This is a Continuation of application Ser. No. 08/364,790, filed Dec. 27, 1994, now abandoned.
Number | Name | Date | Kind |
---|---|---|---|
4617730 | Geldermans et al. | Oct 1986 | |
4664309 | Allen et al. | May 1987 | |
4787853 | Igarashi | Nov 1988 | |
4866841 | Hubbard | Sep 1989 | |
4996391 | Schmidt | Feb 1991 | |
5118027 | Braun et al. | Jun 1992 | |
5177670 | Shinohara et al. | Jan 1993 | |
5485039 | Fujita et al. | Jan 1996 | |
5486723 | Ma et al. | Jan 1996 |
Number | Date | Country |
---|---|---|
60-97656 | May 1985 | JPX |
2-248066 | Oct 1990 | JPX |
3-257989 | Nov 1991 | JPX |
Entry |
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IBM Technical Disclosure Bulletin, "Subsurface Solder I C Module Pin", vol. 28, No. 6, pp. 2603-2604, Nov. 1985. |
IBM Technical Disclosure Bulletin, Subsurface Solder I C Module Pin, vol. 28, No. 6 pp. 2603-2604, Nov., 1985. |
"Flip Chip Attach with Solder Bump on Carrier Via Hole", IBM .RTM. Technical Disclosure Bulletin, vol. 37, No. 06B, Jun. 1994, pp. 159. |
Number | Date | Country | |
---|---|---|---|
Parent | 364790 | Dec 1994 |