The present application relates to devices having vertically-disposed and other non-horizontally disposed nanofabric articles and to methods of making the same.
Memory devices have been proposed which use nanoscopic wires, such as single-walled carbon nanotubes, to form crossbar junctions to serve as memory cells. (See WO 01/03208, Nanoscopic Wire-Based Devices, Arrays, and Methods of Their Manufacture; and Thomas Rueckes et al., “Carbon Nanotube-Based Nonvolatile Random Access Memory for Molecular Computing,” Science, vol. 289, pp. 94-97, 7 Jul., 2000.) Hereinafter these devices are called nanotube wire crossbar memories (NTWCMs). Under these proposals, individual single-walled nanotube wires suspended over other wires define memory cells. Electrical signals are written to one or both wires to cause them to physically attract or repel relative to one another. Each physical state (i.e., attracted or repelled wires) corresponds to an electrical state. Repelled wires are an open circuit junction. Attracted wires are a closed state forming a rectified junction. When electrical power is removed from the junction, the wires retain their physical (and thus electrical) state thereby forming a non-volatile memory cell.
The NTWCM proposals rely on directed growth or chemical self-assembly techniques to grow the individual nanotubes needed for the memory cells. These techniques are now believed to be difficult to employ at commercial scales using modern technology. Moreover, they may contain inherent limitations such as the length of the nanotubes that may be grown reliably using these techniques, and it may difficult to control the statistical variance of geometries of nanotube wires so grown. Improved memory cell designs are thus desired.
U.S. Patent Publication No. 2003-0021966 discloses, among other things, electromechanical circuits, such as memory cells, in which circuits include a structure having electrically conductive traces and supports extending from a surface of a substrate. Nanotube ribbons are suspended by the supports that cross the electrically conductive traces. Each ribbon comprises one or more nanotubes. The ribbons are formed from selectively removing material from a layer or matted fabric of nanotubes.
For example, as disclosed in U.S. Patent Application Publication No. 2003-0021966, a nanofabric may be patterned into ribbons, and the ribbons can be used as a component to create non-volatile electromechanical memory cells. The ribbon is electromechanically-deflectable in response to electrical stimulus of control traces and/or the ribbon. The deflected, physical state of the ribbon may be made to represent a corresponding information state. The deflected, physical state has non-volatile properties, meaning the ribbon retains its physical (and therefore informational) state even if power to the memory cell is removed. As explained in U.S. Patent Application Publication No. 2003-0124325, three-trace architectures may be used for electromechanical memory cells, in which the two of the traces are electrodes to control the deflection of the ribbon.
The present invention provides new devices having vertically-disposed nanofabric articles and methods of making same.
Under certain aspects of the invention, an electromechanical device, includes a structure having a major horizontal surface and a channel formed therein. A conductive trace is in the channel; and a nanotube article vertically suspended in the channel, in spaced relation to a vertical wall of the channel. The article is electro-mechanically deflectable in a horizontal direction toward the conductive trace.
Under another aspect of the invention, the vertically suspended extent of the nanotube article is defined by a thin film process.
Under another aspect of the invention, the vertically suspended extent of the nanotube article is about 50 nanometers or less.
Under another aspect of the invention, the nanotube article is clamped with a conducting material disposed in porous spaces between some nanotubes of the nanotube article.
Under another aspect of the invention, the nanotube article is formed from a porous nanofabric.
Under another aspect of the invention, the nanotube article is electromechanically deflectable into contact with the conductive trace and the contact is either a volatile state or non-volatile state depending on the device construction.
Under other aspects of the invention, the vertically oriented device is arranged into various forms of three-trace devices.
Under yet other aspects of the invention, the channel may be used for multiple independent devices, or for devices that share a common electrode.
In the Drawing,
Preferred embodiments of the invention provide new articles having non-horizontally-disposed nanotube articles and provide methods of making same. Some embodiments provide improved ways of clamping or pinching suspended nanotube articles to improve their performance and manufacturability. Other embodiments provide electromechanical memory cells, which may be discrete or embedded. Under some embodiments, the discrete memory cells use new approaches to connect to other circuitry or cells, which lowers the resistivity of traces to the memory cells. Still other embodiments provide memory cells that have volatile information state (i.e., the information state is lost when power is interrupted). Some other embodiments use three-trace architectures analogous to those of U.S. Patent Application Publication No. 2003-0124325, in that a nanofabric article may be disposed between the electrodes to cause the article to deflect toward or away from one electrode or the other. These embodiments may utilize a combination of volatile and non-volatile characteristics; for example, information state may be non-volatile, but the device may use a three-trace architecture in which the deflection of the nanotube article may be caused by a trace having volatile state characteristics.
Nanofabrics or ribbons, created by growth or application of individual tubes have been shown to substantially conform to substrate surfaces, such as a surface of a semiconductor substrate. Preferred embodiments of the present make devices such as electromechanical switches and memory cells using nanofabrics that conform to a surface which is substantially perpendicular to a semiconductor substrate (i.e. the nanofabrics are vertically-oriented, relative to a horizontal substrate). Devices and fabrication techniques to develop such vertically-disposed devices are described below, and include the ability to form switches and memory cells having relatively short spans of vertically suspended nanofabric articles with corresponding reductions in gap heights. In some embodiments, this allows for the use of smaller device dimensions and lower electrical resistances (and corresponding decreased cycling times and increased speed, e.g., performance up 100 GHz or more). Volatile and non-volatile switches, and numerous types of devices, examples of which are provided for illustration, can be thus created. In certain preferred embodiments, the articles are substantially a monolayer of carbon nanotubes.
