer less subject to damage from thermal expansion or contraction or mechanical shock. The adhesion or tie coating or layer 289 is also believed to decouple defects between the barrier coating or layer 288 and the COP substrate. This is believed to occur because any pinholes or other defects that may be formed when the adhesion or tie coating or layer 289 is applied tend not to be continued when the barrier coating or layer 288 is applied, so the pinholes or other defects in one coating do not line up with defects in the other. The adhesion or tie coating or layer 289 has some efficacy as a barrier layer, so even a defect providing a leakage path extending through the barrier coating or layer 289 is blocked by the adhesion or tie coating or layer 289.
The trilayer coating set 285 includes as a second layer a barrier coating or layer 288 that provides a barrier to oxygen that has permeated the COP wall. The barrier coating or layer 288 also is a barrier to extraction of the composition of the vessel wall 214 by the contents of the lumen 214.
The trilayer coating set 285 includes as a third layer a pH protective coating or layer 286 that provides protection of the underlying barrier coating or layer 288 against contents of the vessel, including where a surfactant is present.
The features of each layer of the trilayer coating set are further described below.
Tie Coating or Layer
The tie coating or layer 289 has at least two functions. One function of the tie coating or layer 289 is to improve adhesion of a barrier coating or layer 288 to a substrate, in particular a thermoplastic substrate. For example, a tie coating or layer, also referred to as an adhesion layer or coating can be applied to the substrate and the barrier layer can be applied to the adhesion layer to improve adhesion of the barrier layer or coating to the substrate.
Another function of the tie coating or layer 289 has been discovered: a tie coating or layer 289 applied under a barrier coating or layer 288 can improve the function of a pH protective coating or layer 286 applied over the barrier coating or layer 288.
The tie coating or layer 289 can be composed of, comprise, or consist essentially of SiOxCy, in which x is between 0.5 and 2.4 and y is between 0.6 and 3. Alternatively, the atomic ratio can be expressed as the formula SiwOxCy, The atomic ratios of Si, O, and C in the tie coating or layer 289 are, as several options:
The atomic ratio can be determined by XPS. Taking into account the H atoms, which are not measured by XPS, the tie coating or layer 289 may thus in one aspect have the formula SiwOxCyHz (or its equivalent SiOxCy), for example where w is 1, x is from about 0.5 to about 2.4, y is from about 0.6 to about 3, and z is from about 2 to about 9. Typically, tie coating or layer 289 would hence contain 36% to 41% carbon normalized to 100% carbon plus oxygen plus silicon.
Optionally, the tie coating or layer can be similar or identical in composition with the pH protective coating or layer 286 described elsewhere in this specification, although this is not a requirement.
The tie coating or layer 289 is contemplated generally to be from 5 nm to 100 nm thick, preferably from 5 to 20 nm thick, particularly if applied by chemical vapor deposition. These thicknesses are not critical. Commonly but not necessarily, the tie coating or layer 289 will be relatively thin, since its function is to change the surface properties of the substrate.
Barrier Layer
A barrier coating or layer 288 optionally can be deposited by plasma enhanced chemical vapor deposition (PECVD) or other chemical vapor deposition processes on the vessel of a pharmaceutical package, in particular a thermoplastic package, to prevent oxygen, carbon dioxide, or other gases from entering the vessel and/or to prevent leaching of the pharmaceutical material into or through the package wall.
The barrier coating or layer for any embodiment defined in this specification (unless otherwise specified in a particular instance) is a coating or layer, optionally applied by PECVD as indicated in U.S. Pat. No. 7,985,188. The barrier layer optionally is characterized as an “SiOx” coating, and contains silicon, oxygen, and optionally other elements, in which x, the ratio of oxygen to silicon atoms, is from about 1.5 to about 2.9, or 1.5 to about 2.6, or about 2. These alternative definitions of x apply to any use of the term SiOx in this specification. The barrier coating or layer is applied, for example to the interior of a pharmaceutical package or other vessel, for example a sample collection tube or another type of vessel.
The barrier coating 288 comprises or consists essentially of SiOx, wherein x is from 1.5 to 2.9, from 2 to 1000 nm thick, the barrier coating 288 of SiOx having an interior surface 220 facing the lumen 212 and an outer surface 222 facing the wall 214 article surface 254, the barrier coating 288 being effective to reduce the ingress of atmospheric gas into the lumen 212 compared to an uncoated vessel 250. One suitable barrier composition is one where x is 2.3, for example. For example, the barrier coating or layer such as 288 of any embodiment can be applied at a thickness of at least 2 nm, or at least 4 nm, or at least 7 nm, or at least 10 nm, or at least 20 nm, or at least 30 nm, or at least 40 nm, or at least 50 nm, or at least 100 nm, or at least 150 nm, or at least 200 nm, or at least 300 nm, or at least 400 nm, or at least 500 nm, or at least 600 nm, or at least 700 nm, or at least 800 nm, or at least 900 nm. The barrier coating or layer can be up to 1000 nm, or at most 900 nm, or at most 800 nm, or at most 700 nm, or at most 600 nm, or at most 500 nm, or at most 400 nm, or at most 300 nm, or at most 200 nm, or at most 100 nm, or at most 90 nm, or at most 80 nm, or at most 70 nm, or at most 60 nm, or at most 50 nm, or at most 40 nm, or at most 30 nm, or at most 20 nm, or at most 10 nm, or at most 5 nm thick. Ranges of 20-200 nm, optionally 20-30 nm, are contemplated. Specific thickness ranges composed of any one of the minimum thicknesses expressed above, plus any equal or greater one of the maximum thicknesses expressed above, are expressly contemplated.
The thickness of the SiOx or other barrier coating or layer can be measured, for example, by transmission electron microscopy (TEM), and its composition can be measured by X-ray photoelectron spectroscopy (XPS). The pH protective coating or layer described herein can be applied to a variety of pharmaceutical packages or other vessels made from plastic or glass, for example to plastic tubes, vessels, and syringes.
A barrier coating or layer 286 of SiOx, in which x is between 1.5 and 2.9, is applied by plasma enhanced chemical vapor deposition (PECVD) directly or indirectly to the thermoplastic wall 214 (for example a tie coating or layer 289 can be interposed between them) so that in the filled pharmaceutical package or other vessel 210 the barrier coating or layer 286 is located between the inner or interior surface 220 of the thermoplastic wall 214 and the fluid 218.
The barrier coating or layer 286 of SiOx is supported by the thermoplastic wall 214. The barrier coating or layer 286 as described elsewhere in this specification, or in U.S. Pat. No. 7,985,188, can be used in any embodiment.
Certain barrier coatings or layers 286 such as SiOx as defined here have been found to have the characteristic of being subject to being measurably diminished in barrier improvement factor in less than six months as a result of attack by certain relatively high pH contents of the coated vessel as described elsewhere in this specification, particularly where the barrier coating or layer directly contacts the contents. This issue can be addressed using a pH protective coating or layer as discussed in this specification.
pH Protective Coating or Layer
The inventors have found that barrier layers or coatings of SiOx are eroded or dissolved by some fluids, for example aqueous compositions having a pH above about 5. Since coatings applied by chemical vapor deposition can be very thin—tens to hundreds of nanometers thick—even a relatively slow rate of erosion can remove or reduce the effectiveness of the barrier layer in less time than the desired shelf life of a product package. This is particularly a problem for fluid pharmaceutical compositions, since many of them have a pH of roughly 7, or more broadly in the range of 5 to 9, similar to the pH of blood and other human or animal fluids. The higher the pH of the pharmaceutical preparation, the more quickly it erodes or dissolves the SiOx coating. Optionally, this problem can be addressed by protecting the barrier coating or layer 288, or other pH sensitive material, with a pH protective coating or layer 286.
Optionally, the pH protective coating or layer 286 can be composed of, comprise, or consist essentially of SiwOxCyHz (or its equivalent SiOxCy) or SiwNxCyHz or its equivalent SiNxCy), each as defined previously. The atomic ratio of Si:O:C or Si:N:C can be determined by XPS (X-ray photoelectron spectroscopy). Taking into account the H atoms, the pH protective coating or layer may thus in one aspect have the formula SiwOxCyHz, or its equivalent SiOxCy, for example where w is 1, x is from about 0.5 to about 2.4, y is from about 0.6 to about 3, and z is from about 2 to about 9.
Typically, expressed as the formula SiwOxCy, the atomic ratios of Si, O, and C are, as several options:
Alternatively, the pH protective coating or layer can have atomic concentrations normalized to 100% carbon, oxygen, and silicon, as determined by X-ray photoelectron spectroscopy (XPS) of less than 50% carbon and more than 25% silicon. Alternatively, the atomic concentrations are from 25 to 45% carbon, 25 to 65% silicon, and 10 to 35% oxygen. Alternatively, the atomic concentrations are from 30 to 40% carbon, 32 to 52% silicon, and 20 to 27% oxygen. Alternatively, the atomic concentrations are from 33 to 37% carbon, 37 to 47% silicon, and 22 to 26% oxygen.
The thickness of the pH protective coating or layer can be, for example:
Optionally, the atomic concentration of carbon in the protective layer, normalized to 100% of carbon, oxygen, and silicon, as determined by X-ray photoelectron spectroscopy (XPS), can be greater than the atomic concentration of carbon in the atomic formula for the organosilicon precursor. For example, embodiments are contemplated in which the atomic concentration of carbon increases by from 1 to 80 atomic percent, alternatively from 10 to 70 atomic percent, alternatively from 20 to 60 atomic percent, alternatively from 30 to 50 atomic percent, alternatively from 35 to 45 atomic percent, alternatively from 37 to 41 atomic percent.
Optionally, the atomic ratio of carbon to oxygen in the pH protective coating or layer can be increased in comparison to the organosilicon precursor, and/or the atomic ratio of oxygen to silicon can be decreased in comparison to the organosilicon precursor.
Optionally, the pH protective coating or layer can have an atomic concentration of silicon, normalized to 100% of carbon, oxygen, and silicon, as determined by X-ray photoelectron spectroscopy (XPS), less than the atomic concentration of silicon in the atomic formula for the feed gas. For example, embodiments are contemplated in which the atomic concentration of silicon decreases by from 1 to 80 atomic percent, alternatively by from 10 to 70 atomic percent, alternatively by from 20 to 60 atomic percent, alternatively by from 30 to 55 atomic percent, alternatively by from 40 to 50 atomic percent, alternatively by from 42 to 46 atomic percent.
As another option, a pH protective coating or layer is contemplated that can be characterized by a sum formula wherein the atomic ratio C:O can be increased and/or the atomic ratio Si:O can be decreased in comparison to the sum formula of the organosilicon precursor.
The pH protective coating or layer 286 commonly is located between the barrier coating or layer 288 and the fluid 218 in the finished article such as the pharmaceutical package 210 shown in
The pH protective coating or layer 286 optionally is effective to keep the barrier coating or layer 288 at least substantially undissolved as a result of attack by the fluid 218 for a period of at least six months.
The pH protective coating or layer can have a density between 1.25 and 1.65 g/cm3, alternatively between 1.35 and 1.55 g/cm3, alternatively between 1.4 and 1.5 g/cm3, alternatively between 1.4 and 1.5 g/cm3, alternatively between 1.44 and 1.48 g/cm3, as determined by X-ray reflectivity (XRR). Optionally, the organosilicon compound can be octamethylcyclotetrasiloxane and the pH protective coating or layer can have a density which can be higher than the density of a pH protective coating or layer made from HMDSO as the organosilicon compound under the same PECVD reaction conditions.
The pH protective coating or layer optionally can prevent or reduce the precipitation of a compound or component of a composition in contact with the pH protective coating or layer, in particular can prevent or reduce insulin precipitation or blood clotting, in comparison to the uncoated surface and/or to a barrier coated surface using HMDSO as precursor.
