In certain types of semiconductor processing chambers that utilize external radio frequency (RF) generators, RF-transmissive windows may be used to form part of the chamber such that RF energy from the RF generators may pass therethrough to cause a plasma within the chamber where a wafer is being processed. Such arrangements may, for example, be used in transformer-coupled plasma (TCP) reactors, in which a coil or other RF-emanating device is positioned above an RF-transmissive window that serves as the top of a semiconductor processing chamber.
Due to the processing conditions within such chambers, such windows may be subjected to high heat loads that may cause the windows to reach unsafe or undesirable temperatures. To counter such thermal effects, cooling systems are typically used that utilize multiple “air amplifiers” or “air multipliers” that direct clean dry air (CDA) provided, for example, by a facility CDA manifold or system, through nozzles at high velocity so that the jetting CDA draws additional ambient air from the facility itself into a common open plenum space above the window so as to cool the window. In an example such conventional cooling system, ˜400-500 standard liters per minute (SLM) of CDA may be flowed through an air amplifier system to draw in an additional 2000 to 2500 SLM of facility ambient air that is used to cool such a window; as a result, between 2400 SLM and 3000 SLM (between 43 and 50 liters per second) of air flow may be flowed across the window being cooled by such a system. The velocity of air flow required to support such flow rates is quite high, and results in such systems generating a large amount of noise, e.g. on the order of 85 dB (comparable to the noise emitted by a milling machine or a food blender), as well as causing potentially undesirable air movement within a semiconductor processing facility due to the large volumes of air being displaced.
Details of one or more implementations of the subject matter described in this specification are set forth in the accompanying drawings and the description below. Other features, aspects, and advantages will become apparent from the description, the drawings, and the claims.
The present inventor conceived of a new and improved cooling system for RF-transmissive windows used in semiconductor processing chambers. The cooling systems discussed hereinbelow may allow the use of air amplifiers to be avoided and may be operated using only CDA from a CDA source, with no use of facility ambient air. These cooling systems are significantly quieter than traditional cooling systems used in such semiconductor processing chambers, generating, in some cases, less than 70 dB, i.e., more than 80% quieter than such traditional cooling systems. In addition to the above benefits that are provided by the cooling systems disclosed herein, such cooling systems may also allow for more uniform cooling of the windows with which they are used, e.g., a window cooled using a representative traditional cooling system may see temperature variations across the entire window of up to 40° C., whereas the same window may see temperature variations across the entire window of less than 15° C. if cooled using an improved cooling system such as one of the cooling systems discussed below. The cooling systems provided 2.0 below may also, generally speaking, be significantly cheaper, involve fewer parts and have a much smaller packaging volume than traditional cooling systems using air amplifiers.
The improved cooling systems discussed below may be generally described as involving a cooling plate having a ceiling portion, e.g., a generally planar surface that is parallel to the plane of the window and offset from the window by some distance to form a gap between the ceiling portion and the window, and one or more sets of walls extending from the ceiling portion towards the window so as to form a plurality of serpentine channels (or passages) that are arranged in one or more circular arrays around a common center axis. The walls may generally span the gap between the window and the ceiling portion, such that the window, in effect, forms a floor for the serpentine channels. In some instances, these structures may be integrated into the window itself, allowing the cooling solution to be an integral part of the window, which may provide for even quieter operation, smaller packaging requirements, and more effective cooling.
Such cooling systems may thus feature one or more annular areas that each have therewithin a circular array of serpentine channels through which CDA (or other fluid, e.g., gas or, in some cases, liquid) may be flowed in order to provide cooling to the window; multiple such annular areas may be provided, each with its own circular array of serpentine channels, for a given cooling system to allow for a “zoned” cooling solution in which different annular regions of the window may be subjected to different degrees of cooling e.g., through varying the volumetric flow rate of the fluid that is flowed through the serpentine channels of each annular region.
In some implementations, an apparatus may be provided that includes a cooling plate having a ceiling portion, one or more sets of walls, and a plurality of fluidic inlets. The walls in each set of walls may define, at least in part, a plurality of serpentine channels. Each serpentine channel may have a first end and a second end, the serpentine channels defined by each set of walls may be arranged in one or more circular patterns centered on a first axis of the cooling plate, the walls in each set of walls may protrude from the ceiling portion in a direction having a major component parallel to the first axis, and each fluidic inlet is fluidically connected with the first end of at least one of the serpentine channels within the cooling plate.