Note that reference to a nanofabric, such as nanofabric article 102, is generally meant to include any suitable structure or article comprising nanotubes, and specifically includes ribbons and nanofabric electrodes containing nanotubes.
Under certain preferred embodiments, a nanofabric article 102 has a span T of less than about 180 nm or smaller and is pinned to insulating support structures 104 and 106 (seen more clearly in
The material of the insulating support structures 104 and 106, likewise, may be made of a variety of materials and into various geometries, but certain preferred embodiments utilize insulating material, such as spin-on-glass (SOG) or silicon nitride or silicon oxide.
As will be explained below, in certain embodiments, the nanofabric article 102, as shown is held to the insulating support structures by friction. In other embodiments, the nanofabric article 102 may be held by other means, such as by anchoring, stitching or pinning the nanofabric to the insulating support structures using any of a variety of techniques.
Specifically, the nanofabric article 102 may be coupled to another material by introducing a matrix material into the spaces between nanotubes in a porous nanofabric to form a conducting composite junction, as described in the references incorporated above. Electrical and mechanical advantages may be obtained by using such composite junctions and connections. In one example, a conducting material is deposited onto the nanofabric and is allowed to penetrate into the spaces within the porous nanofabric, thus forming an improved electrical connection to the nanofabric and reduces contact resistance in the article. In another example, an insulating material is deposited onto the nanofabric and is allowed to penetrate into the spaces within the porous nanofabric, thus forming an improved mechanical pinning contact that increases reliability and manufacturability.
Evaporated or spin-coated material such as metals, semiconductors or insulators especially—silicon, titanium, silicon oxide or polyamide—may be used to increase the pinning strength. The friction interaction can be increased through the use of chemical interactions, including covalent bonding through the use of carbon compounds such as pyrenes or other chemically reactive species. See R. J. Chen et al., “Noncovalent Sidewall Functionalization of Single-Walled Carbon Nanotubes for Protein Immobilization,” J. Am. Chem. Soc., vol. 123, pp. 3838-39 (2001), and Dai et al., Appl. Phys. Lett., vol. 77, pp. 3015-17 (2000), for exemplary techniques for pinning and coating nanotubes by metals. See also WO 01/03208 for techniques.
In some embodiments in which a nanofabric article 102 is spaced apart from and crosses a corresponding, oppositely-disposed electrode, the intersection defines a memory or logic cell, switch or relay. More than one memory cell can be used in arrays or as individual or small groups of interconnected switches depending upon the application such as embedded memory, a two-chip memory device, relays or actuators. The actual number of such cells is immaterial to understanding the invention, but the technology may support devices having information storage capacities at least on the order of modern nonvolatile circuit devices.
By selecting a gap distance 202 in which the strain energy is lower than the adhesion energy the nanofabric article 102 can remain in permanent “non-volatile” contact with the electrode 204. If a larger gap distance 208 were selected, the strain energy increases to such an extent as to allow the nanofabric article 102 to contact the electrode 210 but not to remain in such contact without additional power input, defining a “volatile” condition. In some embodiments, such a volatile switch is preferred and can be combined with non-volatile switches as is necessary to generate particular electronic devices.
The dimensions given above are exemplary and non-limiting, and can be greater or smaller in some embodiments, depending on the application and materials and techniques used. The length of the nanofabric article 102 in these and other vertically-disposed articles can be quite short in comparison to other types of nanofabric articles. In some cases, thin film techniques, such as thin film deposition or etching can be used rather than using lithographic techniques to form the electrodes and gaps spanned by the suspended nanofabric ribbons. In some embodiments the suspended length can be shorter than the length of the nanofabrics used in horizontally disposed devices, such as those in the incorporated reference entitled “Electro-Mechanical Switches and Memory Cells Using Horizontally-Disposed Nanofabric Articles and Methods of Making the Same” (U.S. Provisional Pat. Apl. Ser. No. 60/446,783), filed on Feb. 12, 2003; filed on even date herewith U.S. Apl. Ser. No yet to be assigned). The dependence on thin film deposition rather than lithographic patterning of the devices makes for more facile manufacturing.
A short span of nanofabric can lead to enhanced reliability and vastly increased switching speeds up to 200 GHz for concomitantly lowered gap heights. Also, shorter spans of nanofabric result in reduced electrical resistance to current flowing through the nanofabric. Further embodiments, below, illustrate other types of vertically-disposed articles, and methods of manufacturing the same.
A second tri-trace device 406 (
Compare structure 400, which may be used as non-volatile switch, to structure 406, which includes a volatile switch with gap 208. In structure 406 the gap height 208 between the nanofabric and the electrode 408 has been increased such that the strain energy of the stretched nanofabric overcomes the van der Waals attraction between the fabric and the electrode. The nanofabric forms part of a closed circuit and returns to its non-deflected, open circuit state. It should be noted that the effect of the van der Waals interaction between nanofabrics and other elements can be affected at their interface(s). The effect may be enhanced or diminished; e.g., the attractive force can be diminished by coating the surface of the electrode with a thin layer of oxide or other suitable materials. A purpose of this diminishing of attractive forces may be to create volatile nanoswitches; such volatile switches may be especially useful in applications such as relays, sensors, transistors, etc.
Structure 412 (
In certain embodiments involving a non-volatile cell, there is a high ratio between resistances in the “off” and the “on” states. The differences between resistances in the “off” and “on” states provides a means to read which state a junction is in. In one approach, a “readout” current is applied to the nanofabric or electrode and the voltage across the junction is determined with a “sense amplifier” on the electrodes. Reads are non-destructive, meaning that the cell retains its state, and no write-back operations are needed as is required with semiconductor DRAMs. As alluded to above, the three-trace junctions of preferred embodiments bring their own advantages. By allowing for use of tristate memory cells, more information may be stored or represented by a given cell. Moreover, even if only one of the “on” states were used, three-trace junctions may increase switching speeds from the ability to use both conductive traces in concert to apply forces to move an electromechanically responsive nanofabric 102.
