This application is a continuation of application Ser. No. 07/515,889, filed Apr. 27, 1990, now abandoned.
Number | Name | Date | Kind |
---|---|---|---|
3361195 | Meyerhoff et al. | Jan 1968 | |
3405323 | Surty et al. | Oct 1968 | |
3626252 | Cath | Dec 1971 | |
4069497 | Steidlitz | Jan 1978 | |
4072188 | Wilson et al. | Feb 1978 | |
4092697 | Spaight | May 1978 | |
4109707 | Wilson et al. | Aug 1978 | |
4138692 | Meeker et al. | Feb 1979 | |
4151547 | Rhodes et al. | Apr 1979 | |
4226281 | Chu | Oct 1980 | |
4233645 | Balderes et al. | Nov 1980 | |
4258411 | Sherman | Mar 1981 | |
4264431 | Babuka et al. | Mar 1981 | |
4323914 | Berndlmaier et al. | Apr 1982 | |
4341432 | Cutchaw | Jul 1982 | |
4381032 | Cutchaw | Apr 1983 | |
4386505 | Little | Jun 1983 | |
4462462 | Meagher et al. | Jul 1984 | |
4468717 | Mathias et al. | Aug 1984 | |
4475152 | Ikegame et al. | Oct 1984 | |
4494171 | Bland et al. | Jan 1985 | |
4531146 | Cutchaw | Jul 1985 | |
4546409 | Yoshino et al. | Oct 1985 | |
4551787 | Mittal et al. | Nov 1985 | |
4558395 | Yamada et al. | Dec 1985 | |
4559580 | Lutfy | Dec 1985 | |
4561011 | Kohara et al. | Dec 1985 | |
4561040 | Eastman et al. | Dec 1985 | |
4567505 | Pease et al. | Jan 1986 | |
4602314 | Broadbent | Jul 1986 | |
4607277 | Hassan et al. | Aug 1986 | |
4612601 | Watari | Apr 1986 | |
4635709 | Altoz | Jan 1987 | |
4639829 | Ostergren | Jan 1987 | |
4730665 | Cutchaw | Mar 1988 | |
4730666 | Flint et al. | Mar 1988 | |
4758926 | Herrell et al. | Jul 1988 | |
4765397 | Chrysler et al. | Aug 1988 | |
4884630 | Nelson et al. | Dec 1989 | |
4923003 | Stenlund | May 1990 | |
4953634 | Nelson et al. | Sep 1990 |
Number | Date | Country |
---|---|---|
0002883 | Jul 1979 | EPX |
0014249 | Aug 1980 | EPX |
966944 | Oct 1982 | SUX |
Entry |
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Anacker, "Liquid Cooling of Integrated Circuit Chips", IBM Technical Disclosure Bulletin, vol. 20, No. 9, Feb. 1978, pp. 3742, 3743. |
D. B. Tuckerman et al, "High-Performance Heat Sinking for VLSI", IEEE Electron Dev. Lett., vol. EDL-2, No. 5, May 1981, pp. 126-129. |
Blodgett et al, "Thermal Conduction Module: A High-Performance Multilayer Ceramic Package", IBM J. Res. Develop., vol. 26, No. 1, Jan., 1982, pp. 30-36. |
H. Martin, "Heat and Mass Transfer Between Impinging Gas Jets and Solid Surfaces", Advance Heat Transfer, vol. 13 (1977). |
R. C. Chu, IBM TDB "Design for Providing Thermal Interface Material Between Narrow Thermal Interface Gaps", vol. 20, No. 7, Dec. 1977, pp. 2761-2762. |
R. C. Chu et al, IBM TDB "Force-Free Solid Thermal Conduction Module", vol. 23, No. 3, Aug. 1980, pp. 1123-1124. |
J. A. Andrews, "Parallel Printed Circuit Manifold", Motorola Technical Developments, vol. 7, Oct. 1987, pp. 22-23. |
"Flexible Manifold System For Supply And Return Connectins To An Array of Liquid-Cooled Heat-Transfer Elements In A Circuit Module", IBM Technical Disclosure Bulletin, vol. 30, No. 5, Oct. 1987, pp. 317-318. |
J. A. McDonald et al, "Custom Tailoring of Chip Temperatures In A Singular Temperature Environment", IBM Technical Disclosure Bulletin, vol. 21, No. 6, Nov. 1978, pp. 2441-2442. |
Number | Date | Country | |
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Parent | 515889 | Apr 1990 |