In some implementations, the apparatus may further include a semiconductor processing chamber having a radio-frequency transmissive window, and the cooling plate may be positioned against the window such that the window further defines the serpentine channels.
In some implementations, the apparatus may further include a pressurized air source, and the pressurized air source may be fluidically connected with at least one of the one or more fluidic inlets.
In some implementations, the one or more sets of walls may include a first set of walls and a second set of walls. The first set of walls may occupy a first annular region that has an outer diameter that is smaller than an inner diameter of a second annular region occupied by the second set of walls.
In some implementations, the serpentine channels defined by at least one set of walls of the one or more sets of walls may be open channels.
In some such implementations, the cooling plate may further include one or more floor portions. Each floor portion may be positioned so as to overlap one of the fluidic inlets when viewed along the first axis and offset from the ceiling portion so as to form a gap between the ceiling portion and that floor portion.
In some implementations, the cooling plate may further include a floor portion. In such implementations, the walls may include a first subset of walls that are closest to the first axis and a second subset of walls that are furthest from the first axis, the floor portion may span between the first subset of walls and the second subset of walls, and the walls of each set of walls may span between the ceiling portion and the floor portion.
In some such implementations, the ceiling portion, the floor portion, and the walls of the one or more sets of walls may be made of a material that is transmissive to radio frequency energy.
In some implementations, the one or more sets of walls may include a first set of walls and the first set of walls may define multiple pairs of serpentine channels, with each pair of serpentine channels including a first serpentine channel and a second serpentine channel. In such implementations, the first serpentine channel for each pair of serpentine channels may include a plurality of first and second flow-reversal sections such that fluid flowing from the first end to the second end of that first serpentine channel encounters the first and second flow-reversal sections thereof in an alternating fashion, the second serpentine channel for each pair of serpentine channels may include a plurality of third and fourth flow-reversal sections such that fluid flowing from the first end to the second end of that second serpentine channel encounters the third and fourth flow-reversal sections thereof in an alternating fashion, and the first flow-reversal sections of the first serpentine channel for each pair of serpentine channels and the third flow-reversal sections of the second serpentine channel for that pair of serpentine channels may be fluidically adjacent.
In some implementations, the one or more sets of walls may include a first set of walls and the first set of walls may include multiple subsets of walls, each subset of walls including a first radial wall, a second radial wall, one or more island walls, and one or more pairs of peninsular walls. In such implementations, each first radial wall may extend along a generally radial direction with respect to the first axis, each second radial wall may extend along a generally radial direction with respect to the first axis each pair of peninsular walls of each subset of walls may include a first peninsular wall that extends outward from the first radial wall of that subset of walls and a second peninsular wall that extends outward from the second radial wall of that subset of walls, the first peninsular wall and the second peninsular wall of each pair of peninsular walls of each subset of walls may extend outward and towards each other from the first radial wall of that subset of walls and the second radial wall of that subset of walls, respectively, a gap may exist between the first peninsular wall and the second peninsular wall of each pair of peninsular walls, each island wall of each subset of walls may be located between the first radial wall of that subset of walls and the second radial wall of that subset of walls, a first gap may exist between each island wall of each subset of walls and the first radial wall of that subset of walls, a second gap may exist between each island wall of each subset of walls and the second radial wall of that subset of walls, and the one or more island walls of each subset of walls and one or more pairs of peninsular walls of that subset of walls may be arranged in an alternating fashion along a corresponding second axis that intersects with, and is perpendicular to, the first axis such that one of the one or more island walls of that subset of walls is between every two adjacent pairs of peninsular walls of that subset of walls and one of the one or more pairs of peninsular walls of that subset of walls is between every two adjacent island walls of that subset of walls. In some implementations, the radial walls and the peninsular walls of the first set of walls may all be arcuate and concentric with one another.