Among other things the structures as shown in
One aspect of the present invention is directed to formation of conductive composite junctions whereby a suitable matrix material is disposed within and around the nanotubes or fibers of a nanofabric or other porous nano material. Such junctions can provide desirable mechanical and/or electrical properties. For example, electrical contact between a nanofabric and a metal connection or activation point may be enhanced, or the contact resistance may be decreased by applying the metal contact as a matrix material impregnating the nanofabric tubes. Also, mechanical contact and strain may be increased as a result of the increased contact between the nanotubes and the matrix material.
Cross-sectional
In
Nanofabric layer 518 conforms to the underlying insulating layer 512 and substantially follows the geometry of cavity 507. Examples of nanofabric articles and methods of manufacturing and using the same can be found in the previously-mentioned and incorporated references. The resulting structure 520 thus includes two vertical portions 518A of the nanofabric 518 which is perpendicular to the major surface of the substrate 501. Devices created using these vertical portions substantially parallel to channel 507 side walls 508, e.g. nano-switches, are termed “vertical” devices or switches.
Since preferred nanofabrics are permeable or porous, the regions 512A of first insulating layer 512 below the regions of nanotube fabric 518A are removable, e.g. by wet etching. Removal of materials from beneath a porous nanofabric has been described by the present applicants in the patent references incorporated above. Suitable wet etching conditions to remove the layers of first insulating layer 512 and second insulating layer 522 leave a suspended nanofabric 558 having vertical height 560 as observed in intermediate structure 562 (
The vertical height 560 is defined by the etching procedure. For a vertical height 560 of 200 nm the thicknesses of first insulating layer 512 and second insulating layer 522 would be approximately 20 nm in order to provide gap distances to create two non-volatile states. Smaller vertical gaps may be preferred in certain embodiments of the invention, e.g. 30 nm gap heights.
Electrode material 566 is deposited into trench 507, leaving gaps 568 between electrode material 566 and suspended nanotube fabric 558 as shown in intermediate structure 570 (
The structure 570 illustrates a pair of vertically-suspended nanofabric portions 572 surrounded by vertical gaps 574, 576 on either side of each portion. The structure may serve as a basis for a pair of bi- or tri-state switching devices as is explained below. The behavior of the switching devices is influenced by the strain in the suspended nanofabric portions and the surrounding gap distances, as discussed herein. Also, many configurations, including common electrode (e.g. 566) configurations may be obtained using the structure 570. It is possible to split structure 570 into two discrete sections (left, right) by a vertical divide running vertically through electrode 566 for example, leaving two bi- or tri-state switches that can be independently operated.
In these and other embodiments, the nature of the resulting devices and switches depends on the construction and arrangement of the electrodes and connections, among other factors. Attention is called to the construction of various types of electrodes in the following embodiments, as an indication of the flexibility of the design and concepts underlying these devices and the variety of their potential uses. For example, some devices share common electrodes between more than one nanofabric article (e.g. two nanofabric switch elements being influenced by a same shared electrode). Other devices have separate electrodes that control the behavior of the nanofabric. One or more electrodes can be used with each nanofabric article to control the article, as mentioned in the incorporated reference entitled “Electromechanical Three-Trace Junction Devices” (U.S. patent application Ser. No. 10/033,323), filed on Dec. 28, 2001.
If vertical height 560 is 200 nm and first insulating layer 512 and second insulating layer 522 are increased to a thickness of about 50 nm the nanotube switch of certain device types would become volatile at the necessary bias voltages because the deflected nanofabric has a strain energy higher than that of the van der Waals force keeping the fabric in contact with metallic region 504 or electrode 566. The thicknesses of first insulating layer 512 and second insulating layer 522 can be adjusted to generate either a non-volatile or volatile condition for a given vertical gap 560 as called for by particular applications with desired electrical characteristics.
Cross-sectional
Cross-sectional
Cross-sectional
Cross-sectional
Cross-sectional
The devices and articles shown in the preceding embodiments are given for illustrative purposes only, and other techniques may be used to produce the same or equivalents thereof. Furthermore, the articles shown may be substituted with other types of materials and geometries in yet other embodiments. For example, rather than using metallic electrodes, some embodiments of the present invention may employ nanotubes. In fact, devices comprising nanotube and nanofabric articles in place of the electrodes shown above can be constructed as well.
In certain embodiments it may be advantageous to utilize such nanofabric electrodes as contacts to portions of a transistor or as part of a transistor or to contact or become part of an interconnect for subsequent sense amplifier or addressing logic circuitry, see e.g. U.S. patent application Ser. No. 10/379,973 entitled, Hybrid Circuit Having Nanotube Electromechanical Memory.
Additional electrodes can provide extra control of a switch or device constructed according to the present description. For example,
As mentioned previously, using vertically-disposed nanofabric articles permits exploitation of the smaller dimensions achievable with thin film technology than with the lithographic techniques used in horizontally-disposed nanofabric articles. For example, returning to
The preferred embodiments are made using nanotube films, layers, or non-woven fabrics so that they form, or may be made to form, various useful patterned components, elements or articles. (Herein “films,” “layers,” or “non-woven fabrics” are referred to as “fabrics” or “nanofabrics”.) The components created from the nanofabrics retain desirable physical properties of the nanotubes and/or the nanofabrics from which they are formed. In addition, preferred embodiments allow modern manufacturing techniques (e.g., those used in semiconductor manufacture) to be employed to utilize the nanofabric articles and devices.