The interior surface of the pH protective coating or layer optionally can have a contact angle (with distilled water) of from 90° to 110°, optionally from 80° to 120°, optionally from 70° to 130°, as measured by Goniometer Angle measurement of a water droplet on the pH protective surface, per ASTM D7334-08 “Standard Practice for Surface Wettability of Coatings, Substrates and Pigments by Advancing Contact Angle Measurement.”
The passivation layer or pH protective coating or layer 286 optionally shows an O-Parameter measured with attenuated total reflection (ATR) of less than 0.4, measured as:
The O-Parameter is defined in U.S. Pat. No. 8,067,070, which claims an O-parameter value of most broadly from 0.4 to 0.9. It can be measured from physical analysis of an FTIR amplitude versus wave number plot to find the numerator and denominator of the above expression, as shown in
U.S. Pat. No. 8,067,070 asserts that the claimed O-parameter range provides a superior pH protective coating or layer, relying on experiments only with HMDSO and HMDSN, which are both non-cyclic siloxanes. Surprisingly, it has been found by the present inventors that if the PECVD precursor is a cyclic siloxane, for example OMCTS, O-parameters outside the ranges claimed in U.S. Pat. No. 8,067,070, using OMCTS, provide even better results than are obtained in U.S. Pat. No. 8,067,070 with HMDSO.
Alternatively in any embodiment, the O-parameter has a value of from 0.1 to 0.39, or from 0.15 to 0.37, or from 0.17 to 0.35.
Even another aspect is a composite material according to any embodiment, wherein the passivation layer shows an N-Parameter measured with attenuated total reflection (ATR) of less than 0.7, measured as:
The N-Parameter is also described in U.S. Pat. No. 8,067,070, and is measured analogously to the O-Parameter except that intensities at two specific wave numbers are used—neither of these wave numbers is a range. U.S. Pat. No. 8,067,070 claims a passivation layer with an N-Parameter of 0.7 to 1.6. Again, the present inventors have made better coatings employing a pH protective coating or layer 286 having an N-Parameter lower than 0.7, as described above. Alternatively, the N-parameter has a value of at least 0.3, or from 0.4 to 0.6, or at least 0.53.
The rate of erosion, dissolution, or leaching (different names for related concepts) of the pH protective coating or layer 286, if directly contacted by the fluid 218, is less than the rate of erosion of the barrier coating or layer 288, if directly contacted by the fluid 218.
The thickness of the pH protective coating or layer is contemplated to be from 50-500 nm, with a preferred range of 100-200 nm.
The pH protective coating or layer 286 is effective to isolate the fluid 218 from the barrier coating or layer 288, at least for sufficient time to allow the barrier coating to act as a barrier during the shelf life of the pharmaceutical package or other vessel 210.
The inventors have further found that certain pH protective coatings or layers of SiOxCy or SiNxCy formed from cyclic polysiloxane precursors, which pH protective coatings or layers have a substantial organic component, do not erode quickly when exposed to fluids, and in fact erode or dissolve more slowly when the fluids have higher pHs within the range of 5 to 9. For example, at pH 8, the dissolution rate of a pH protective coating or layer made from the precursor octamethylcyclotetrasiloxane, or OMCTS, is quite slow. These pH protective coatings or layers of SiOxCy or SiNxCy can therefore be used to cover a barrier layer of SiOx, retaining the benefits of the barrier layer by protecting it from the fluid in the pharmaceutical package. The protective layer is applied over at least a portion of the SiOx layer to protect the SiOx layer from contents stored in a vessel, where the contents otherwise would be in contact with the SiOx layer.
Although the present invention does not depend upon the accuracy of the following theory, it is further believed that effective pH protective coatings or layers for avoiding erosion can be made from cyclic siloxanes and silazanes as described in this disclosure. SiOxCy or SiNxCy coatings deposited from cyclic siloxane or linear silazane precursors, for example octamethylcyclotetrasiloxane (OMCTS), are believed to include intact cyclic siloxane rings and longer series of repeating units of the precursor structure. These coatings are believed to be nanoporous but structured and hydrophobic, and these properties are believed to contribute to their success as pH protective coatings or layers, and also protective coatings or layers. This is shown, for example, in U.S. Pat. No. 7,901,783.
SiOxCy or SiNxCy coatings also can be deposited from linear siloxane or linear silazane precursors, for example hexamethyldisiloxane (HMDSO) or tetramethyldisiloxane (TMDSO).
Optionally an FTIR absorbance spectrum of the pH protective coating or layer 286 of any embodiment has a ratio greater than 0.75 between the maximum amplitude of the Si—O—Si symmetrical stretch peak normally located between about 1000 and 1040 cm-1, and the maximum amplitude of the Si—O—Si assymmetric stretch peak normally located between about 1060 and about 1100 cm-1. Alternatively in any embodiment, this ratio can be at least 0.8, or at least 0.9, or at least 1.0, or at least 1.1, or at least 1.2. Alternatively in any embodiment, this ratio can be at most 1.7, or at most 1.6, or at most 1.5, or at most 1.4, or at most 1.3. Any minimum ratio stated here can be combined with any maximum ratio stated here, as an alternative embodiment.
Optionally, in any embodiment the pH protective coating or layer 286, in the absence of the medicament, has a non-oily appearance. This appearance has been observed in some instances to distinguish an effective pH protective coating or layer from a lubricity layer, which in some instances has been observed to have an oily (i.e. shiny) appearance.
Optionally, for the pH protective coating or layer 286 in any embodiment, the silicon dissolution rate by a 50 mM potassium phosphate buffer diluted in water for injection, adjusted to pH 8 with concentrated nitric acid, and containing 0.2 wt. % polysorbate-80 surfactant, (measured in the absence of the medicament, to avoid changing the dissolution reagent), at 40° C., is less than 170 ppb/day. (Polysorbate-80 is a common ingredient of pharmaceutical preparations, available for example as Tween®-80 from Uniqema Americas LLC, Wilmington Del.)
Optionally, for the pH protective coating or layer 286 in any embodiment, the silicon dissolution rate is less than 160 ppb/day, or less than 140 ppb/day, or less than 120 ppb/day, or less than 100 ppb/day, or less than 90 ppb/day, or less than 80 ppb/day. Optionally, in any embodiment the silicon dissolution rate is more than 10 ppb/day, or more than 20 ppb/day, or more than 30 ppb/day, or more than 40 ppb/day, or more than 50 ppb/day, or more than 60 ppb/day. Any minimum rate stated here can be combined with any maximum rate stated here for the pH protective coating or layer 286 in any embodiment.
Optionally, for the pH protective coating or layer 286 in any embodiment the total silicon content of the pH protective coating or layer and barrier coating, upon dissolution into a test composition with a pH of 8 from the vessel, is less than 66 ppm, or less than 60 ppm, or less than 50 ppm, or less than 40 ppm, or less than 30 ppm, or less than 20 ppm.
pH Protective Coating or Layer Properties of any Embodiment Theory of Operation
The inventors offer the following theory of operation of the pH protective coating or layer described here. The invention is not limited by the accuracy of this theory or to the embodiments predictable by use of this theory.
The dissolution rate of the SiOx barrier layer is believed to be dependent on SiO bonding within the layer. Oxygen bonding sites (silanols) are believed to increase the dissolution rate.
It is believed that the OMCTS-based pH protective coating or layer bonds with the silanol sites on the SiOx barrier layer to “heal” or passivate the SiOx surface and thus dramatically reduces the dissolution rate. In this hypothesis, the thickness of the OMCTS layer is not the primary means of protection—the primary means is passivation of the SiOx surface. It is contemplated that a pH protective coating or layer as described in this specification can be improved by increasing the crosslink density of the pH protective coating or layer.
Use of a coating or layer according to any described embodiment is contemplated as a pH protective coating or layer preventing dissolution of the barrier coating in contact with a fluid.
Some conditions optionally used for production of pH Protective Layers are shown in Table 1.
Vessel samples were produced as follows. A COC 8007 vessel was produced according to the Protocol for Forming COC Vessel. An SiOx barrier coating or layer was applied to the vessels according to the Protocol for Coating COC Vessel Interior with SiOx. A pH protective coating or layer was applied to the SiOx coated vessels according to the Protocol for Coating COC Vessel Interior with OMCTS, modified as follows. Argon carrier gas and oxygen were used where noted in Table 2.
The process conditions were set to the following, or as indicated in Table 2:
The silicon was extracted using saline water digestion. The vessel was filled with two milliliters of 0.9% aqueous saline solution and sealed. The vessel was set into a PTFE test stand and placed in an oven at 50° C. for 72 hours.
Then, the saline solution was removed from the vesseland the fluid obtained from each vessel was brought to a volume of 50 ml using 18.2M0-cm deionized water and further diluted 2× to minimize sodium background during analysis.
Next, the fluid recovered from each vessel was tested for extractable silicon using the Protocol for Measuring Dissolved Silicon in a Vessel. The instrument used was a Perkin Elmer Elan DRC II equipped with a Cetac ASX-520 autosampler. The following ICP-MS conditions were employed:
Aliquots from aqueous dilutions obtained from vessels 2, 3, and 4 were injected and analyzed for Si in concentration units of micrograms per liter. The results of this test are shown in Table 2. While the results are not quantitative, they do indicate that extractables from the pH protective coating or layer are not clearly higher than the extractables for the SiOx barrier layer only.
Vessel samples 6, 7, and 8, employing three different pH protective coatings or layers, were produced in the same manner as for Examples 2-5 except as otherwise indicated in Table 3:
Vessel 6 had a three-component pH protective coating or layer employing OMCTS, oxygen, and carrier gas. Vessel 7 had a two component pH protective coating or layer employing OMCTS and oxygen, but no carrier gas. Vessel 8 had a one-component pH protective coating or layer (OMCTS only). Vessels 6-8 were then tested for lubricity as described for Examples 2-5.
The pH protective coatings or layers produced according to these working examples are also contemplated to function as protective coatings or layers to increase the shelf life of the vessels, compared to similar vessels provided with a barrier coating or layer but no pH protective coating or layer.
Examples 6-8 using an OMCTS precursor gas were repeated in Examples 9-11, except that HMDSO was used as the precursor in Examples 9-11. The results are shown in Table 4. The coatings produced according to these working examples are contemplated to function as pH protective coatings or layers, and also as protective coatings or layers to increase the shelf life of the vessels, compared to similar vessels provided with a barrier coating or layer but no pH protective coating or layer.
Silicon extractables from vessels were measured using ICP-MS analysis as described in the Protocol for Measuring Dissolved Silicon in a Vessel. The vessels were evaluated in both static and dynamic situations. The Protocol for Measuring Dissolved Silicon in a Vessel, modified as follows, describes the test procedure:
The extractable Silicon Levels from a silicon oil coated glass vessel and a protective coated and SiOx coated COC vessel are shown in Table 5. Precision of the ICP-MS total silicon measurement is +/−3%.
Summary of Lubricity and/or Protective Measurements
Table 6 shows a summary of the above OMCTS coatings or layers
The Protocol for Measuring Dissolved Silicon in a Vessel is followed, except as modified here. Test solutions—50 mM buffer solutions at pH 3, 6, 7, 8, 9, and 12 are prepared. Buffers are selected having appropriate pKa values to provide the pH values being studied. A potassium phosphate buffer is selected for pH 3, 7, 8 and 12, a sodium citrate buffer is utilized for pH 6 and tris buffer is selected for pH 9. 3 ml of each test solution is placed in borosilicate glass 5 ml pharmaceutical vessels and SiOx coated 5 ml thermoplastic pharmaceutical vessels. The vessels are all closed with standard coated stoppers and crimped. The vessels are placed in storage at 20-25° C. and pulled at various time points for inductively coupled plasma spectrometer (ICP) analysis of Si content in the solutions contained in the vessels, in parts per billion (ppb) by weight, for different storage times.