In some implementations, the one or more sets of walls may include a first set of walls that includes multiple subsets of walls, each subset of walls including a first radial wall, a second radial wall, one or more first peninsular walls, and one or more second peninsular walls. In such implementations, for each subset of walls, each first radial wall may extend along a generally radial direction with respect to the first axis, each second radial wall may extend along a generally radial direction with respect to the first axis, each first peninsular wall for that subset of walls may extend outward from the first radial wall for that subset of walls towards the second radial wall for that subset of walls, each second peninsular wall for that subset of walls may extend outward from the second radial wall of that subset of walls towards the first radial wall for that subset of walls, each first peninsular wall for that subset of walls and each second peninsular wall for that subset of walls may be separated from the second radial wall for that subset of walls and the first radial wall for that subset of walls, respectively, by a corresponding gap, and the one or more first peninsular walls for that subset of walls and the one or more second peninsular walk for that subset of walls may be arranged in an alternating fashion along a corresponding second axis that intersects with, and is perpendicular to, the first axis such that every two adjacent pairs of peninsular walls for that subset of walls has a portion of one of the one or more island walls for that subset of walls therebetween and every two adjacent island walls for that subset of walls has a portion of one of the one or more pairs of peninsular walls therebetween.
In some implementations of the apparatus, the one or more sets of walls may include a first set of walls that includes multiple subsets of walls, each subset of walls including an inner wall, an outer wall, one or more first radial walls, and one or more second radial walls. In such implementations, for each subset of walls, each first radial wall for that subset of walls may extend radially inward from the outer wall for that subset of walls and with respect to the first axis, each second radial wall for that subset of walls may extend radially outward from the inner wall for that subset of walls and with respect to the first axis the inner wall for that subset of walls may be closer to the first axis than the outer wall for that subset of walls, and the one or more first radial walls for that subset of walls and the one or more second radial walls for that subset of walls may be arranged in an alternating fashion along an arcuate path centered on the first axis.
In some implementations of the apparatus, each set of walls may be (a) a first set of walls, (b) a second set of walls, or (c) a third set of walls. Each first set of walls of (a) may include multiple first subsets of walls, each first subset of walls including a first radial wall, a second radial wall, one or more island walls, and one or more pairs of peninsular walls. For each first subset of walls, each first radial wall may extend along a generally radial direction with respect to the first axis, each second radial wall may extend along a generally radial direction with respect to the first axis, each pair of peninsular walls for that first subset of walls may include a first peninsular wall that extends outward from the first radial wall of that first subset of walls and a second peninsular wall that extends outward from the second radial wall of that first subset of walls, the first peninsular wall and the second peninsular wall of each pair of peninsular walls of that first subset of walls may extend outward and towards each other from the first radial wall of that first subset of walls and the second radial wall of that first subset of walls, respectively, a gap may exist between the first peninsular wall and the second peninsular wall of each pair of peninsular walls for that first subset of walk, each island wall of that first subset of walls may be located between the first radial wall of that first subset of walls and the second radial wall of that first subset of walls, a first gap may exist between each island wall of that first subset of walk and the first radial wall of that first subset of walls, a second gap may exist between each island wall of that first subset of walls and the second radial wall of that first subset of walls, and the one or more island walls of that first subset of walls and one or more pairs of peninsular walls of that first subset of walls may be arranged in an alternating fashion along a corresponding second axis that intersects with, and is perpendicular to, the first axis such that one of the one or more island walls of that first subset of walls is between every two adjacent pairs of peninsular walls of that first subset of walls and one of the one or more pairs of peninsular walls of that first subset of walls is between every two adjacent island walls of that first subset of walls. Each second set of walls of (b) may include multiple second subsets of walls, each second subset of walls including a third radial wall, a fourth radial wall, one or more third peninsular walls, and one or more fourth peninsular walls. For each second subset of walls, each third radial wall may extend along a generally radial direction with respect to the first axis each fourth radial wall may extend along a generally radial direction with respect to the first axis, each third peninsular wall for that second subset of walls may extend outward from the third radial wall for that second subset of walls towards the fourth radial wall for that second subset of walls, each fourth peninsular wall for that second subset of walls may extend outward from the fourth radial wall of that second subset of walls towards the third radial wall for that second subset of walls, each third peninsular wall for that second subset of walls and each fourth peninsular wall for that second subset of walls may be separated from the fourth radial wall for that second subset of walls and the third radial wall for that second subset of walls, respectively, by a corresponding gap, and the one or more third peninsular walls for that second subset of walls and the one or more fourth peninsular walls for that second subset of walls may be arranged in an alternating fashion along a corresponding second axis that intersects with, and is perpendicular to, the first axis such that every two adjacent pairs of peninsular walls for that second subset of walls has a portion of one of the one or more island walls for that second subset of walls therebetween and every two adjacent island walls for that second subset of walls has a portion of one of the one or more pairs of peninsular walls therebetween. Each third set of walk of (c) may include multiple third subsets of walk, each third subset of walls including an inner wall, an outer wall, one or more fifth radial walls, and one or more sixth radial walls. For each third subset of walk, each fifth radial wall for that third subset of walls may extend radially inward from the outer wall for that third subset of walls and with respect to the first axis, each sixth radial wall for that third subset of walls may extend radially outward from the inner wall for that third subset of walls and with respect to the first axis, the inner wall for that third subset of walls may be closer to the first axis than the outer wall for that third subset of walls, and the one or more fifth radial walls for that third subset of walls and the one or more sixth radial walls for that third subset of walls may be arranged in an alternating fashion along an arcuate path centered on the first axis.
