Claims
- 1. A composition comprising a plurality of electrically-conductive solder particles having substantially uniform sizes and shapes dispersed in a ferrofluid comprising a colloidal suspension of ferromagnetic particles in a non-curable, non-magnetic carrier liquid, which when applied to a surface and arrayed in a regular pattern by application of a substantially uniform magnetic field to the composition forms a monolayer of solder particles which become locked in the regular pattern.
- 2. A composition according to claim 1, wherein the non-curable, non-magnetic carrier liquid is a rosin-based flux.
- 3. A composition according to claim 1, wherein the average particle size of the electrically-conductive solder particles is at least 10 times that of the colloidal ferromagnetic particles.
- 4. A composition according to claim 1, wherein the electrically-conductive solder particles are substantially non-magnetic.
- 5. A composition according to claim 1, capable of conducting electricity in an anisotropic direction.
- 6. A composition according to claim 1, wherein the electrically-conductive solder particles are locked to a substrate in a regular pattern under elevated temperature conditions sufficient to melt the solder particles.
- 7. A composition according to claim 1, wherein the electrically-conductive solder particles locked to a substrate in a regular pattern are capable of conducting electricity in an anisotropic direction.
Priority Claims (2)
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940077 |
Jan 1994 |
IEX |
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940078 |
Jan 1994 |
IEX |
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Parent Case Info
This application is DIVISIONAL OF U.S. application Ser. No. 08/464,733, filed Jun. 29, 1995, now U.S. Pat. No. 5,769,996, which is a National Stage application of PCT/IE95/00009, filed Jan. 25, 1995.
US Referenced Citations (57)
Foreign Referenced Citations (1)
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0208391 |
Jan 1987 |
EPX |
Divisions (1)
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464733 |
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