The Protocol for Determining Average Dissolution Rate Si content is used to monitor the rate of glass dissolution, except as modified here. The data is plotted to determine an average rate of dissolution of borosilicate glass or SiOx coating at each pH condition. Representative plots at pH 6 through 8 are
The rate of Si dissolution in ppb is converted to a predicted thickness (nm) rate of Si dissolution by determining the total weight of Si removed, then using a surface area calculation of the amount of vessel surface (11.65 cm2) exposed to the solution and a density of SiOx of 2.2 g/cm3.
The coating thicknesses in
The following conclusions are reached, based on this test. First, the amount of dissolved Si in the SiOx coating or glass increases exponentially with increasing pH. Second, the SiOx coating dissolves more slowly than borosilicate glass at a pH lower than 8. The SiOx coating shows a linear, monophasic dissolution over time, whereas borosilicate glass tends to show a more rapid dissolution in the early hours of exposure to solutions, followed by a slower linear dissolution. This may be due to surface accumulation of some salts and elements on borosilicate during the forming process relative to the uniform composition of the SiOx coating. This result incidentally suggests the utility of an SiOx coating on the wall of a borosilicate glass vessel to reduce dissolution of the glass at a pH lower than 8. Third, PECVD applied barrier coatings for vessels in which pharmaceutical preparations are stored will need to be adapted to the specific pharmaceutical preparation and proposed storage conditions (or vice versa), at least in some instances in which the pharmaceutical preparation interacts with the barrier coating significantly.
An experiment is conducted with vessels coated with SiOx coating+OMCTS pH protective coating or layer, to test the pH protective coating or layer for its functionality as a protective coating or layer. The vessels are 5 mL vessels (the vessels are normally filled with product to 5 mL; their capacity without headspace, when capped, is about 7.5 mL) composed of cyclic olefin co-polymer (COC, Topas® 6013M-07).
Sixty vessels are coated on their interior surfaces with an SiOx coating produced in a plasma enhanced chemical vapor deposition (PECVD) process using a HMDSO precursor gas according to the Protocol for Coating Tube Interior with SiOx set forth above, except that equipment suitable for coating a vessel is used. The following conditions are used.
Next the SiOx coated vessels are coated over the SiOx with an SiOxCy coating produced in a PECVD process using an OMCTS precursor gas according to the Protocol for Coating COC Vessel Interior with OMCTS Lubricity Coating set forth above, except that the same coating equipment is used as for the SiOx coating. The following conditions are used.
Eight vessels are selected and the total deposited quantity of PECVD coating (SiOx+SiOxCy) is determined with a Perkin Elmer Optima Model 7300DV ICP-OES instrument, using the Protocol for Total Silicon Measurement set forth above. This measurement determines the total amount of silicon in both coatings, and does not distinguish between the respective SiOx and SiOxCy coatings. The results are shown below.
In the following work, except as indicated otherwise in this example, the Protocol for Determining Average Dissolution Rate is followed. Two buffered pH test solutions are used in the remainder of the experiment, respectively at pH 4 and pH 8 to test the effect of pH on dissolution rate. Both test solutions are 50 mM buffers using potassium phosphate as the buffer, diluted in water for injection (WFI) (0.1 um sterilized, filtered). The pH is adjusted to pH 4 or 8, respectively, with concentrated nitric acid.
25 vessels are filled with 7.5 ml per vessel of pH 4 buffered test solution and 25 other vessels are filled with 7.5 ml per vessel of pH 4 buffered test solution (note the fill level is to the top of the vessel—no head space). The vessels are closed using prewashed butyl stoppers and aluminum crimps. The vessels at each pH are split into two groups. One group at each pH containing 12 vessels is stored at 4° C. and the second group of 13 vessels is stored at 23° C.
The vessels are sampled at Days 1, 3, 6, and 8. The Protocol for Measuring Dissolved Silicon in a Vessel is used, except as otherwise indicated in this example. The analytical result is reported on the basis of parts per billion of silicon in the buffered test solutions of each vessel. A dissolution rate is calculated in terms of parts per billion per day as described above in the Protocol for Determining Average Dissolution Rate. The results at the respective storage temperatures follow:
The observations of Si dissolution versus time for the OMCTS-based coating at pH8 and pH 4 indicate the pH 4 rates are higher at ambient conditions. Thus, the pH 4 rates are used to determine how much material would need to be initially applied to leave a coating of adequate thickness at the end of the shelf life, taking account of the amount of the initial coating that would be dissolved. The results of this calculation are:
Based on this calculation, the OMCTS protective layer needs to be about 2.5 times thicker—resulting in dissolution of 33945 ppb versus the 14,371 ppb representing the entire mass of coating tested—to achieve a 3-year calculated shelf life.
The results of Comparative Example 13 and Example 14 above can be compared as follows, where the “pH protective coating or layer” is the coating of SiOxCy referred to in Example BB.
This data shows that the silicon dissolution rate of SiOx alone is reduced by more than 2 orders of magnitude at pH 8 in vessels also coated with SiOxCy coatings.
Another comparison is shown by the following data from several different experiments carried out under similar accelerated dissolution conditions.
Row A (SiOx with OMCTS coating) versus C (SiOx without OMCTS coating) show that the OMCTS pH protective coating or layer is also an effective protective coating or layer to the SiOx coating at pH 8. The OMCTS coating reduced the one-day dissolution rate from 2504 ug/L (“u” or μ or the Greek letter “mu” as used herein are identical, and are abbreviations for “micro”) to 165 ug/L.
Samples 1-6 as listed in Table 7 were prepared as described in Example 13, with further details as follows.
A cyclic olefin copolymer (COC) resin was injection molded to form a batch of 5 ml vessels. Silicon chips were adhered with double-sided adhesive tape to the internal walls of the vessels. The vessels and chips were coated with a two layer coating by plasma enhanced chemical vapor deposition (PECVD). The first layer was composed of SiOx with barrier properties as defined in the present disclosure, and the second layer was an SiOxCy pH protective coating or layer.
A precursor gas mixture comprising OMCTS, argon, and oxygen was introduced inside each vessel. The gas inside the vessel was excited between capacitively coupled electrodes by a radio-frequency (13.56 MHz) power source. The monomer flow rate (Fm) in units of sccm, oxygen flow rate (Fo) in units of sccm, argon flowrate in sccm, and power (W) in units of watts are shown in Table 7.
A composite parameter, W/FM in units of kJ/kg, was calculated from process parameters W, Fm, Fo and the molecular weight, M in g/mol, of the individual gas species. W/FM is defined as the energy input per unit mass of polymerizing gases. Polymerizing gases are defined as those species that are incorporated into the growing coating such as, but not limited to, the monomer and oxygen. Non-polymerizing gases, by contrast, are those species that are not incorporated into the growing coating, such as but not limited to argon, helium and neon.
In this test, PECVD processing at high W/FM is believed to have resulted in higher monomer fragmentation, producing organosiloxane coatings with higher cross-link density. PECVD processing at low W/FM, by comparison, is believed to have resulted in lower monomer fragmentation producing organosiloxane coatings with a relatively lower cross-link density.
The relative cross-link density of samples 5, 6, 2, and 3 was compared between different coatings by measuring FTIR absorbance spectra. The spectra of samples 5, 6, 2, and 3 are provided in
A qualitative relation—whether the coating appeared oily (shiny, often with irridescence) or non-oily (non-shiny) when applied on the silicon chips—was also found to correlate with the W/FM values in Table 7. Oily appearing coatings deposited at lower W/FM values, as confirmed by Table 7, are believed to have a lower crosslink density, as determined by their lower sym/asym ratio, relative to the non-oily coatings that were deposited at higher W/FM and a higher cross-link density. The only exception to this general rule of thumb was sample 2 in Table 7. It is believed that the coating of sample 2 exhibited a non-oily appearance because it was was too thin to see. Thus, an oilyness observation was not reported in Table 7 for sample 2. The chips were analyzed by FTIR in transmission mode, with the infrared spectrum transmitted through the chip and sample coating, and the transmission through an uncoated null chip subtracted.
Non-oily organosiloxane layers produced at higher W/FM values, which protect the underlying SiOx coating from aqueous solutions at elevated pH and temperature, were preferred because they provided lower Si dissolution and a longer shelf life, as confirmed by Table 7. For example, the calculated silicon dissolution by contents of the vessel at a pH of 8 and 40° C. was reduced for the non-oily coatings, and the resulting shelf life was 1381 days in one case and 1147 days in another, as opposed to the much shorter shelf lives and higher rates of dissolution for oily coatings. Calculated shelf life was determined as shown for Example 13. The calculated shelf life also correlated linearly to the ratio of symmetric to asymmetric stretching modes of the Si—O—Si bond in organosiloxane pH protective coatings or layers.
Sample 6 can be particularly compared to Sample 5. An organosiloxane, pH protective coating or layer was deposited according to the process conditions of sample 6 in Table 7. The coating was deposited at a high W/FM. This resulted in a non-oily coating with a high Si—O—Si sym/asym ratio of 0.958, which resulted in a low rate of dissolution of 84.1 ppb/day (measured by the Protocol for Determining Average Dissolution Rate) and long shelf life of 1147 days (measured by the Protocol for Determining Calculated Shelf Life). The FTIR spectra of this coating exhibits a relatively similar asymmetric Si—O—Si peak absorbance compared to the symmetric Si—O—Si peak absorbance. This is an indication of a higher cross-link density coating, which is a preferred characteristic for pH protection and long shelf life.
An organosiloxane pH protective coating or layer was deposited according to the process conditions of sample 5 in Table 7. The coating was deposited at a moderate W/FM. This resulted in an oily coating with a low Si—O—Si sym/asym ratio of 0.673, which resulted in a high rate of dissolution of 236.7 ppb/day (following the Protocol for Determining Average Dissolution Rate) and shorter shelf life of 271 days (following the Protocol for Determining Calculated Shelf Life). The FTIR spectrum of this coating exhibits a relatively high asymmetric Si—O—Si peak absorbance compared to the symmetric Si—O—Si peak absorbance. This is an indication of a lower cross-link density coating, which is contemplated to be an unfavorable characteristic for pH protection and long shelf life.
Sample 2 can be particularly compared to Sample 3. A pH protective coating or layer was deposited according to the process conditions of sample 2 in Table 7. The coating was deposited at a low W/FM. This resulted in a coating that exhibited a low Si—O—Si sym/asym ratio of 0.582, which resulted in a high rate of dissolution of 174 ppb/day and short shelf life of 107 days. The FTIR spectrum of this coating exhibits a relatively high asymmetric Si—O—Si peak absorbance compared to the symmetric Si—O—Si peak absorbance. This is an indication of a lower cross-link density coating, which is an unfavorable characteristic for pH protection and long shelf life.
An organosiloxane, pH protective coating or layer was deposited according to the process conditions of sample 3 in Table 7. The coating was deposited at a high W/FM. This resulted in a non-oily coating with a high Si—O—Si sym/asym ratio of 0.947, which resulted in a low rate of Si dissolution of 79.5 ppb/day (following the Protocol for Determining Average Dissolution Rate) and long shelf life of 1381 days (following the Protocol for Determining Calculated Shelf Life). The FTIR spectrum of this coating exhibits a relatively similar asymmetric Si—O—Si peak absorbance compared to the symmetric Si—O—Si peak absorbance. This is an indication of a higher cross-link density coating, which is a preferred characteristic for pH protection and long shelf life.