As noted earlier, the cooling systems discussed herein may include a cooling plate with a ceiling portion and a plurality of walls extending from the ceiling portion. The walls may extend from the ceiling portion in a direction generally perpendicular to the ceiling portion; when the cooling plate is in an in-use configuration, e.g., placed on top of a window of a semiconductor processing chamber, the walls may extend downwards from the ceiling portion and towards the window. As also noted earlier, such a cooling plate may have one or more sets of walls, with each set of walls defining a plurality of serpentine channels that are distributed in a circular array within a corresponding annular region. Further details and features of such cooling systems are discussed below with respect to the Figures.
As noted above, the cooling plates discussed herein may be used in semiconductor processing chambers or tools that feature an RF-transmissive window that forms part of the chamber, e.g., the ceiling portion; an example of such a piece of equipment is a TCP reactor;
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As discussed, a cooling plate according to the present disclosure may have one or more sets of walls.
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Each set of walls may have within it a plurality of subsets of walls; one or more of the subsets of walls for a given set of walls may be replicated in a circular pattern centered on the first axis 234.
It will be understood that different cooling plates 210 may feature different numbers of subsets of walls 224; in the depicted example, each set of walls 224 includes four subsets of walls 224, but other implementations may include a set or sets of walls that feature more or fewer numbers of subsets, e.g., two subsets, three subsets, five subsets, six subsets, seven subsets, eight subsets, etc. Different sets of walls 224 for the same cooling plate 210 may also, in some implementation, have multiple sets of walls 224, two or more of which may have different numbers of subsets of walls.
The walls 224 of each subset may, depending on the particular implementation, include various specific types of walls. For example, the first subset 262 of walls 224 includes a first radial wall 258, a second radial wall 260, a plurality of first peninsular walls 254, and a plurality of second peninsular walls 256. For clarity, “radial walls,” as the term is used herein, are walls 224 that extend in a generally radial direction with respect to the first axis 234, although such walls do not necessarily have to be parallel to an axis that radiates outward from the first axis 234. Radial walls, as the phrase is used herein, may generally be characterized as being walls that extend from a point along or near the interior of the annular region within which they are located to a point along or near the exterior of the annular region within which they are located; such radial walls may be straight (as in the pictured example), slanted (i.e., at an oblique angle to a radius radiating outward from the first axis 234) or non-linear (for example, alternating short, straight segments in a zig-zag pattern or having a curved profile). Peninsular walls, as the phrase is used herein, may be generally characterized as being walls that have one end that is directly adjacent to or touching another wall while the other end thereof does not touch another wall and is spaced apart therefrom by some distance, thereby giving the appearance of a peninsula.
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It will be appreciated that more or fewer peninsular walls may be used, as desired, depending on packaging constraints and desired cooling efficacy. Furthermore, it will be appreciated that an odd number of peninsular walls may be used as well, if desired. The size of the corresponding gaps 272 may be set to any of a variety of values that do not adversely affect fluid flow through the serpentine channel(s) defined by the walls 224 of the first subset 262. For example, the corresponding gaps 272, in this example, vary somewhat from peninsular wall to peninsular wall, but are generally of a similar size as the radial gap that separates each peninsular wall from its neighboring peninsular wall (or walls).
