Patent Application
20090116201
This Non-provisional application claims priority under 35 U.S.C. ยง119(a) on Patent Application No(s). 096141530 filed in Taiwan, Republic of China on Nov. 2, 2007, the entire contents of which are hereby incorporated by reference.
1. Field of Invention
The invention relates to a circuit board module and a method for reinforcing the structure thereof.
2. Related Art
By the development of the integrated circuit technology, many kinds of electronic elements can be integrated on a circuit board and applied to various kinds of electronic products. Besides, because the development of electronic products trends towards miniaturization, the circuit board needs to be miniaturized to fit the electronic products. However, if the circuit board is too thin, the structure strength will be insufficient. Thus, the electronic elements formed thereon may be easily damaged due to the improper uses or collisions.
As shown in
However, using the package adhesive 13 to reinforce the structure of the circuit board module 1 causes many drawbacks. Firstly, to form the package adhesive 13 on the circuit board 11 needs three processes of dispensing, baking and cooling. The processes make the manufacturing procedure take a long time and need additional apparatuses for dispensing and baking, which increases the cost. Furthermore, the dispensing process easily makes the package adhesive 13 non-uniform, thereby affecting the following assembling process and the production yield. Alternatively, the package adhesive 13 can be formed by injection molding so as to encapsulate the circuit board. However, utilizing the injection molding technology needs the molds and injection molding apparatuses, which may increase the cost and the production time. Besides, the circuit boards produced by the injection molding can not be repaired, so that the production yield will be decreased.
In view of the foregoing, the invention is to provide a circuit board module and a method for reinforcing the structure thereof that can simplify the manufacturing processes and increase the production yield.
To achieve the above, a circuit board module according to the present invention includes a circuit board and a reinforcing substrate. At least one electronic element is disposed on one surface of the circuit board. The reinforcing substrate is connected to a portion of the surface and disposed around the electronic element.
In addition, the present invention also discloses a method for reinforcing the structure of a circuit board module. The method includes the following steps of: disposing a conductive connection layer on a surface of a circuit board; disposing at least one electronic element and a reinforcing substrate to contact the conductive connection layer; and connecting the electronic element and the reinforcing substrate to the surface of the circuit board.
As mentioned above, the reinforcing substrate of the present invention is connected to the circuit board through the surface mount technology (SMT) so as to reinforce the structure of the circuit board module. Compared with the prior art, the conventional package adhesive is not utilized in the present invention so that the manufacturing processes and the apparatuses of dispensing, baking and cooling are unnecessary. Additionally, the reinforcing substrate and the electronic element can be simultaneously connected to the circuit board to simplify the manufacturing processes and decrease the production time and cost. Furthermore, the usage of the reinforcing substrate can eliminate the non-uniform of the adhesive so that the production yield can be increased. In addition, the reinforcing substrate is provided without utilizing the conventional injection molding, so that the aim of reinforcing the circuit board can be achieved with lower production cost and higher production yield.
The present invention will become more fully understood from the detailed description given herein below and accompanying drawings which are given by way of illustration only, and thus are not limitative of the present invention, and wherein:
The present invention will be apparent from the following detailed description, which proceeds with reference to the accompanying drawings, wherein the same references relate to the same elements.
As shown in
The electronic element 22 is disposed on a surface 211 of the circuit board 21. In the embodiment, the electronic element 22 can be a passive component or an active component. The reinforcing substrate 23 is connected to a portion of the surface 211 and disposed on the circuit board 21 through the SMT. The reinforcing substrate 23 is not limited in materials and shapes in the present invention. The material of the reinforcing substrate 23 is, for example but not limited to, resin, ceramics, metal or alloy.
In the embodiment, the reinforcing substrate 23 is disposed along at least one portion of the circumference of the circuit board 21 and disposed around at least one portion of the electronic element 22 for protecting the electronic element 22. To be noted, the height of the electronic element 22 must be not larger than that of the reinforcing substrate 23. In addition, the reinforcing substrate 23 has a metal layer 231 which is a grounding metal layer to prevent the electromagnetic interference (EMI). The grounding metal layer 231 is electrically connected to a grounding point of the circuit board 21 through a wire or a via (not shown in the drawing) of the reinforcing substrate 23. The material of the reinforcing substrate 23 can include metal or alloy.
As shown in
First, the step S01 is to dispose a conductive connection layer on a surface 211 of the circuit board 21. The conductive connection layer is, for example, a solder paste.
Then, the step S02 is to dispose at least one electronic element 22 and a reinforcing substrate 23 on the surface 211 of the circuit board 21.
Finally, the step S03 is to connect the electronic element 22 and the reinforcing substrate 23 with the surface 211 of the circuit board 21. In the embodiment, the electronic element 22 and the reinforcing substrate 23 are connected with the surface 211 of the circuit board 21 through the reflow process. Accordingly, the electronic element 22 and the reinforcing substrate 23 can be simultaneously connected on the circuit board 21 through the SMT. Because the main features of the reinforcing substrate 23 and the configurations of the reinforcing substrate 23 and the circuit board 21 are illustrated in the previous embodiment, the detailed descriptions thereof are omitted.
In summary, a reinforcing substrate of the invention is connected to a circuit board through the surface mount technology (SMT) so as to reinforce the structure of a circuit board module. Compared with the prior art, the conventional package adhesive is not utilized in the invention so that the manufacturing processes and the apparatuses of dispensing, baking and cooling are unnecessary. Additionally, the reinforcing substrate and the electronic element can be simultaneously connected to the circuit board to simplify the manufacturing processes and decrease the production time and cost. Furthermore, the usage of the reinforcing substrate can eliminate the non-uniform of the adhesive so that the production yield can be increased. Furthermore, the reinforcing substrate has a grounding metal layer to prevent EMI. In addition, the reinforcing substrate is provided without utilizing the conventional injection molding, so that to the aim of reinforcing the circuit board can be achieved with lower production cost and easier reparation.
Although the invention has been described with reference to specific embodiments, this description is not meant to be construed in a limiting sense. Various modifications of the disclosed embodiments, as well as alternative embodiments, will be apparent to persons skilled in the art. It is, therefore, contemplated that the appended claims will cover all modifications that fall within the true scope of the invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 096141530 | Nov 2007 | TW | national |