An experiment similar to Example 14 was carried out, modified as indicated in this example and in Table 8 (where the results are tabulated). 100 5 mL COP vessels were made and coated with an SiOx barrier layer and an OMCTS-based pH protective coating or layer as described previously, except that for Sample PC194 only the pH protective coating or layer was applied. The coating quantity was again measured in parts per billion extracted from the surfaces of the vessels to remove the entire pH protective coating or layer, as reported in Table 8.
In this example, several different coating dissolution conditions were employed. The test solutions used for dissolution contained either 0.02 or 0.2 wt. % polysorbate-80 surfactant, as well as a buffer to maintain a pH of 8. Dissolution tests were carried out at either 23° C. or 40° C.
Multiple vessels were filled with each test solution, stored at the indicated temperature, and analyzed at several intervals to determine the extraction profile and the amount of silicon extracted. An average dissolution rate for protracted storage times was then calculated by extrapolating the data obtained according to the Protocol for Determining Average Dissolution Rate. The results were calculated as described previously and are shown in Table 8. Of particular note, as shown on Table 8, were the very long calculated shelf lives of the filled packages provided with a PC 194 pH protective coating or layer:
21045 days (over 57 years) based on storage at a pH of 8, 0.02 wt. % polysorbate-80 surfactant, at 23° C.;
38768 days (over 100 years) based on storage at a pH of 8, 0.2 wt. % polysorbate-80 surfactant, at 23° C.;
8184 days (over 22 years) based on storage at a pH of 8, 0.02 wt. % polysorbate-80 surfactant, at 40° C.; and
14732 days (over 40 years) based on storage at a pH of 8, 0.2 wt. % polysorbate-80 surfactant, at 40° C.
Referring to Table 8, the longest calculated shelf lives corresponded with the use of an RF power level of 150 Watts and a corresponding high W/FM value. It is believed that the use of a higher power level causes higher cross-link density of the pH protective coating or layer.
Another series of experiments similar to those of Example 17 are run, showing the effect of progressively increasing the RF power level on the FTIR absorbance spectrum of the pH protective coating or layer. The results are tabulated in Table 9, which in each instance shows a symmetric/assymmetric ratio greater than 0.75 between the maximum amplitude of the Si—O—Si symmetrical stretch peak normally located between about 1000 and 1040 cm-1, and the maximum amplitude of the Si—O—Si assymmetric stretch peak normally located between about 1060 and about 1100 cm-1. Thus, the symmetric/assymmetric ratio is 0.79 at a power level of 20 W, 1.21 or 1.22 at power levels of 40, 60, or 80 W, and 1.26 at 100 Watts under otherwise comparable conditions.
The 150 Watt data in Table 9 is taken under somewhat different conditions than the other data, so it is not directly comparable with the 20-100 Watt data discussed above. The FTIR data of samples 6 and 8 of Table 9 was taken from the upper portion of the vessel and the FTIR data of samples 7 and 9 of Table 9 was taken from the lower portion of the vessel. Also, the amount of OMCTS was cut in half for samples 8 and 9 of Table 9, compared to samples 6 and 7. Reducing the oxygen level while maintaining a power level of 150 W raised the symmetric/asymmetric ratio still further, as shown by comparing samples 6 and 7 to samples 8 and 9 in Table 9.
It is believed that, other conditions being equal, increasing the symmetric/asymmetric ratio increases the shelf life of a vessel filled with a material having a pH exceeding 5.
Table 10 shows the calculated O-Parameters and N-Parameters (as defined in U.S. Pat. No. 8,067,070) for the experiments summarized in Table 9. As Table 10 shows, the O-Parameters ranged from 0.134 to 0.343, and the N-Parameters ranged from 0.408 to 0.623—all outside the ranges claimed in U.S. Pat. No. 8,067,070.
Optionally in any embodiment of the vessel, the barrier coating or layer comprises SiOx, where x is from 1.5 to 2.9.
Optionally in any embodiment of the vessel, the barrier coating or layer consists essentially of SiOx, where x is from 1.5 to 2.9.
Optionally in any embodiment of the vessel, the barrier coating or layer is deposited by vapor deposition.
Optionally in any embodiment of the vessel, the barrier coating or layer is deposited by chemical vapor deposition.
Optionally in any embodiment of the vessel, the barrier coating or layer is deposited by plasma enhanced chemical vapor deposition.
Optionally in any embodiment of the vessel, the pH protective coating or layer is deposited by vapor deposition.
Optionally in any embodiment of the vessel, the pH protective coating or layer is deposited by chemical vapor deposition.
Optionally in any embodiment of the vessel, the pH protective coating or layer is deposited by plasma enhanced chemical vapor deposition. Graded Composite Layer
Another expedient contemplated here, for adjacent layers of SiOx and a pH protective coating or layer, is a graded composite of any two or more adjacent PECVD layers, for example the barrier coating or layer 288 and a pH protective coating or layer 286. A graded composite can be separate layers of a pH protective and/or barrier layer or coating with a transition or interface of intermediate composition between them, or separate layers of a protective and/or hydrophobic layer and SiOx with an intermediate distinct pH protective coating or layer of intermediate composition between them, or a single coating or layer that changes continuously or in steps from a composition of a protective and/or hydrophobic layer to a composition more like SiOx, going through the pH protective coating or layer in a normal direction.
The grade in the graded composite can go in either direction. For example, the composition of SiOx can be applied directly to the substrate and graduate to a composition further from the surface of a pH protective coating or layer, and optionally can further graduate to another type of coating or layer, such as a hydrophobic coating or layer or a lubricity coating or layer. Additionally, in any embodiment an adhesion coating or layer, for example SiwOxCy, or its equivalent SiOxCy, optionally can be applied directly to the substrate before applying the barrier layer. A graduated pH protective coating or layer is particularly contemplated if a layer of one composition is better for adhering to the substrate than another, in which case the better-adhering composition can, for example, be applied directly to the substrate. It is contemplated that the more distant portions of the graded pH protective coating or layer can be less compatible with the substrate than the adjacent portions of the graded pH protective coating or layer, since at any point the pH protective coating or layer is changing gradually in properties, so adjacent portions at nearly the same depth of the pH protective coating or layer have nearly identical composition, and more widely physically separated portions at substantially different depths can have more diverse properties. It is also contemplated that a pH protective coating or layer portion that forms a better barrier against transfer of material to or from the substrate can be directly against the substrate, to prevent the more remote pH protective coating or layer portion that forms a poorer barrier from being contaminated with the material intended to be barred or impeded by the barrier.
The applied coatings or layers, instead of being graded, optionally can have sharp transitions between one layer and the next, without a substantial gradient of composition. Such pH protective coating or layer can be made, for example, by providing the gases to produce a layer as a steady state flow in a non-plasma state, then energizing the system with a brief plasma discharge to form a coating or layer on the substrate. If a subsequent coating or layer is to be applied, the gases for the previous coating or layer are cleared out and the gases for the next coating or layer are applied in a steady-state fashion before energizing the plasma and again forming a distinct layer on the surface of the substrate or its outermost previous coating or layer, with little if any gradual transition at the interface.
Common Conditions for All Embodiments
In any embodiment contemplated here, many common conditions can be used, for example any of the following, in any combination. For example, the low-pressure PECVD process described in U.S. Pat. No. 7,985,188 can be used. A brief synopsis of that process follows.
The organosilicon precursor for the protective layer can include any of the following precursors useful for PECVD. The precursor for the PECVD coating or layer of the present invention is broadly defined as an organometallic precursor. An organometallic precursor is defined in this specification as comprehending compounds of metal elements from Group III and/or Group IV of the Periodic Table having organic residues, for example hydrocarbon, aminocarbon or oxycarbon residues. Organometallic compounds as presently defined include any precursor having organic moieties bonded to silicon or other Group III/IV metal atoms directly, or optionally bonded through oxygen or nitrogen atoms. The relevant elements of Group III of the Periodic Table are Boron, Aluminum, Gallium, Indium, Thallium, Scandium, Yttrium, and Lanthanum, Aluminum and Boron being preferred. The relevant elements of Group IV of the Periodic Table are Silicon, Germanium, Tin, Lead, Titanium, Zirconium, Hafnium, and Thorium, with Silicon and Tin being preferred. Other volatile organic compounds can also be contemplated. However, organosilicon compounds are preferred for performing present invention.
An organosilicon precursor is contemplated, where an “organosilicon precursor” is defined throughout this specification most broadly as a compound having the linkage:
The structure immediately above is a tetravalent silicon atom connected to an oxygen atom and an organic carbon atom (an organic carbon atom being a carbon atom bonded to at least one hydrogen atom). Optionally, the organosilicon precursor is selected from the group consisting of a linear siloxane, a monocyclic siloxane, a polycyclic siloxane, a polysilsesquioxane, a linear silazane, a monocyclic silazane, a polycyclic silazane, a polysilsesquiazane, and a combination of any two or more of these precursors. Also contemplated as a precursor, though not within the two formulas immediately above, is an alkyl trimethoxysilane.
If an oxygen-containing precursor (for example a siloxane) is used, a representative predicted empirical composition resulting from PECVD under conditions forming a coating or layer would be SiwOxCyHz or its equivalent SiOxCy as defined in the Definition Section, while a representative predicted empirical composition resulting from PECVD under conditions forming a barrier coating or layer would be SiOx, where x in this formula is from about 1.5 to about 2.9.
One type of precursor starting material having the above empirical formula is a linear siloxane, for example a material having the following formula:
in which each R is independently selected from alkyl, for example methyl, ethyl, propyl, isopropyl, butyl, isobutyl, t-butyl, vinyl, alkyne, or others, and n is 1, 2, 3, 4, or greater, optionally two or greater. Several examples of contemplated linear siloxanes are
hexamethyldisiloxane (HMDSO),
octamethyltrisiloxane,
decamethyltetrasiloxane,
dodecamethylpentasiloxane,
or combinations of two or more of these.
Another type of precursor starting material, among the preferred starting materials in the present context, is a monocyclic siloxane, for example a material having the following structural formula:
in which R is defined as for the linear structure and “a” is from 3 to about 10, or the analogous monocyclic silazanes. Several examples of contemplated hetero-substituted and unsubstituted monocyclic siloxanes and silazanes include
Another type of precursor starting material, among the preferred starting materials in the present context, is a polycyclic siloxane, for example a material having one of the following structural formulas:
in which Y can be oxygen or nitrogen, E is silicon, and Z is a hydrogen atom or an organic substituent, for example alkyl such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, t-butyl, vinyl, alkyne, or others. When each Y is oxygen, the respective structures, from left to right, are a Silatrane, a Silquasilatrane, and a Silproatrane.
Another type of polycyclic siloxane precursor starting material, among the preferred starting materials in the present context, is a polysilsesquioxane, with the empirical formula RSiO1.5 and the structural formula:
in which each R is a hydrogen atom or an organic substituent, for example alkyl such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, t-butyl, vinyl, alkyne, or others. Two commercial materials of this sort are SST-eM01 poly(methylsilsesquioxane), in which each R is methyl, and SST-3MH1.1 poly(Methyl-Hydridosilsesquioxane), in which 90% of the R groups are methyl, 10% are hydrogen atoms. This material is available in a 10% solution in tetrahydrofuran, for example. Combinations of two or more of these are also contemplated. Other examples of a contemplated precursor are methylsilatrane, CAS No. 2288-13-3, in which each Y is oxygen and Z is methyl, poly(methylsilsesquioxane) (for example SST-eM01 poly(methylsilsesquioxane)), in which each R optionally can be methyl, SST-3MH1.1 poly(Methyl-Hydridosilsesquioxane) (for example SST-3MH1.1 poly(Methyl-Hydridosilsesquioxane)), in which 90% of the R groups are methyl and 10% are hydrogen atoms, or a combination of any two or more of these.