As with the first subset 262 the second subset 264 of walls 224 also features a first radial wall 258, a second radial wall 260, first peninsular walls 254, and second peninsular walls 256, but the second subset 264 has a slightly different configuration of the peninsular walls and also features island walls 252. Island walls, as the phrase is used herein, refer to walls 224 that are separated from any nearby walls 224 by a gap (at both ends and along both sides). In the second subset 264, the first peninsular walls 254 and the second peninsular walls 256, as with the analogous walls 224 in the first subset 262, extend outward, towards each other, from the first radial wall 258 and the second radial wall 260, respectively, but, unlike the analogous walls 224 in the first subset 262, the first peninsular walls 254 and the second peninsular walls 256 of the second subset 264 are arranged as opposing pairs of walls. Each opposing pair of peninsular walls 254 and 256 are generally symmetric about a radial axis that extends outward from the first axis 234 (similar to the second axis 270 shown passing through the second subset 264). The first peninsular walls 254 and the second peninsular walls 256 of the second subset 264 thus do not overlap one another when viewed along a radial axis radiating out from the first axis 234, thereby causing a gap to exist between the ends of the first peninsular walls 254 and the second peninsular walls 256 of each pair of peninsular walls in the second subset 264.
The island walls 252 may be arranged to be positioned generally midway between the first radial wall 258 and the second radial wall 260, e.g., separated from the first radial wall 258 by a first gap 266 and from the second radial wall 260 by a second gap 268, with the island walls 252 and the pairs of first peninsular walls 254 and second peninsular walls 256 arranged in an alternating fashion along the second axis 270 that passes through the second subset 264.
As likely already apparent, the walls 224 of the cooling plate 210 discussed above may form a plurality of serpentine channels. In the interest of clarity,
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It will be noted that the second serpentine channels 246A and 246B are not actually separated entirely from one another by walls 224—they are, in fact, fluidically adjacent. Fluidically adjacent, as the phrase is used herein, refers to two volumes that are directly adjacent to one another such that they would generally be considered to be sub-volumes of the same fluidic volume. For example, two discrete fluid channels that may each be considered to have their own fluidic volumes might share a common wall for some distance; if a portion of that wall were to be removed, allowing the fluids in each channel to come into contact, the fluidic volumes of each of the channels in that region where the portion of the wall was removed would be considered to be “fluidically adjacent” in the context of this disclosure. Fluids from volumes that are fluidically adjacent may very well cross from one volume to the other, or vice versa. In the case of the second serpentine channels 246A and 246B, the first flow-reversal sections 250 (A and C) are fluidically adjacent, which may allow fluid from the serpentine channel 246A to cross over into the serpentine channel 246B (or vice versa). For the purposes of this disclosure, however, such fluidically adjacent serpentine channels are still considered to be serpentine channels despite the first flow-reversal portions 250 (A and C) being fluidically adjacent. Generally speaking, if the flow rates in each serpentine channel are the same, the fluid that flows through such arrangements of serpentine channels may generally reverse direction in the flow reversal sections, even if there is no wall separating the flow reversal section from an adjacent flow reversal section of another serpentine channel. For example, if two fluid streams are directed towards each other, each fluid stream will push back against the other fluid stream, generally causing the other fluid stream to change direction, e.g., to make a sharp turn away from the path that the fluid stream had been following. In this case, the fluid streams would generally change direction to both flow radially outward until they struck the island wall 252 that defines part of the flow-reversal sections 250, at which point the fluid streams would again generally split apart and travel in opposing directions. As noted above, some fluid from one second serpentine channel 246A or 246B may cross over into the other second serpentine channel 246A or 246B; this is to be expected and should not be viewed as affecting the interpretation
As is evident from the previous example, a cooling plate according to the present disclosure may have walls 224 that are a mixture of arcuate and straight walls that may be arranged to produce serpentine channels that follow predominantly arcuate paths. Other implementations, however, may be configured to generate serpentine channels that predominantly follow other paths, e.g., linear paths. An example of such an alternate cooling plate follows.
