CONNECTION CONFIGURATION FOR RIGID SUBSTRATES

Abstract

There is provided a configuration in which rigid substrates are connected via flexible substrates, the connection configuration having a pair of rigid substrates each having a predetermined circuit pattern on a front and a reverse surface thereof, a first flexible substrate attached on the front surfaces of the pair of the rigid substrates so as to electrically connect the circuit patterns provided respectively on the front surfaces, a second flexible substrate attached on the reverse surfaces of the pair of the rigid substrates so as to electrically connect the circuit patterns provided respectively on the reverse surfaces. The first and the second substrate have a gap therebetween smaller than a thickness of the pair of the rigid substrates.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

In accompanying drawings:

FIG. 1 is a cross-sectional view of a related-art connection configuration in which rigid substrates are connected with each other via flexible substrates, illustrating where the flexible substrates are unbent;

FIG. 2 is a cross-sectional view of the related-art connection configuration, illustrating where the flexible substrates are bent;

FIG. 3 is a plan view of a connection configuration according to a first embodiment of the present invention;

FIG. 4 is a cross-sectional view of the connection configuration taken along a line A-A;

FIG. 5 is cross-sectional view of the connection configuration according to the first embodiment, illustrating where flexible substrates thereof are bent;

FIG. 6A is an explanatory view of a connection configuration composed so that flexible substrates thereof have a gap equal to a thickness of a first and a second rigid substrate thereof, illustrating where the flexible substrates are unbent;

FIG. 6B is an explanatory view of the connection configuration shown in FIG. 6A, illustrating where the flexible substrates are bent on the assumption that they can bend freely;

FIG. 6C is an explanatory view of the connection configuration shown in FIG. 6A, illustrating that a kink is produced in an inner flexible substrate when the flexible substrates are bent;

FIG. 7 is a fragmentary cross-sectional perspective view of a connection configuration according to a second embodiment of the present invention; and

FIG. 8 is a cross-sectional view of a connection configuration according to a third embodiment of the present invention.

Claims

1. A connection configuration in which rigid substrates are connected via flexible substrates, comprising: a pair of rigid substrates each having a predetermined circuit pattern on a front and a reverse surface thereof,a first flexible substrate attached on the front surfaces of the pair of the rigid substrates so as to electrically connect the circuit patterns provided respectively on the front surfaces,a second flexible substrate attached on the reverse surfaces of the pair of the rigid substrates so as to electrically connect the circuit patterns provided respectively on the reverse surfaces,wherein the first and the second flexible substrate have a gap therebetween smaller than a thickness of the pair of the rigid substrates.

2. The connection configuration as recited in claim 1, wherein the first flexible substrate is attached on the front surfaces adjacent to one side surface of each rigid substrate of the pair of the rigid substrates, the first flexible substrate having a first curved portion in which the first flexible substrate bends from the front surfaces of the rigid substrates toward the reverse surfaces of the rigid substrates and having a second curved portion in which the first flexible substrate bends so as to be substantially parallel with the pair of the rigid substrates,wherein the second flexible substrate is attached on the reverse surfaces adjacent to the side surface of each rigid substrate of the pair of the rigid substrates, the second flexible substrate having a third curved portion in which the second flexible substrate bends from the reverse surfaces of the rigid substrates toward the front surfaces of the rigid substrates and having a fourth curved portion in which the second flexible substrate bends so as to be substantially parallel with the pair of the rigid substrates, andwherein a space substantially determined by the first curved portion, the second curved portion, the third curved portion, the fourth curved portion and the side surface of each of the rigid substrates is filled with a first adhesive.

3. The connection configuration as recited in claim 2, further comprising a reinforcing plate provided in the space filled with the adhesive.

4. The connection configuration as recited in claim 2, wherein the first adhesive filled in the space is a resin, and wherein the first and the second flexible substrates are connected to each other by a lamination structure composed of a second adhesive, a reinforcing plate and a third adhesive laminated in this order, the lamination structure being provided so as to contact with the resin.

5. The connection configuration as recited in claim 1, wherein the first and the second flexible substrates each have a wiring pattern that opposes each other when the first and the second flexible substrate are attached on the pair of the rigid substrates.