Preferred embodiments of the present invention include articles and methods that increase a strain in the nanofabrics, allowing selectable construction of volatile and non-volatile electromechanical switches, including tri-state or tri-trace switches having both volatile and non-volatile states. The nanofabrics in some embodiments also provide for discrete cellular articles, such as memory cells, to be manufactured.
It will be further appreciated that the scope of the present invention is not limited to the above-described embodiments but rather is defined by the appended claims, and that these claims will encompass modifications and improvements to what has been described.
This application claims priority under 35 U.S.C. §119(e) to U.S. Provisional Pat. Apl., Ser. No. 60/446,786, filed on Feb. 12, 2003, entitled Electro-Mechanical Switches and Memory Cells Using Vertically-Disposed Nanofabric Articles and Methods of Making the Same and to U.S. Pat. Apl. No. 60/446,783, filed on Feb. 12, 2003, entitled Electro-Mechanical Switches and Memory Cells Using Horizontally-Disposed Nanofabric Articles and Methods of Making the Same, which are incorporated herein by reference in their entirety. This application is a continuation and claims priority under 35 U.S.C. §120 to U.S. patent application Ser. No. 10/776,572, filed on Feb. 11, 2004, now U.S. Pat. No. 6,924,538 entitled Devices Having Vertically-Disposed Nanofabric Articles and Methods of Making the Same. This application is a continuation-in-part and claims priority under 35 U.S.C. §120 to the following applications which are expressly incorporated herein by reference in their entirety: U.S. patent application Ser. No. 09/915,093, filed on Jul. 25, 2001, now U.S. Pat. No. 6,919,592 entitled Electromechanical Memory Array Using Nanotube Ribbons and Method for Making Same; U.S. patent application Ser. No. 10/033,323, filed on Dec. 28, 2001, now U.S. Pat. No. 6,911,682 entitled Electromechanical Three-Trace Junction Devices. U.S. patent application Ser. No. 10/128,118, filed Apr. 23, 2002, now U.S. Pat. No. 6,706,402 entitled Nanotube Films and Articles; and U.S. patent application Ser. No. 10/341,005, filed on Jan. 13, 2003, entitled Methods of Making Carbon Nanotube Films, Layers, Fabrics, Ribbons, Elements and Articles.
Number | Name | Date | Kind |
---|---|---|---|
3448302 | Shanefield | Jun 1969 | A |
3740494 | Dunand et al. | Jun 1973 | A |
3892890 | Watanabe et al. | Jul 1975 | A |
3970887 | Smith et al. | Jul 1976 | A |
4324814 | Reichert | Apr 1982 | A |
4378629 | Bozler et al. | Apr 1983 | A |
4495511 | Yoder | Jan 1985 | A |
4510016 | Chi et al. | Apr 1985 | A |
4524431 | Haken et al. | Jun 1985 | A |
4673474 | Ogawa | Jun 1987 | A |
4694427 | Miyamoto et al. | Sep 1987 | A |
4701842 | Olnowich | Oct 1987 | A |
4707197 | Hensel et al. | Nov 1987 | A |
4758534 | Derkits, Jr. et al. | Jul 1988 | A |
4819212 | Nakai et al. | Apr 1989 | A |
4845533 | Pryor et al. | Jul 1989 | A |
4853893 | Eaton, Jr. et al. | Aug 1989 | A |
4876667 | Ross et al. | Oct 1989 | A |
4888630 | Paterson | Dec 1989 | A |
4901121 | Gibson et al. | Feb 1990 | A |
4903090 | Yokoyama | Feb 1990 | A |
4939556 | Eguchi et al. | Jul 1990 | A |
4947226 | Huang et al. | Aug 1990 | A |
4979149 | Popovic et al. | Dec 1990 | A |
4985871 | Catlin | Jan 1991 | A |
5010037 | Lin et al. | Apr 1991 | A |
5031145 | Lever | Jul 1991 | A |
5032538 | Bozler et al. | Jul 1991 | A |
5051956 | Burns et al. | Sep 1991 | A |
5057883 | Noda et al. | Oct 1991 | A |
5089545 | Pol | Feb 1992 | A |
5155561 | Bozler et al. | Oct 1992 | A |
5161218 | Catlin | Nov 1992 | A |
5168070 | Luth et al. | Dec 1992 | A |
5175597 | Cachier et al. | Dec 1992 | A |
5184320 | Dye | Feb 1993 | A |
5196396 | Lieber | Mar 1993 | A |
5198390 | MacDonald et al. | Mar 1993 | A |
5198994 | Natori et al. | Mar 1993 | A |