The cooling plate 1010, it will be noted, has, as with the cooling plate 210, two sets of walls 1024, although additional sets of walls (or fewer) may be used instead. Unlike the cooling plate 210, in which there were four subsets of walk 224 in each of the two sets of walk 224, each set of walls 1024 in the cooling plate 1010 has six subsets of walls, each of which defines a separate serpentine channel. Additionally, the cooling plate 1010 also features a single fluidic inlet 1030 and a single fluidic outlet 1032 for each subset and each serpentine channel, although other implementations may see fluidic inlets 1030 and/or fluidic outlets 1032 be shared between two subsets or serpentine channels, or may see multiple fluidic inlets 1030 and/or fluidic outlets 1032 provided for a single subset and/or serpentine channel.
As noted above, the cooling plate 1010 exhibits a different arrangement of walls 1024 compared to the cooling plate 210. Such an arrangement is discussed below with respect to
The cooling plates discussed above with respect to the Figures are both designed to be separate components from the windows that each is configured to cool. However, as discussed earlier, other cooling plate designs may be integrated into the window itself.
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The cooling plates discussed herein may be made of a variety of RF-transmissive materials so as to avoid or reduce interference with the transmission of RF energy through the windows with which they are used. Such materials may include, for example, ceramics, such as aluminum oxide or aluminum nitride, quartz, or other material having a similar level of RF transmissivity. It will be recognized that the cooling plates discussed herein may be manufactured using any of a number of manufacturing techniques, including, but not limited to, machining, casting, molding, additive manufacturing (3D printing), and so forth.
As noted earlier, the cooling plates discussed herein may be connected with one or more air sources, e.g. a CDA source, via one or more fluid conduits, e.g., tubes hoses, etc. The flow of cooling fluid, e.g., CDA, to each fluidic inlet of the cooling plate may, in some instances, be regulated by a restrictor plate, valve, or other fluid flow control device or structure. In some instances, a controller may control the flow of fluid to the cooling plate, e.g., by controlling one or more valves.
The controllers discussed above may be part of a system that may include the above-described examples, and may be operatively connected with various valves, mass flow controllers, pumps, etc. so as to be able to receive information from and/or control such equipment. Such systems can include semiconductor processing equipment, including a processing tool or tools, chamber or chambers, a platform or platforms for processing, and/or specific processing components (a wafer pedestal, a gas flow system, etc.). These systems may be integrated with electronics for controlling their operation before, during, and after processing of a semiconductor wafer or substrate. The electronics may be referred to as the “controller,” which may control various components or subparts of the system or systems. The controller, depending on the processing requirements and/or the type of system, may be programmed to control any of the processes disclosed herein, including the delivery of various gases, temperature settings (e.g., heating and/or cooling), pressure settings, vacuum settings, power settings, flow rate settings, fluid delivery settings, and positional and operation settings.
Broadly speaking, the controller may be defined as electronics having various integrated circuits, logic, memory, and/or software that receive instructions, issue instructions, control operation, enable cleaning operations, enable endpoint measurements, and the like. The integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and/or one or more microprocessors, or microcontrollers that execute program instructions (e.g., software). Program instructions may be instructions communicated to the controller in the form of various individual settings (or program files), defining operational parameters for carrying out a particular process on or for a semiconductor wafer or to a system. The operational parameters may, in some implementations, be part of a recipe defined by process engineers to accomplish one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide surfaces, circuits, and/or dies of a wafer.
The controller, in some implementations, may be a part of or coupled to a computer that is integrated with, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller may be in the “cloud” or all or a part of a fab host computer system, which can allow for remote access of the wafer processing. The computer may enable remote access to the system to monitor current progress of fabrication operations, examine a history of past fabrication operations, examine trends or performance metrics from a plurality of fabrication operations, to change parameters of current processing, to set processing steps to follow a current processing, or to start a new process. In some examples, a remote computer (e.g. a server) can provide process recipes to a system over a network, which may include a local network or the Internet. The remote computer may include a user interface that enables entry or programming of parameters and/or settings, which are then communicated to the system from the remote computer. In some examples, the controller receives instructions in the form of data, which specify parameters for each of the processing steps to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be performed and the type of tool that the controller is configured to interface with or control. Thus as described above, the controller may be distributed, such as by comprising one or more discrete controllers that are networked together and working towards a common purpose, such as the processes and controls described herein. An example of a distributed controller for such purposes would be one or more integrated circuits on a chamber in communication with one or more integrated circuits located remotely (such as at the platform level or as part of a remote computer) that combine to control a process on the chamber.