One particularly contemplated precursor for the barrier coating or layer according to the present invention is a linear siloxane, for example is HMDSO. One particularly contemplated precursor for the pH protective coating or layer according to the present invention is a cyclic siloxane, for example octamethylcyclotetrasiloxane (OMCTS).
It is believed that under certain conditions the OMCTS or other cyclic siloxane molecule provides several advantages over other siloxane materials. First, its ring structure results in a less dense coating or layer (as compared to a coating or layer prepared from HMDSO). The molecule also allows selective ionization so that the final structure and chemical composition of the coating or layer can be directly controlled through the application of the plasma power. Other organosilicon molecules are readily ionized (fractured) so that it is more difficult to retain the original structure of the molecule.
Under certain other conditions, acyclic siloxane molecules such as TMDSO or HMDSO can instead be used to provide a suitable tie coating or layer 289, barrier coating or layer 288, or pH protective coating or layer 286.
Optionally, the PECVD coating or layer can be formed by chemical vapor deposition of a precursor selected from a monocyclic siloxane, a polycyclic siloxane, a polysilsesquioxane, a silatrane, a silquasilatrane, a silproatrane, or a combination of any two or more of these precursors.
In any of the PECVD methods according to the present invention, the applying step optionally can be carried out by vaporizing the precursor and providing it in the vicinity of the substrate. For example, OMCTS is usually vaporized by heating it to about 50° C. before applying it to the PECVD apparatus.
The reaction gas or precursor can also include a hydrocarbon. The hydrocarbon can comprise methane, ethane, ethylene, propane, acetylene, or a combination of two or more of these.
The organosilicon precursor can be delivered at a rate of equal to or less than 10 sccm, optionally equal to or less than 6 sccm, optionally equal to or less than 2.5 sccm, optionally equal to or less than 1.5 sccm, optionally equal to or less than 1.25 sccm. Larger pharmaceutical packages or other vessels or other changes in conditions or scale may require more or less of the precursor. The precursor can be provided at less than 1 Torr absolute pressure.
Other Components of PECVD Reaction Mixture and Ratios of Components
Generally, for a tie coating or layer 289 or pH protective coating or layer 286, O2 can be present in an amount (which can, for example be expressed by the flow rate in sccm) which is less than, or less than one order of magnitude greater than, the organosilicon amount. In contrast, in order to achieve a barrier coating or layer, the amount of O2 typically is at least one order of magnitude higher than the amount of organosilicon precursor. In particular, the volume ratio (in sccm) of organosilicon precursor to O2 for a tie coating or layer 289 or pH protective coating or layer 286, can be in the range from 0.1:1 to 10:1, optionally in the range from 0.3:1 to 8:1, optionally in the range from 0.5:1 to 5:1, optionally from 1:1 to 3:1. The presence of the precursor and O2 in the volume ratios as given in the working examples is specifically suitable to achieve a tie coating or layer 289 or pH protective coating or layer 286. Carrier gas of any embodiment
The tie coating or layer 289 or pH protective coating or layer 286 optionally can be made using a carrier gas. The carrier gas, alternatively referred to as a diluent gas since it is not used to take up or entrain the precursor in the illustrated embodiments, can comprise or consist of an inert gas, for example argon, helium, xenon, neon, another gas that is inert to the other constituents of the process gas under the deposition conditions, or any combination of two or more of these.
In one aspect, a carrier gas is absent in the reaction mixture, in another aspect, it is present. Suitable carrier gases include Argon, Helium and other noble gases such as Neon and Xenon. When the carrier gas is present in the reaction mixture, it is typically present in a volume (in sccm) exceeding the volume of the organosilicon precursor. For example, the ratio of the organosilicon precursor to carrier gas can be from 1:1 to 1:50, optionally from 1:5 to 1:40, optionally from 1:10 to 1:30. One function of the carrier gas is to dilute the reactants in the plasma, encouraging the formation of a coating on the substrate instead of powdered reaction products that do not adhere to the substrate and are largely removed with the exhaust gases.
Since the addition of Argon gas improves the protective performance (see the working examples below), it is believed that additional ionization of the molecule in the presence of Argon contributes to providing a tie coating or layer 289 or pH protective coating or layer 286. The Si—O—Si bonds of the molecule have a high bond energy followed by the Si—C, with the C—H bonds being the weakest. A tie coating or layer 289 or pH protective coating or layer 286, appears to be achieved when a portion of the C—H bonds are broken. This allows the connecting (cross-linking) of the structure as it grows. Addition of oxygen (with the Argon) is understood to enhance this process. A small amount of oxygen can also provide C—O bonding to which other molecules can bond. The combination of breaking C—H bonds and adding oxygen all at low pressure and power leads to a chemical structure that is solid while providing a tie coating or layer 289 or pH protective coating or layer 286.
Oxidizing Gas of any Embodiment
The oxidizing gas can comprise or consist of oxygen (O2 and/or O3 (commonly known as ozone)), nitrous oxide, or any other gas that oxidizes the precursor during PECVD at the conditions employed. The oxidizing gas comprises about 1 standard volume of oxygen. The gaseous reactant or process gas can be at least substantially free of nitrogen.
In any of embodiments, one preferred combination of process gases includes octamethylcyclotetrasiloxane (OMCTS) or another cyclic siloxane as the precursor, in the presence of oxygen as an oxidizing gas and argon as a carrier gas. Without being bound to the accuracy of this theory, the inventors believe this particular combination is effective for the following reasons. The presence of O2, N2O, or another oxidizing gas and/or of a carrier gas, in particular of a carrier gas, for example a noble gas, for example Argon (Ar), is contemplated to improve the resulting pH protective coating or layer.
Some non-exhaustive alternative selections and suitable proportions of the precursor gas, oxygen, and a carrier gas are provided below.
OMCTS: 0.5-5.0 sccm
Oxygen: 0.1-5.0 sccm
Argon: 1.0-20 sccm
RF Power of any Embodiment
The precursor can be contacted with a plasma made by energizing the vicinity of the precursor with electrodes powered at a frequency of 10 kHz to 2.45 GHz, alternatively from about 13 to about 14 MHz.
The precursor can be contacted with a plasma made by energizing the vicinity of the precursor with electrodes powered at radio frequency, optionally at a frequency of from 10 kHz to less than 300 MHz, optionally from 1 to 50 MHz, even optionally from 10 to 15 MHz, optionally at 13.56 MHz.
The precursor can be contacted with a plasma made by energizing the vicinity of the precursor with electrodes supplied with electric power at from 0.1 to 25 W, optionally from 1 to 22 W, optionally from 1 to 10 W, even optionally from 1 to 5 W, optionally from 2 to 4 W, for example of 3 W, optionally from 3 to 17 W, even optionally from 5 to 14 W, for example 6 or 7.5 W, optionally from 7 to 11 W, for example of 8 W, from 0.1 to 500 W, optionally from 0.1 to 400 W, optionally from 0.1 to 300 W, optionally from 1 to 250 W, optionally from 1 to 200 W, even optionally from 10 to 150 W, optionally from 20 to 150 W, for example of 40 W, optionally from 40 to 150 W, even optionally from 60 to 150 W.
The precursor can be contacted with a plasma made by energizing the vicinity of the precursor with electrodes supplied with electric power density at less than 10 W/ml of plasma volume, alternatively from 6 W/ml to 0.1 W/ml of plasma volume, alternatively from 5 W/ml to 0.1 W/ml of plasma volume, alternatively from 4 W/ml to 0.1 W/ml of plasma volume, alternatively from 2 W/ml to 0.2 W/ml of plasma volume, alternatively from 10 W/ml to 50 W/ml, optionally from 20 W/ml to 40 W/ml.
The plasma can be formed by exciting the reaction mixture with electromagnetic energy, alternatively microwave energy.
Other Process Options of any Embodiment
The applying step for applying a coating or layer to the substrate can be carried out by vaporizing the precursor and providing it in the vicinity of the substrate.
The chemical vapor deposition employed can be PECVD and the deposition time can be from 1 to 30 sec, alternatively from 2 to 10 sec, alternatively from 3 to 9 sec. The purposes for optionally limiting deposition time can be to avoid overheating the substrate, to increase the rate of production, and to reduce the use of process gas and its constituents. The purposes for optionally extending deposition time can be to provide a thicker coating or layer for particular deposition conditions.
Gaseous Reactant or Process Gas Limitations of any Embodiment
The plasma for PECVD, if used, can be generated at reduced pressure and the reduced pressure can be less than 300 mTorr, optionally less than 200 mTorr, even optionally less than 100 mTorr. The physical and chemical properties of the tie coating or layer 289, the pH protective coating or layer 286, or a layer serving the function of more than one of these can be set by setting the ratio of O2 to the organosilicon precursor in the gaseous reactant, and/or by setting the electric power used for generating the plasma.
The plasma of any PECVD embodiment can be formed in the vicinity of the substrate. The plasma can in certain cases, especially when preparing a barrier coating or layer, be a non-hollow-cathode plasma. In other certain cases, especially when preparing the tie coating or layer 289, the pH protective coating or layer 286, or a layer serving the function of more than one of these a non-hollow-cathode plasma is not desired. The plasma can be formed from the gaseous reactant at reduced pressure. Sufficient plasma generation power input can be provided to induce coating or layer formation on the substrate.
Relative proportions of gases for producing the tie coating or layer 289 or the pH protective coating or layer 286.
The process gas can contain this ratio of gases for preparing the tie coating or layer 289, the pH protective coating or layer 286, or a layer serving the function of more than one of these:
The tie coating or layer 289, the pH protective coating or layer 286, or a layer serving the function of more than one of these described in this specification can be applied in many different ways. For one example, the low-pressure PECVD process described in U.S. Pat. No. 7,985,188 can be used. For another example, instead of using low-pressure PECVD, atmospheric PECVD can be employed to deposit the tie coating or layer 289, the pH protective coating or layer 286, or a layer serving the function of more than one of these. For another example, the coating can be simply evaporated and allowed to deposit on the SiOx layer to be protected. For another example, the coating can be sputtered on the SiOx layer to be protected.
Process for Applying Tie Coating or Layer 289
The general PECVD process described in this specification is used, for example as follows, to produce a tie or adhesion coating or layer 289 (several names for the same type of coating) on a 1 to 5 mL vessel such as a pharmaceutical vessel or prefilled syringe. A person skilled in the art will know from this description how to scale the process conditions to suit larger or smaller vessels.
The tie or adhesion coating or layer can be produced, for example, using as the precursor tetramethyldisiloxane (TMDSO) or hexamethyldisiloxane (HMDSO) at a flow rate of 0.5 to 10 sccm, preferably 1 to 5 sccm; oxygen flow of 0.25 to 5 sccm, preferably 0.5 to 2.5 sccm; and argon flow of 1 to 120 sccm, preferably in the upper part of this range for a 1 mL vessel and the lower part of this range for a 5 ml. vessel. The overall pressure in the vessel during PECVD can be from 0.01 to 10 Torr, preferably from 0.1 to 1.5 Torr. The power level applied can be from 5 to 100 Watts, preferably in the upper part of this range for a 1 mL vessel and the lower part of this range for a 5 ml. vessel. The deposition time (i.e. “on” time for RF power) is from 0.1 to 10 seconds, preferably 1 to 3 seconds. The power cycle optionally can be ramped or steadily increased from 0 Watts to full power over a short time period, such as 2 seconds, when the power is turned on, which may improve the plasma uniformity. The ramp up of power over a period of time is optional, however.
PECVD Process for Applying Barrier Layer
The PECVD processes described as suitable in U.S. Pat. No. 7,985,188, incorporated by reference here, can be used to apply an SiOx barrier coating or layer 288 as defined in this specification.