5216631 | Sliwa, Jr. | Jun 1993 | A |
5252835 | Lieber et al. | Oct 1993 | A |
5271862 | Freese | Dec 1993 | A |
5290715 | Pandya | Mar 1994 | A |
5316979 | MacDonald et al. | May 1994 | A |
5346683 | Green et al. | Sep 1994 | A |
5412785 | Skruhak et al. | May 1995 | A |
5424054 | Bethune et al. | Jun 1995 | A |
5426070 | Shaw et al. | Jun 1995 | A |
5444421 | Carroll et al. | Aug 1995 | A |
5444651 | Yamamoto et al. | Aug 1995 | A |
5453970 | Rust et al. | Sep 1995 | A |
5456986 | Majetich et al. | Oct 1995 | A |
5475341 | Reed | Dec 1995 | A |
5479172 | Smith et al. | Dec 1995 | A |
5482601 | Ohshima et al. | Jan 1996 | A |
5517194 | Carroll et al. | May 1996 | A |
5521602 | Carroll et al. | May 1996 | A |
5533061 | Smith et al. | Jul 1996 | A |
5538916 | Kuroi et al. | Jul 1996 | A |
5547748 | Ruoff et al. | Aug 1996 | A |
5553099 | Carroll et al. | Sep 1996 | A |
5563424 | Yang et al. | Oct 1996 | A |
5586286 | Santeler et al. | Dec 1996 | A |
5589692 | Reed | Dec 1996 | A |
5590078 | Chatter | Dec 1996 | A |
5592642 | Thomas | Jan 1997 | A |
5592643 | Thomas | Jan 1997 | A |
5592644 | Thomas | Jan 1997 | A |
5608246 | Yeager et al. | Mar 1997 | A |
5608888 | Purcell et al. | Mar 1997 | A |
5623638 | Andrade | Apr 1997 | A |
5626670 | Varshney et al. | May 1997 | A |
5626812 | Ebbesen et al. | May 1997 | A |
5640133 | MacDonald et al. | Jun 1997 | A |
5640343 | Gallagher et al. | Jun 1997 | A |
5650958 | Gallagher et al. | Jul 1997 | A |
5651126 | Bailey et al. | Jul 1997 | A |
5652856 | Santeler et al. | Jul 1997 | A |
5676865 | Chang | Oct 1997 | A |
5699317 | Sartore et al. | Dec 1997 | A |
5716708 | Lagow | Feb 1998 | A |
5719073 | Shaw et al. | Feb 1998 | A |
5721862 | Sartore et al. | Feb 1998 | A |
5739057 | Tiwari et al. | Apr 1998 | A |
5747180 | Miller et al. | May 1998 | A |
5751156 | Muller et al. | May 1998 | A |
5753088 | Olk | May 1998 | A |
5780101 | Nolan et al. | Jul 1998 | A |
5781717 | Wu et al. | Jul 1998 | A |
5793697 | Scheuerlein | Aug 1998 | A |
5799209 | Chatter | Aug 1998 | A |
5802583 | Yeager et al. | Sep 1998 | A |
5829125 | Fujimoto et al. | Nov 1998 | A |
5838165 | Chatter | Nov 1998 | A |
5840435 | Lieber et al. | Nov 1998 | A |
5841692 | Gallagher et al. | Nov 1998 | A |
5846849 | Shaw et al. | Dec 1998 | A |
5847454 | Shaw et al. | Dec 1998 | A |
5847565 | Narayanan et al. | Dec 1998 | A |
5850089 | Varshney et al. | Dec 1998 | A |
5850231 | Orimoto et al. | Dec 1998 | A |
5858862 | Westwater et al. | Jan 1999 | A |
5875451 | Joseph | Feb 1999 | A |
5878840 | Tessum et al. | Mar 1999 | A |
5887272 | Sartore et al. | Mar 1999 | A |
5897945 | Lieber et al. | Apr 1999 | A |
5903010 | Flory et al. | May 1999 | A |
5909624 | Yeager et al. | Jun 1999 | A |
5914553 | Adams et al. | Jun 1999 | A |
5925465 | Ebbesen et al. | Jul 1999 | A |
5928450 | Russell | Jul 1999 | A |
5930164 | Zhu | Jul 1999 | A |
5939785 | Klonis et al. | Aug 1999 | A |
5946228 | Abraham et al. | Aug 1999 | A |
5946930 | Anthony | Sep 1999 | A |
5973444 | Xu et al. | Oct 1999 | A |
5985446 | Lagow | Nov 1999 | A |
5993697 | Cohen et al. | Nov 1999 | A |
5994733 | Nishioka et al. | Nov 1999 | A |
5997832 | Lieber et al. | Dec 1999 | A |
6025618 | Chen | Feb 2000 | A |
6031711 | Tennent et al. | Feb 2000 | A |
6031756 | Gimzewski et al. | Feb 2000 | A |
6036774 | Lieber et al. | Mar 2000 | A |
6038060 | Crowley | Mar 2000 | A |
6038637 | Berube et al. | Mar 2000 | A |
6044008 | Choi et al. | Mar 2000 | A |
6048740 | Hsu et al. | Apr 2000 | A |
6049856 | Bolyn | Apr 2000 | A |
6051866 | Shaw et al. | Apr 2000 | A |
6052263 | Gill | Apr 2000 | A |
6052313 | Atsumi et al. | Apr 2000 | A |
6057637 | Zettl et al. | May 2000 | A |
6060724 | Flory et al. | May 2000 | A |
6062931 | Chuang et al. | May 2000 | A |
6063243 | Zettl et al. | May 2000 | A |
6064107 | Yeh et al. | May 2000 | A |
6069380 | Chou et al. | May 2000 | A |