Without limitation, example systems may include a plasma etch chamber or module, a deposition chamber or module, a spin-rinse chamber or module a metal plating chamber or module, a dean chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, a track chamber or module, and any other semiconductor processing systems that may be associated or used in the fabrication and/or manufacturing of semiconductor wafers.
As noted above, depending on the process step or steps to be performed by the tool, the controller might communicate with one or more of other tool circuits or modules, other tool components, duster took, other tool interfaces, adjacent took, neighboring took, took located throughout a factory, a main computer, another controller, or took used in material transport that bring containers of wafers to and from tool locations and/or load ports in a semiconductor manufacturing factory.
For the purposes of this disclosure, the term “fluidically connected” is used with respect to volumes, plenums, holes, etc., that may be connected with one another in order to form a fluidic connection, similar to how the term “electrically connected” is used with respect to components that are connected together to form an electric connection. The term “fluidically interposed,” if used, may be used to refer to a component, volume, plenum, or hole that is fluidically connected with at least two other components, volumes, plenums, or holes such that fluid flowing from one of those other components, volumes, plenums, or holes to the other or another of those components, volumes, plenums, or holes would first flow through the “fluidically interposed” component before reaching that other or another of those components, volumes, plenums, or holes. For example, if a pump is fluidically interposed between a reservoir and an outlet, fluid that flowed from the reservoir to the outlet would first flow through the pump before reaching the outlet.
It is to be understood that the phrases “for each <item> of the one or more <items>,” “each <item> of the one or more <items>,” or the like, if used herein, are inclusive of both a single-item group and multiple-item groups, i.e., the phrase “for . . . each” is used in the sense that it is used in programming languages to refer to each item of whatever population of items is referenced. For example, if the population of items referenced is a single item, then “each” would refer to only that single item (despite the fact that dictionary definitions of “each” frequently define the term to refer to “every one of two or more things”) and would not imply that there must be at least two of those items. Similarly, the term “set” or “subset” should not be viewed, in itself, as necessarily encompassing a plurality of items—it will be understood that a set or a subset can encompass only one member or multiple members (unless the context indicates otherwise).
The use, if any, of ordinal indicators, e.g., (a), (b), (c) . . . or the like, in this disclosure and claims is to be understood as not conveying any particular order or sequence, except to the extent that such an order or sequence is explicitly indicated. For example, if there are three steps labeled (i), (ii), and (iii), it is to be understood that these steps may be performed in any order (or even concurrently, if not otherwise contraindicated) unless indicated otherwise. For example, if step (ii) involves the handling of an element that is created in step (i), then step (ii) may be viewed as happening at some point after step (i). Similarly, if step (i) involves the handling of an element that is created in step (ii), the reverse is to be understood.
Terms such as “about,” “approximately,” “substantially,” “nominal,” or the like, when used in reference to quantities or similar quantifiable properties, are to be understood to be inclusive of values within ±10% of the values or relationship specified (as well as inclusive of the actual values or relationship specified), unless otherwise indicated.
It should be appreciated that all combinations of the foregoing concepts (provided such concepts are not mutually inconsistent) are contemplated as being part of the inventive subject matter disclosed herein. In particular, all combinations of claimed subject matter appearing at the end of this disclosure are contemplated as being part of the inventive subject matter disclosed herein. It should also be appreciated that terminology explicitly employed herein that also may appear in any disclosure incorporated by reference should be accorded a meaning most consistent with the particular concepts disclosed herein.
It is to be further understood that the above disclosure, while focusing on a particular example implementation or implementations, is not limited to only the discussed example, but may also apply to similar variants and mechanisms as well, and such similar variants and mechanisms are also considered to be within the scope of this disclosure.
A PCT Request Form is filed concurrently with this specification as part of the present application. Each application that the present application claims benefit of or priority to as identified in the concurrently filed PCT Request Form is incorporated by reference herein in its entirety and for all purposes.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/US2021/017125 | 2/8/2021 | WO |
| Number | Date | Country | |
|---|---|---|---|
| 62975117 | Feb 2020 | US |