PECVD Process for pH Protective Layer
A tie coating or layer 289 or a pH protective coating or layer 286 can be a SiOxCy coating or layer applied as described in any embodiment of this specification. For example, the pH protective coating or layer 286 of any embodiment comprises or consists essentially of a coating or layer of SiOxCy optionally applied over the barrier coating or layer 288 to protect at least a portion of the barrier coating or layer from the pharmaceutical preparation such as 218. The pH protective coating or layer such as 286 is provided, for example, by applying one of the described precursors on or in the vicinity of a substrate in a PECVD process, providing a pH protective coating or layer. The coating can be applied, for example, at a thickness of 1 to 5000 nm, or 10 to 1000 nm, or 10 to 500 nm, or 10 to 200 nm, or 20 to 100 nm, or 30 to 1000 nm, or 30 to 500 nm thick, or 30 to 1000 nm, or 20 to 100 nm, or 80 to 150 nm, and crosslinking or polymerizing (or both) the protective layer, optionally in a PECVD process, to provide a protected surface.
Although not intending to be bound according to the accuracy of the following theory, the inventors contemplate that the pH protective coating or layer 286, applied over an SiOx barrier layer on a vessel wall, functions at least in part by passivating the SiOx barrier layer surface against attack by the contents of the vessel, as well as providing a more resistant or sacrificial independent layer to isolate the SiOx barrier layer from the contents of the vessel. It is thus contemplated that the pH protective coating or layer can be very thin, and even so improve the shelf life of the pharmaceutical package.
Exemplary reaction conditions for preparing a pH protective coating or layer 286 coating or layer according to the present invention in a 3 ml sample size vessel with a ⅛″ diameter tube (open at the end) are as follows:
Flow Rate Ranges:
OMCTS: 0.5-10 sccm
Oxygen: 0.1-10 sccm
Argon: 1.0-200 sccm
Power: 0.1-500 watts
Specific Flow Rates:
OMCTS: 2.0 sccm
Oxygen: 0.7 sccm
Argon: 7.0 sccm
Power: 3.5 watts
The pH protective coating or layer 286 and its application are described in more detail below. A method for applying the coating includes several steps. A vessel wall is provided, as is a reaction mixture comprising plasma forming gas, i.e. an organosilicon compound gas, optionally an oxidizing gas, and optionally a hydrocarbon gas.
Plasma is formed in the reaction mixture that is substantially free of hollow cathode plasma. The vessel wall is contacted with the reaction mixture, and the coating or layer of SiOx is deposited on at least a portion of the vessel wall.
It has been found that acyclic organosiloxanes, for example HMDSO and TMDSO, can be used to form the pH protective coating or layer, as described elsewhere in this specification.
In certain embodiments, the generation of a uniform plasma throughout the portion of the vessel to be coated is contemplated, as it has been found in certain instances to generate a better coating or layer. Uniform plasma means regular plasma that does not include a substantial amount of hollow cathode plasma (which has a higher emission intensity than regular plasma and is manifested as a localized area of higher intensity interrupting the more uniform intensity of the regular plasma).
Additional Embodiments
The pH protective coating or layer 286 described in this specification can be applied in many different ways. For one example, the low-pressure PECVD process described in U.S. Pat. No. 7,985,188 can be used. For another example, instead of using low-pressure PECVD, atmospheric PECVD can be employed to deposit the pH protective coating or layer. For another example, the coating can be simply evaporated and allowed to deposit on the SiOx layer to be protected. For another example, the coating can be sputtered on the SiOx layer to be protected. For still another example, the pH protective coating or layer 286 can be applied from a liquid medium used to rinse or wash the SiOx layer.
Other precursors and methods can be used to apply the pH protective coating or layer or passivating treatment. For example, hexamethylene disilazane (HMDZ) can be used as the precursor. HMDZ has the advantage of containing no oxygen in its molecular structure. This passivation treatment is contemplated to be a surface treatment of the SiOx barrier layer with HMDZ. To slow down and/or eliminate the decomposition of the silicon dioxide coatings at silanol bonding sites, the coating must be passivated. It is contemplated that passivation of the surface with HMDZ (and optionally application of a few mono layers of the HMDZ-derived coating) will result in a toughening of the surface against dissolution, resulting in reduced decomposition. It is contemplated that HMDZ will react with the —OH sites that are present in the silicon dioxide coating, resulting in the evolution of NH3 and bonding of S—(CH3)3 to the silicon (it is contemplated that hydrogen atoms will be evolved and bond with nitrogen from the HMDZ to produce NH3).
It is contemplated that this HMDZ passivation can be accomplished through several possible paths.
One contemplated path is dehydration/vaporization of the HMDZ at ambient temperature. First, an SiOx surface is deposited, for example using hexamethylene disiloxane (HMDSO). The as-coated silicon dioxide surface is then reacted with HMDZ vapor. In an embodiment, as soon as the SiOx surface is deposited onto the article of interest, the vacuum is maintained. The HMDSO and oxygen are pumped away and a base vacuum is achieved. Once base vacuum is achieved, HMDZ vapor is flowed over the surface of the silicon dioxide (as coated on the part of interest) at pressures from the mTorr range to many Torr. The HMDZ is then pumped away (with the resulting NH3 that is a byproduct of the reaction). The amount of NH3 in the gas stream can be monitored (with a residual gas analyzer—RGA—as an example) and when there is no more NH3 detected, the reaction is complete. The part is then vented to atmosphere (with a clean dry gas or nitrogen). The resulting surface is then found to have been passivated. It is contemplated that this method optionally can be accomplished without forming a plasma.
Alternatively, after formation of the SiOx barrier coating or layer, the vacuum can be broken before dehydration/vaporization of the HMDZ. Dehydration/vaporization of the HMDZ can then be carried out in either the same apparatus used for formation of the SiOx barrier coating or layer or different apparatus.
Dehydration/vaporization of HMDZ at an elevated temperature is also contemplated. The above process can alternatively be carried out at an elevated temperature exceeding room temperature up to about 150° C. The maximum temperature is determined by the material from which the coated part is constructed. An upper temperature should be selected that will not distort or otherwise damage the part being coated.
Dehydration/vaporization of HMDZ with a plasma assist is also contemplated. After carrying out any of the above embodiments of dehydration/vaporization, once the HMDZ vapor is admitted into the part, a plasma is generated. The plasma power can range from a few watts to 100+ watts (similar powers as used to deposit the SiOx). The above is not limited to HMDZ and could be applicable to any molecule that will react with hydrogen, for example any of the nitrogen-containing precursors described in this specification.
For depositing a pH protective coating or layer, a precursor feed or process gas can be employed having a standard volume ratio of, for example:
from 0.5 to 10 standard volumes, optionally from 1 to 6 standard volumes, optionally from 2 to 4 standard volumes, optionally equal to or less than 6 standard volumes, optionally equal to or less than 2.5 standard volumes, optionally equal to or less than 1.5 standard volumes, optionally equal to or less than 1.25 standard volumes of the precursor, for example OMCTS or one of the other precursors of any embodiment;
from 0 to 100 standard volumes, optionally from 1 to 80 standard volumes, optionally from 5 to 100 standard volumes, optionally from 10 to 70 standard volumes, of a carrier gas of any embodiment;
from 0.1 to 10 standard volumes, optionally from 0.1 to 2 standard volumes, optionally from 0.2 to 1.5 standard volumes, optionally from 0.2 to 1 standard volumes, optionally from 0.5 to 1.5 standard volumes, optionally from 0.8 to 1.2 standard volumes of an oxidizing agent.
Another embodiment is a pH protective coating or layer of the type made by the above process.
Another embodiment is a vessel such as the vessel 214 (
PECVD Process for Trilayer Coating
The PECVD trilayer coating described in this specification can be applied, for example, as follows for a 1 to 5 mL vessel. Two specific examples are 1 mL thermoplastic resin vessel and a 5 mL thermoplastic resin drug vessel. Larger or smaller vessels will call for adjustments in parameters that a person of ordinary skill can carry out in view of the teaching of this specification.
The apparatus used is the PECVD apparatus with rotating quadrupole magnets as described generally in this specification.
The general coating parameter ranges, with preferred ranges in parentheses, for a trilayer coating for a 1 mL vessel are shown in the PECVD Trilayer Process General Parameters Tables (1 mL vessel and 5 mL vessel).
Trilayer Working Examples
Examples of specific coating parameters that have been used for a 1 mL vessel and 5 mL vessel are shown in the PECVD Trilayer Process Specific Parameters Tables (1 mL vessel and 5 mL vessel):
The O-parameter and N-parameter values for the pH protective coating or layer applied to the 1 mL vessel as described above are 0.34 and 0.55, respectively.
The O-parameter and N-parameter values for the pH protective coating or layer applied to the 5 mL vessel are 0.24 and 0.63, respectively.
Referring to
A vessel having a coating similar to the trilayer coating of
The Vessel Coating Distribution Table shows the breakdown of coating thickness (nm) by vessel location as shown in
The three vessels were each exposed to 1 N potassium hydroxide for four hours, then exposed for 24 hours to a ruthenium oxide (RuO4) stain that darkens any exposed part of the thermoplastic vessel unprotected by the coatings. The high pH potassium hydroxide exposure erodes any exposed part of the barrier coating or layer at a substantial rate, greatly reduced, however by an intact pH protective coating or layer. In particular, the high pH exposure opens up any pinholes in the coating system. As
The rate of erosion of the pH protective coating or layer 286, if directly contacted by the fluid 218, is less than the rate of erosion of the barrier coating 288, if directly contacted by the fluid 218.
The pH protective coating or layer 286 is effective to isolate the fluid 218 from the barrier coating 288.
Optionally for any of the embodiments, at least a portion of the wall 214 of the vessel 250 comprises or consists essentially of a polymer, for example a polyolefin (for example a cyclic olefin polymer, a cyclic olefin copolymer
Optionally for any of the embodiments, the fluid 218 in the lumen such as 212 or 274 has a pH between 5 and 6, optionally between 6 and 7, optionally between 7 and 8, optionally between 8 and 9, optionally between 6.5 and 7.5, optionally between 7.5 and 8.5, optionally between 8.5 and 9.
Optionally for any of the embodiments, the fluid 218 is a liquid at 20° C. and ambient pressure at sea level, which is defined as a pressure of 760 mm Hg.
Optionally for any of the embodiments, the fluid 218 is an aqueous liquid.
Optionally for any of the embodiments, the barrier coating 288 is from 4 nm to 500 nm thick, optionally from 7 nm to 400 nm thick, optionally from 10 nm to 300 nm thick, optionally from 20 nm to 200 nm thick, optionally from 30 nm to 100 nm thick.
Optionally for any of the embodiments, the pH protective coating or layer 286 comprises or consists essentially of SiOxCy. Optionally for any of the embodiments, the pH protective coating or layer 286 comprises or consists essentially of SiNxCy.
Optionally for any of the embodiments, the precursor comprises a monocyclic siloxane, a polycyclic siloxane, a polysilsesquioxane, a monocyclic silazane, a polycyclic silazane, a polysilsesquiazane, a silatrane, a silquasilatrane, a silproatrane, an azasilatrane, an azasilquasiatrane, an azasilproatrane, or a combination of any two or more of these precursors.
Optionally for any of the embodiments, the precursor comprises a monocyclic siloxane, a polycyclic siloxane, a polysilsesquioxane, a Silatrane, a Silquasilatrane, a Silproatrane, or a combination of any two or more of these precursors. Optionally for any of the embodiments, the precursor comprises octamethylcyclotetrasiloxane (OMCTS) or consists essentially of OMCTS. Other precursors described elsewhere in this specification or known in the art are also contemplated for use according to the invention.