6072718 | Abraham et al. | Jun 2000 | A |
6083624 | Hiura et al. | Jul 2000 | A |
6087293 | Carnahan et al. | Jul 2000 | A |
6088760 | Walker et al. | Jul 2000 | A |
6100109 | Melzner et al. | Aug 2000 | A |
6104633 | Abraham et al. | Aug 2000 | A |
6105381 | Ghoshal | Aug 2000 | A |
6108725 | Chatter | Aug 2000 | A |
6128214 | Kuekes et al. | Oct 2000 | A |
6136160 | Hrkut et al. | Oct 2000 | A |
6138219 | Soman et al. | Oct 2000 | A |
6144481 | Kowarz et al. | Nov 2000 | A |
6146227 | Mancevski | Nov 2000 | A |
6156256 | Kennel | Dec 2000 | A |
6159620 | Heath et al. | Dec 2000 | A |
6159742 | Lieber et al. | Dec 2000 | A |
6165890 | Kohl et al. | Dec 2000 | A |
6166948 | Parkin et al. | Dec 2000 | A |
6177703 | Cunningham | Jan 2001 | B1 |
6183714 | Smalley et al. | Feb 2001 | B1 |
6187823 | Haddon et al. | Feb 2001 | B1 |
6190634 | Lieber et al. | Feb 2001 | B1 |
6198655 | Heath et al. | Mar 2001 | B1 |
6203814 | Fisher et al. | Mar 2001 | B1 |
6203864 | Zhang et al. | Mar 2001 | B1 |
6212597 | Conlin et al. | Apr 2001 | B1 |
6219212 | Gill et al. | Apr 2001 | B1 |
6221330 | Moy et al. | Apr 2001 | B1 |
6226722 | Shippy et al. | May 2001 | B1 |
6231744 | Ying et al. | May 2001 | B1 |
6231980 | Cohen et al. | May 2001 | B1 |
6232706 | Dai et al. | May 2001 | B1 |
6233665 | Bolyn | May 2001 | B1 |
6237130 | Soman et al. | May 2001 | B1 |
6239547 | Uemura et al. | May 2001 | B1 |
6250984 | Jin et al. | Jun 2001 | B1 |
6256767 | Kuekes et al. | Jul 2001 | B1 |
6259277 | Tour et al. | Jul 2001 | B1 |
6262469 | Le et al. | Jul 2001 | B1 |
6265333 | Dzenis et al. | Jul 2001 | B1 |
6277318 | Bower et al. | Aug 2001 | B1 |
6300205 | Fulford et al. | Oct 2001 | B1 |
6314019 | Kuekes et al. | Nov 2001 | B1 |
6320428 | Atsumi et al. | Nov 2001 | B1 |
6322713 | Choi et al. | Nov 2001 | B1 |
6325909 | Li et al. | Dec 2001 | B1 |
6331209 | Jang et al. | Dec 2001 | B1 |
6333016 | Resasco et al. | Dec 2001 | B1 |
6340822 | Brown et al. | Jan 2002 | B1 |
6342276 | You et al. | Jan 2002 | B1 |
6346413 | Fodor et al. | Feb 2002 | B1 |
6348295 | Griffith et al. | Feb 2002 | B1 |
6348700 | Ellenbogen et al. | Feb 2002 | B1 |
6350488 | Lee et al. | Feb 2002 | B1 |
6354133 | Yedur et al. | Mar 2002 | B1 |
6358756 | Sandhu et al. | Mar 2002 | B1 |
6361861 | Gao et al. | Mar 2002 | B2 |
6362073 | Kim et al. | Mar 2002 | B2 |
6376787 | Martin et al. | Apr 2002 | B1 |
6380434 | Chiang et al. | Apr 2002 | B1 |
6394158 | Momeni | May 2002 | B1 |
6400088 | Livingston et al. | Jun 2002 | B1 |
6400091 | Deguchi et al. | Jun 2002 | B1 |
6406776 | D'Evelyn | Jun 2002 | B1 |
6407443 | Chen et al. | Jun 2002 | B2 |
6409567 | Amey et al. | Jun 2002 | B1 |
6413487 | Resasco et al. | Jul 2002 | B1 |
6417606 | Nakamoto et al. | Jul 2002 | B1 |
6420726 | Choi et al. | Jul 2002 | B2 |
6421271 | Gogl et al. | Jul 2002 | B1 |
6422450 | Zhou et al. | Jul 2002 | B1 |
6423583 | Avouris et al. | Jul 2002 | B1 |
6426134 | Lavin et al. | Jul 2002 | B1 |
6426687 | Osborn | Jul 2002 | B1 |
6432740 | Chen | Aug 2002 | B1 |
6440761 | Choi | Aug 2002 | B1 |
6443901 | Fraser | Sep 2002 | B1 |
6445006 | Brandes et al. | Sep 2002 | B1 |
6495116 | Herman | Dec 2002 | B1 |
6495258 | Chen et al. | Dec 2002 | B1 |
6515339 | Shin et al. | Feb 2003 | B2 |
6518156 | Chen et al. | Feb 2003 | B1 |
6528020 | Dai et al. | Mar 2003 | B1 |
6533620 | Franzen et al. | Mar 2003 | B2 |
6541309 | Chen | Apr 2003 | B2 |
6548841 | Frazier et al. | Apr 2003 | B2 |
6559468 | Kuekes et al. | May 2003 | B1 |
6566983 | Shin | May 2003 | B2 |
6574130 | Segal et al. | Jun 2003 | B2 |
6586965 | Kuekes | Jul 2003 | B2 |
6595405 | Terunuma et al. | Jul 2003 | B2 |
6611033 | Hsu et al. | Aug 2003 | B2 |
6630772 | Bower et al. | Oct 2003 | B1 |
6642639 | Choi et al. | Nov 2003 | B2 |
6643165 | Segal et al. | Nov 2003 | B2 |
6645628 | Shiffler, Jr. et al. | Nov 2003 | B2 |
6658634 | Goodnow et al. | Dec 2003 | B1 |