Optionally for any of the embodiments, the pH protective coating or layer 286 as applied is between 10 and 1000 nm thick, optionally between 50 and 800 nm thick, optionally between 100 and 700 nm thick, optionally between 300 and 600 nm thick. The thickness does not need to be uniform throughout the vessel, and will typically vary from the preferred values in portions of a vessel.
Optionally for any of the embodiments, the pH protective coating or layer 286 contacting the fluid 218 is between 10 and 1000 nm thick, optionally between 50 and 500 nm thick, optionally between 100 and 400 nm thick, optionally between 150 and 300 nm thick two years after the pharmaceutical package 210 is assembled.
Optionally for any of the embodiments, the rate of erosion of the pH protective coating or layer 286, if directly contacted by a fluid 218 having a pH of 8, is less than 20%, optionally less than 15%, optionally less than 10%, optionally less than 7%, optionally from 5% to 20%, optionally 5% to 15%, optionally 5% to 10%, optionally 5% to 7%, of the rate of erosion of the barrier coating 288, if directly contacted by the same fluid 218 under the same conditions.
Optionally for any of the embodiments, the pH protective coating or layer 286 is at least coextensive with the barrier coating 288. The pH protective coating or layer 286 alternatively can be less extensive than the barrier coating, as when the fluid does not contact or seldom is in contact with certain parts of the barrier coating absent the pH protective coating or layer. The pH protective coating or layer 286 alternatively can be more extensive than the barrier coating, as it can cover areas that are not provided with a barrier coating.
Optionally for any of the embodiments, the pharmaceutical package 210 can have a shelf life, after the pharmaceutical package 210 is assembled, of at least one year, alternatively at least two years.
Optionally for any of the embodiments, the shelf life is measured at 3° C., alternatively at 4° C. or higher, alternatively at 20° C. or higher, alternatively at 23° C., alternatively at 40° C.
Optionally for any of the embodiments, the pH of the fluid 218 is between 5 and 6 and the thickness by TEM of the pH protective coating or layer 286 is at least 80 nm at the end of the shelf life. Alternatively, the pH of the fluid 218 is between 6 and 7 and the thickness by TEM of the pH protective coating or layer 286 is at least 80 nm at the end of the shelf life. Alternatively, the pH of the fluid 218 is between 7 and 8 and the thickness by TEM of the pH protective coating or layer 286 is at least 80 nm at the end of the shelf life. Alternatively, the pH of the fluid 218 is between 8 and 9 and the thickness by TEM of the pH protective coating or layer 286 is at least 80 nm at the end of the shelf life. Alternatively, the pH of the fluid 218 is between 5 and 6 and the thickness by TEM of the pH protective coating or layer 286 is at least 150 nm at the end of the shelf life. Alternatively, the pH of the fluid 218 is between 6 and 7 and the thickness by TEM of the pH protective coating or layer 286 is at least 150 nm at the end of the shelf life. Alternatively, the pH of the fluid 218 is between 7 and 8 and the thickness by TEM of the pH protective coating or layer 286 is at least 150 nm at the end of the shelf life. Alternatively, the pH of the fluid 218 is between 8 and 9 and the thickness by TEM of the pH protective coating or layer 286 is at least 150 nm at the end of the shelf life.
Optionally for any of the embodiments, the fluid 218 removes the pH protective coating or layer 286 at a rate of 1 nm or less of pH protective coating or layer thickness per 44 hours of contact with the fluid 218 (200 nm per year), alternatively 1 nm or less of pH protective coating or layer thickness per 88 hours of contact with the fluid 218 (100 nm per year), alternatively 1 nm or less of pH protective coating or layer thickness per 175 hours of contact with the fluid 218 (50 nm per year), alternatively 1 nm or less of pH protective coating or layer thickness per 250 hours of contact with the fluid 218 (35 nm per year), alternatively 1 nm or less of pH protective coating or layer thickness per 350 hours of contact with the fluid 218 (25 nm per year). The rate of removing the pH protective coating or layer can be determined by TEM from samples exposed to the fluid for known periods.
Optionally for any of the embodiments, the pH protective coating or layer 286 is effective to provide a lower frictional resistance than the uncoated article surface 254. Preferably the frictional resistance is reduced by at least 25%, more preferably by at least 45%, even more preferably by at least 60% in comparison to the uncoated article surface 254. For example, the pH protective coating or layer 286 preferably is effective to reduce the frictional resistance between a portion of the wall 214 contacted by the fluid 218 and a relatively sliding part 258 after the pharmaceutical package 210 is assembled. Preferably, the pH protective coating or layer 286 is effective to reduce the frictional resistance between the wall 214 and a relatively sliding part 258 at least two years after the pharmaceutical package 210 is assembled.
Optionally, in any embodiment the calculated shelf life of the package (total Si/Si dissolution rate) is more than six months, or more than 1 year, or more than 18 months, or more than 2 years, or more than 2½ years, or more than 3 years, or more than 4 years, or more than 5 years, or more than 10 years, or more than 20 years. Optionally, in any embodiment the calculated shelf life of the package (total Si/Si dissolution rate) is less than 60 years.
Any minimum time stated here can be combined with any maximum time stated here, as an alternative embodiment.
Even another embodiment is a medical or diagnostic kit including a vessel having a coating or layer as defined in any embodiment herein on a substrate as defined in any embodiment above. Optionally, the kit additionally includes a medicament or diagnostic agent which is contained in the vessel in contact with the coating or layer; and/or a hypodermic needle, double-ended needle, or other delivery conduit; and/or an instruction sheet.
The substrate can be a pharmaceutical package or other vessel, for protecting a compound or composition contained or received in the vessel with a coating or layer against mechanical and/or chemical effects of the surface of the uncoated substrate.
The substrate can be a pharmaceutical package or other vessel, for preventing or reducing precipitation and/or clotting of a compound or a component of the composition in contact with the inner or interior surface of the vessel. The compound or composition can be a biologically active compound or composition, for example a medicament, for example the compound or composition can comprise insulin, wherein insulin precipitation can be reduced or prevented. Alternatively, the compound or composition can be a biological fluid, for example a bodily fluid, for example blood or a blood fraction wherein blood clotting can be reduced or prevented.
A concern of converting from glass to plastic vessels centers around the potential for leachable materials from plastics. With plasma coating technology, the coatings or layers derived from non-metal gaseous precursors, for example HMDSO or OMCTS or other organosilicon compounds, will itself contain no trace metals and function as a barrier to inorganic, metals and organic solutes, preventing leaching of these species from the coated substrate into vessel fluids. In addition to leaching control of plastic vessels, the same plasma coating or layer technology offers potential to provide a solute barrier to the plunger tip, typically made of elastomeric plastic compositions containing even higher levels of leachable organic oligomers and catalysts.
Moreover, a critical factor in the conversion from glass to plastic vessels will be the improvement of plastic oxygen and moisture barrier performance. The plasma coating technology is suitable to maintain the SiOx barrier coating or layer for protection against oxygen and moisture over an extended shelf life.
Substrate
Vessels Generally
A vessel with a coating or layer as described herein and/or prepared according to a method described herein can be used for reception and/or storage and/or delivery of a compound or composition. The compound or composition can be sensitive, for example air-sensitive, oxygen-sensitive, sensitive to humidity and/or sensitive to mechanical influences. It can be a biologically active compound or composition, for example a pharmaceutical preparation or medicament like insulin or a composition comprising insulin. In another aspect, it can be a biological fluid, optionally a bodily fluid, for example blood or a blood fraction. In certain aspects of the present invention, the compound or composition can be a product to be administrated to a subject in need thereof, for example a product to be injected, like blood (as in transfusion of blood from a donor to a recipient or reintroduction of blood from a patient back to the patient) or insulin.
A vessel as described herein and/or prepared according to a method described herein can further be used for protecting a compound or composition contained in its interior space against mechanical and/or chemical effects of the surface of the vessel material. For example, it can be used for preventing or reducing precipitation and/or clotting or platelet activation of the compound or a component of the composition, for example insulin precipitation or blood clotting or platelet activation.
It can further be used for protecting a compound or composition contained in its interior against the environment outside of the vessel, for example by preventing or reducing the entry of one or more compounds from the environment surrounding the vessel into the interior space of the vessel. Such environmental compound can be a gas or liquid, for example an atmospheric gas or liquid containing oxygen, air, and/or water vapor.
A vessel with a trilayer coating as described herein can also be evacuated and stored in an evacuated state. For example, the trilayer coating or layer allows better maintenance of the vacuum in comparison to a corresponding vessel without a trilayer coating or layer. In one aspect of this embodiment, the vessel with a trilayer coating or layer is a blood collection tube. The tube can also contain an agent for preventing blood clotting or platelet activation, for example EDTA or heparin.
Basic Protocols for Forming and Coating Vessels
The vessels tested in the subsequent working examples were formed and coated according to the following exemplary protocols, except as otherwise indicated in individual examples. Particular parameter values given in the following basic protocols, for example the electric power and gaseous reactant or process gas flow, are typical values. When parameter values were changed in comparison to these typical values, this will be indicated in the subsequent working examples. The same applies to the type and composition of the gaseous reactant or process gas.
In some instances, the reference characters and Figures mentioned in the following protocols and additional details can be found in U.S. Pat. No. 7,985,188.
Protocol for Coating Vessel Interior with SiOx
The apparatus and protocol generally as found in U.S. Pat. No. 7,985,188 were used for coating vessel interiors with an SiOx barrier coating or layer, in some cases with minor variations. A similar apparatus and protocol were used for coating vessels with an SiOx barrier coating or layer, in some cases with minor variations. Protocol for Coating Vessel Interior with OMCTS pH Protective Coating or Layer
Vessels already interior coated with a barrier coating or layer of SiOx, as previously identified, are further interior coated with a pH protective coating or layer as previously identified, generally following the protocols of U.S. Pat. No. 7,985,188 for applying the lubricity coating or layer, except with modified conditions in certain instances as noted in the working examples. The conditions given here are for a COC vessel, and can be modified as appropriate for vessels made of other materials. The apparatus as generally shown in FIGS. 3 and 4 of U.S. Pat. No. 7,985,188 is used to hold a vessel with butt sealing at the base of the vessel. Additionally a cap is provided that seals the end of the vessel (illustrated in present
The vessel is carefully moved into the sealing position over the extended probe or counter electrode 108 of U.S. Pat. No. 7,985,188 and pushed against a plasma screen. The plasma screen is fit snugly around the probe or counter electrode 108 insuring good electrical contact. The probe or counter electrode 108 is grounded to the casing of the RF matching network.
The gas delivery port 110 of U.S. Pat. No. 7,985,188 is connected to a manual ball valve or similar apparatus for venting, a thermocouple pressure gauge and a bypass valve connected to the vacuum pumping line. In addition, the gas system is connected to the gas delivery port 110 allowing the gaseous reactant or process gas, octamethylcyclotetrasiloxane (OMCTS) (or the specific gaseous reactant or process gas reported for a particular example) to be flowed through the gas delivery port 110 (under process pressures) into the interior of the vessel.
The gas system is comprised of a commercially available heated mass flow vaporization system that heats the OMCTS to about 100° C. The heated mass flow vaporization system is connected to liquid octamethylcyclotetrasiloxane (Alfa Aesar® Part Number A12540, 98%). The OMCTS flow rate is set to the specific organosilicon precursor flow reported for a particular example. To ensure no condensation of the vaporized OMCTS flow past this point, the gas stream is diverted to the pumping line when it is not flowing into the interior of the COC vessel for processing.
Once the vessel is installed, the vacuum pump valve is opened to the vessel holder 50 and the interior of the COC vessel of U.S. Pat. No. 7,985,188. A vacuum pump and blower comprise the vacuum pump system. The pumping system allows the interior of the COC vessel to be reduced to pressure(s) of less than 100 mTorr while the gaseous reactant or process gases is flowing at the indicated rates.