6673424 | Lindsay | Jan 2004 | B1 |
6706402 | Rueckes et al. | Mar 2004 | B2 |
6707098 | Hofmann et al. | Mar 2004 | B2 |
6709566 | Cumings et al. | Mar 2004 | B2 |
6743408 | Lieber et al. | Jun 2004 | B2 |
6750471 | Bethune et al. | Jun 2004 | B2 |
6759693 | Vogeli et al. | Jul 2004 | B2 |
6774052 | Vogeli et al. | Aug 2004 | B2 |
6781166 | Lieber et al. | Aug 2004 | B2 |
6784028 | Rueckes et al. | Aug 2004 | B2 |
6803840 | Jin | Oct 2004 | B2 |
6808746 | Dai et al. | Oct 2004 | B1 |
6809462 | Pelrine et al. | Oct 2004 | B2 |
6809465 | Hunt et al. | Oct 2004 | B2 |
6833558 | Lee et al. | Dec 2004 | B2 |
6835591 | Rueckes et al. | Dec 2004 | B2 |
6858197 | Delzeit | Feb 2005 | B1 |
6863942 | Ren et al. | Mar 2005 | B2 |
6896864 | Clarke | May 2005 | B2 |
6911682 | Rueckes et al. | Jun 2005 | B2 |
6918284 | Snow et al. | Jul 2005 | B2 |
6919284 | Yamamoto et al. | Jul 2005 | B2 |
6919529 | Franzen et al. | Jul 2005 | B2 |
6919730 | Cole et al. | Jul 2005 | B2 |
6919740 | Snider | Jul 2005 | B2 |
6921575 | Horiuchi et al. | Jul 2005 | B2 |
6924538 | Jaiprakash et al. | Aug 2005 | B2 |
6946410 | French et al. | Sep 2005 | B2 |
7048999 | Smalley et al. | May 2006 | B2 |
20010004979 | Han et al. | Jun 2001 | A1 |
20010023123 | Kim | Sep 2001 | A1 |
20010023986 | Mancevski | Sep 2001 | A1 |
20020055010 | Gao et al. | May 2002 | A1 |
20020061441 | Ogura et al. | May 2002 | A1 |
20020068170 | Smalley et al. | Jun 2002 | A1 |
20020081380 | Dillon et al. | Jun 2002 | A1 |
20020081787 | Kohl et al. | Jun 2002 | A1 |
20020088938 | Colbert et al. | Jul 2002 | A1 |
20020090331 | Smalley et al. | Jul 2002 | A1 |
20020092983 | Colbert et al. | Jul 2002 | A1 |
20020092984 | Colbert et al. | Jul 2002 | A1 |
20020096634 | Colbert et al. | Jul 2002 | A1 |
20020098135 | Smalley et al. | Jul 2002 | A1 |
20020102193 | Smalley et al. | Aug 2002 | A1 |
20020102194 | Smalley et al. | Aug 2002 | A1 |
20020102196 | Smalley et al. | Aug 2002 | A1 |
20020102353 | Mauthner et al. | Aug 2002 | A1 |
20020112814 | Hafner et al. | Aug 2002 | A1 |
20020125805 | Hsu | Sep 2002 | A1 |
20020130311 | Lieber et al. | Sep 2002 | A1 |
20020130353 | Lieber et al. | Sep 2002 | A1 |
20020136896 | Takikawa et al. | Sep 2002 | A1 |
20020160111 | Sun et al. | Oct 2002 | A1 |
20020172639 | Horiuchi et al. | Nov 2002 | A1 |
20020172963 | Kelley et al. | Nov 2002 | A1 |
20020173083 | Avouris et al. | Nov 2002 | A1 |
20020175323 | Guillom et al. | Nov 2002 | A1 |
20020175390 | Goldstein et al. | Nov 2002 | A1 |
20020179434 | Dai et al. | Dec 2002 | A1 |
20030004058 | Li et al. | Jan 2003 | A1 |
20030021141 | Segal et al. | Jan 2003 | A1 |
20030021966 | Segal et al. | Jan 2003 | A1 |
20030022428 | Segal et al. | Jan 2003 | A1 |
20030042834 | Dean et al. | Mar 2003 | A1 |
20030091825 | Shiffler et al. | May 2003 | A1 |
20030108480 | Baker et al. | Jun 2003 | A1 |
20030118727 | Ting et al. | Jun 2003 | A1 |
20030122111 | Glatkowski | Jul 2003 | A1 |
20030124325 | Rueckes et al. | Jul 2003 | A1 |
20030124837 | Rueckes et al. | Jul 2003 | A1 |
20030132823 | Hyman et al. | Jul 2003 | A1 |
20030165074 | Segal et al. | Sep 2003 | A1 |
20030180472 | Zhou et al. | Sep 2003 | A1 |
20030198812 | Rueckes et al. | Oct 2003 | A1 |
20030199172 | Rueckes et al. | Oct 2003 | A1 |
20030200521 | DeHon et al. | Oct 2003 | A1 |
20030206436 | Eaton et al. | Nov 2003 | A1 |
20030234407 | Vogeli et al. | Dec 2003 | A1 |
20030236000 | Vogeli et al. | Dec 2003 | A1 |
20040007528 | Bakajin et al. | Jan 2004 | A1 |
20040023514 | Moriya et al. | Feb 2004 | A1 |
20040041154 | Watanabe et al. | Mar 2004 | A1 |
20040071949 | Glatkowski et al. | Apr 2004 | A1 |
20040075159 | Vogeli | Apr 2004 | A1 |
20040077107 | Vogeli | Apr 2004 | A1 |
20040085805 | Segal et al. | May 2004 | A1 |
20040087162 | Vogeli | May 2004 | A1 |
20040099438 | Arthur et al. | May 2004 | A1 |