Once the base vacuum level is achieved, the vessel holder 50 assembly is moved into the electrode 160 assembly. The gas stream (OMCTS vapor) is flowed into the gas delivery port 110 (by adjusting the 3-way valve from the pumping line to the gas delivery port 110. Pressure inside the COC vessel is approximately 140 mTorr as measured by a capacitance manometer (MKS) installed on the pumping line near the valve that controls the vacuum. In addition to the COC vessel pressure, the pressure inside the gas delivery port 110 and gas system is also measured with the thermocouple vacuum gauge that is connected to the gas system. This pressure is typically less than 6 Torr.
Once the gas is flowing to the interior of the COC vessel, the RF power supply is turned on to its fixed power level. A 600 Watt RF power supply is used (at 13.56 MHz) at a fixed power level indicated in a specific example. The RF power supply is connected to an auto match which matches the complex impedance of the plasma (to be created in the vessel) to the output impedance of the RF power supply. The forward power is as stated and the reflected power is 0 Watts so that the stated power is delivered to the interior of the vessel. The RF power supply is controlled by a laboratory timer and the power on time set to 10 seconds (or a different time stated in a given example).
Upon initiation of the RF power, a uniform plasma is established inside the interior of the vessel. The plasma is maintained for the entire coating time, until the RF power is terminated by the timer. The plasma produces a pH protective coating or layer on the interior of the vessel.
After pH protective coating, the gas flow is diverted back to the vacuum line and the vacuum valve is closed. The vent valve is then opened, returning the interior of the COC vessel to atmospheric pressure (approximately 760 Torr). The treated vessel is then carefully removed from the vessel holder 50 assembly (after moving the vessel holder 50 assembly out of the electrode 160 assembly).
A similar protocol is used, except using apparatus generally like that of FIG. 1 of U.S. Pat. No. 7,985,188, for applying a pH protective coating or layer to vessels.
Protocol for Total Silicon Measurement
This protocol is used to determine the total amount of silicon coatings present on the entire vessel wall. A supply of 0.1 N potassium hydroxide (KOH) aqueous solution is prepared, taking care to avoid contact between the solution or ingredients and glass. The water used is purified water, 18 MΩ) quality. A Perkin Elmer Optima Model 7300DV ICP-OES instrument is used for the measurement except as otherwise indicated.
Each device (vessel, such as a vial, syringe, tube, or the like) to be tested and its closure (in the case of a vessel) or other closure are weighed empty to 0.001 g, then filled completely with the KOH solution (with no headspace), closed with the closure, and reweighed to 0.001 g. In a digestion step, each vessel is placed in an autoclave oven (liquid cycle) at 121° C. for 1 hour. The digestion step is carried out to quantitatively remove the silicon coatings from the vessel wall into the KOH solution. After this digestion step, the vessels are removed from the autoclave oven and allowed to cool to room temperature. The contents of the vessels are transferred into ICP tubes. The total Si concentration is run on each solution by ICP/OES following the operating procedure for the ICP/OES.
The total Si concentration is reported as parts per billion of Si in the KOH solution. This concentration represents the total amount of silicon coatings that were on the vessel wall before the digestion step was used to remove it.
The total Si concentration can also be determined for fewer than all the silicon layers on the vessel, as when an SiOx barrier layer is applied, an SiOxCy second layer (for example, a pH protective coating or layer) is then applied, and it is desired to know the total silicon concentration of just the SiOxCy layer. This determination is made by preparing two sets of vessels, one set to which only the SiOx layer is applied and the other set to which the same SiOx layer is applied, followed by the SiOxCy layer or other layers of interest. The total Si concentration for each set of vessels is determined in the same manner as described above. The difference between the two Si concentrations is the total Si concentration of the SiOxCy second layer.
Protocol for Measuring Dissolved Silicon in a Vessel
In some of the working examples, the amount of silicon dissolved from the wall of the vessel by a test solution is determined, in parts per billion (ppb), for example to evaluate the dissolution rate of the test solution. This determination of dissolved silicon is made by storing the test solution in a vessel provided with an SiOx and/or SiOxCy coating or layer under test conditions, then removing a sample of the solution from the vessel and testing the Si concentration of the sample. The test is done in the same manner as the Protocol for Total Silicon Measurement, except that the digestion step of that protocol is replaced by storage of the test solution in the vessel as described in this protocol. The total Si concentration is reported as parts per billion of Si in the test solution
Protocol for Determining Average Dissolution Rate
The average dissolution rates reported in the working examples are determined as follows. A series of test vessels having a known total silicon measurement are filled with the desired test solution analogous to the manner of filling the vessels with the KOH solution in the Protocol for Total Silicon Measurement. (The test solution can be a physiologically inactive test solution as employed in the present working examples or a physiologically active pharmaceutical preparation intended to be stored in the vessels to form a pharmaceutical package). The test solution is stored in respective vessels for several different amounts of time, then analyzed for the Si concentration in parts per billion in the test solution for each storage time. The respective storage times and Si concentrations are then plotted. The plots are studied to find a series of substantially linear points having the steepest slope.
The plot of dissolution amount (ppb Si) versus days decreases in slope with time, even though it does not appear that the Si layer has been fully digested by the test solution.
For the PC194 test data in Table 10 below, linear plots of dissolution versus time data are prepared by using a least squares linear regression program to find a linear plot corresponding to the first five data points of each of the experimental plots. The slope of each linear plot is then determined and reported as representing the average dissolution rate applicable to the test, measured in parts per billion of Si dissolved in the test solution per unit of time.
Protocol for Determining Calculated Shelf Life
The calculated shelf life values reported in the working examples below are determined by extrapolation of the total silicon measurements and average dissolution rates, respectively determined as described in the Protocol for Total Silicon Measurement and the Protocol for Determining Average Dissolution Rate. The assumption is made that under the indicated storage conditions the SiOxCy pH protective coating or layer will be removed at the average dissolution rate until the coating is entirely removed. Thus, the total silicon measurement for the vessel, divided by the dissolution rate, gives the period of time required for the test solution to totally dissolve the SiOxCy coating. This period of time is reported as the calculated shelf life. Unlike commercial shelf life calculations, no safety factor is calculated. Instead, the calculated shelf life is the calculated time to failure.
It should be understood that because the plot of ppb Si versus hours decreases in slope with time, an extrapolation from relatively short measurement times to relatively long calculated shelf lives is believed to be a “worst case” test that tends to underestimate the calculated shelf life actually obtainable.
Test Methods
Barrier Improvement Factor
The barrier improvement factor (BIF) of a barrier coating or layer can be determined by providing two groups of identical containers, adding a barrier layer to one group of containers, testing a barrier property (such as the rate of outgassing in micrograms per minute or another suitable measure) on containers having a barrier, doing the same test on containers lacking a barrier, and taking a ratio of the properties of the materials with versus without a barrier. For example, if the rate of outgassing through the barrier is one-third the rate of outgassing without a barrier, the barrier has a BIF of 3.
Measurement of Coating Thickness
The thickness of a PECVD coating or layer such as the pH protective coating or layer, the barrier coating or layer, the lubricity coating or layer, and/or a composite of any two or more of these layers can be measured, for example, by transmission electron microscopy (TEM). An exemplary TEM image for a pH protective coating or layer is shown in
The TEM can be carried out, for example, as follows. Samples can be prepared for Focused Ion Beam (FIB) cross-sectioning in two ways. Either the samples can be first coated with a thin layer of carbon (50-100 nm thick) and then coated with a sputtered coating or layer of platinum (50-100 nm thick) using a K575X Emitech primer coating or layer system, or the samples can be coated directly with the protective sputtered Pt layer. The coated samples can be placed in an FEI FIB200 FIB system. An additional coating or layer of platinum can be FIB-deposited by injection of an organometallic gas while rastering the 30 kV gallium ion beam over the area of interest. The area of interest for each sample can be chosen to be a location half way down the length of the vessel. Thin cross sections measuring approximately 15 μm (“micrometers”) long, 2 μm wide and 15 μm deep can be extracted from the die surface using an in-situ FIB lift-out technique. The cross sections can be attached to a 200 mesh copper TEM grid using FIB-deposited platinum. One or two windows in each section, measuring about 8 μm wide, can be thinned to electron transparency using the gallium ion beam of the FEI FIB.
Cross-sectional image analysis of the prepared samples can be performed utilizing either a Transmission Electron Microscope (TEM), or a Scanning Transmission Electron Microscope (STEM), or both. All imaging data can be recorded digitally. For STEM imaging, the grid with the thinned foils can be transferred to a Hitachi HD2300 dedicated STEM. Scanning transmitted electron images can be acquired at appropriate magnifications in atomic number contrast mode (ZC) and transmitted electron mode (TE). The following instrument settings can be used.
For TEM analysis the sample grids can be transferred to a Hitachi HF2000 transmission electron microscope. Transmitted electron images can be acquired at appropriate magnifications. The relevant instrument settings used during image acquisition can be those given below.
SEM Procedure
SEM Sample Preparation: Each vessel sample was cut in half along its length (to expose the inner or interior surface). The top of the vessel (Luer end) was cut off to make the sample smaller.
The sample was mounted onto the sample holder with conductive graphite adhesive, then put into a Denton Desk IV SEM Sample Preparation System, and a thin (approximately 50 Å) gold coating was sputtered onto the inner or interior surface of the vessel. The gold coating is used to eliminate charging of the surface during measurement.
The sample was removed from the sputter system and mounted onto the sample stage of a Jeol JSM 6390 SEM (Scanning Electron Microscope). The sample was pumped down to at least 1×10-6 Torr in the sample compartment. Once the sample reached the required vacuum level, the slit valve was opened and the sample was moved into the analysis station.
The sample was imaged at a coarse resolution first, then higher magnification images were accumulated. The SEM images can be, for example, 5 m edge-to-edge (horizontal and vertical).
XPS
The composition of the SiOx or other barrier coating or layer can be measured, for example, by X-ray photoelectron spectroscopy (XPS).
Silicon Dissolution Rate
As shown in the working examples, the silicon dissolution rate is measured by determining the total silicon leached from the vessel into its contents, and does not distinguish between the silicon derived from the pH protective coating or layer 286, the barrier coating or layer 288, or other materials present.
This application is a continuation-in-part of U.S. Ser. No. 16/029,923, filed Jul. 9, 2018, now pending, which is a continuation of U.S. Ser. No. 15/385,150, filed Dec. 20, 2016, now U.S. patent Ser. No. 10/016,338, which is a continuation of U.S. Ser. No. 14/205,329, filed Mar. 11, 2014, now U.S. Pat. No. 9,554,968, which claims the priority of U.S. Provisional Applications 61/776,733, filed Mar. 11, 2013, and 61/800,746, filed Mar. 15, 2013. This application is also a continuation-in-part of U.S. Ser. No. 14/357,418, filed Nov. 9, 2012, now U.S. patent Ser. No. 10/189,603, which is the U.S. National Stage of International Application No. PCT/US2012/064489, which claims priority to U.S. Ser. No. 61/645,003, filed May 9, 2012, U.S. Ser. No. 61/636,377, filed Apr. 20, 2012, and U.S. Ser. No. 61/558,885, filed Nov. 11, 2011. The entire specification and all the drawings of each application mentioned in this paragraph is incorporated here by reference to provide continuity of disclosure. The specification and drawings of U.S. Ser. No. 12/779,007, filed May 12, 2010, now U.S. Pat. No. 7,985,188, is also incorporated here by reference in its entirety.
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| Number | Date | Country | |
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| 61800746 | Mar 2013 | US | |
| 61645003 | May 2012 | US | |
| 61636377 | Apr 2012 | US | |
| 61558885 | Nov 2011 | US |
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| Parent | 16029923 | Jul 2018 | US |
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