20040104129 | Gu et al. | Jun 2004 | A1 |
20040159833 | Rueckes et al. | Aug 2004 | A1 |
20040164289 | Rueckes et al. | Aug 2004 | A1 |
20040175856 | Jaiprakash et al. | Sep 2004 | A1 |
20040181630 | Jaiprakash et al. | Sep 2004 | A1 |
20040191978 | Rueckes et al. | Sep 2004 | A1 |
20040214366 | Segal et al. | Oct 2004 | A1 |
20040214367 | Segal et al. | Oct 2004 | A1 |
20040238907 | Pinkerton et al. | Dec 2004 | A1 |
20040253167 | Silva et al. | Dec 2004 | A1 |
20040265550 | Glatkowski et al. | Dec 2004 | A1 |
20050007002 | Golovchenko et al. | Jan 2005 | A1 |
20050035344 | Bertin et al. | Feb 2005 | A1 |
20050035367 | Bertin et al. | Feb 2005 | A1 |
20050035786 | Bertin et al. | Feb 2005 | A1 |
20050035787 | Bertin et al. | Feb 2005 | A1 |
20050036365 | Bertin et al. | Feb 2005 | A1 |
20050037547 | Bertin et al. | Feb 2005 | A1 |
20050040874 | Allison et al. | Feb 2005 | A1 |
20050041465 | Rueckes et al. | Feb 2005 | A1 |
20050041466 | Rueckes et al. | Feb 2005 | A1 |
20050047244 | Rueckes et al. | Mar 2005 | A1 |
20050052894 | Segal et al. | Mar 2005 | A1 |
20050053525 | Segal et al. | Mar 2005 | A1 |
20050056825 | Bertin et al. | Mar 2005 | A1 |
20050056866 | Bertin et al. | Mar 2005 | A1 |
20050056877 | Rueckes et al. | Mar 2005 | A1 |
20050058590 | Sen et al. | Mar 2005 | A1 |
20050058797 | Sen et al. | Mar 2005 | A1 |
20050058834 | Rueckes et al. | Mar 2005 | A1 |
20050059176 | Rueckes et al. | Mar 2005 | A1 |
20050059210 | Rueckes et al. | Mar 2005 | A1 |
20050062035 | Bertin et al. | Mar 2005 | A1 |
20050062062 | Bertin et al. | Mar 2005 | A1 |
20050062070 | Bertin et al. | Mar 2005 | A1 |
20050063210 | Segal et al. | Mar 2005 | A1 |
20050063244 | Bertin et al. | Mar 2005 | A1 |
20050065742 | Segal et al. | Mar 2005 | A1 |
20050068128 | Yip | Mar 2005 | A1 |
20050074926 | Bertin et al. | Apr 2005 | A1 |
20050095938 | Rosenberger et al. | May 2005 | A1 |
20050101112 | Rueckes et al. | May 2005 | A1 |
20050128788 | Segal et al. | Jun 2005 | A1 |
20050174842 | Bertin et al. | Aug 2005 | A1 |
20050191495 | Rueckes et al. | Sep 2005 | A1 |
20050237781 | Bertin et al. | Oct 2005 | A1 |
20050269553 | Sen et al. | Dec 2005 | A1 |
20050269554 | Sen et al. | Dec 2005 | A1 |
20050270824 | Bertin et al. | Dec 2005 | A1 |
20050279988 | Bertin | Dec 2005 | A1 |
20050280436 | Bertin | Dec 2005 | A1 |
20050281084 | Rueckes et al. | Dec 2005 | A1 |
20050282515 | Bertin | Dec 2005 | A1 |
20050282516 | Bertin | Dec 2005 | A1 |
20060044035 | Bertin | Mar 2006 | A1 |
20060052509 | Saitoh | Mar 2006 | A1 |
20060061389 | Bertin | Mar 2006 | A1 |
20060125033 | Segal et al. | Jun 2006 | A1 |
20060128049 | Jaiprakash et al. | Jun 2006 | A1 |
20060183278 | Bertin et al. | Aug 2006 | A1 |
20060193093 | Bertin et al. | Aug 2006 | A1 |
20060204427 | Ghenciu et al. | Sep 2006 | A1 |
20060231865 | Rueckes et al. | Oct 2006 | A1 |
20060237805 | Segal et al. | Oct 2006 | A1 |
20060250843 | Bertin et al. | Nov 2006 | A1 |
20060250856 | Bertin et al. | Nov 2006 | A1 |
20060255834 | Bertin | Nov 2006 | A1 |
20060276056 | Ward et al. | Dec 2006 | A1 |
20070015303 | Bertin et al. | Jan 2007 | A1 |
Number | Date | Country |
---|---|---|
0217023 | Apr 1987 | EP |
0269255 | Jun 1988 | EP |
0296716 | Dec 1988 | EP |
0315392 | May 1989 | EP |
426282 | May 1991 | EP |
441409 | Aug 1991 | EP |
0613130 | Aug 1994 | EP |
0655187 | May 1995 | EP |
0688618 | Dec 1995 | EP |
758028 | Feb 1997 | EP |
0945402 | Sep 1999 | EP |
0947466 | Oct 1999 | EP |
0989579 | Mar 2000 | EP |
1046613 | Oct 2000 | EP |
1052520 | Nov 2000 | EP |
1054249 | Nov 2000 | EP |
1059266 | Dec 2000 | EP |
1061040 | Dec 2000 | EP |
1061043 | Dec 2000 | EP |
1061044 | Dec 2000 | EP |
1061544 | Dec 2000 | EP |
1061555 | Dec 2000 | EP |
1069206 | Jan 2001 | EP |
1072693 | Jan 2001 | EP |
1096533 | May 2001 | EP |
1100106 | May 2001 | EP |
1100297 | May 2001 | EP |
1132920 | Sep 2001 | EP |
1205436 | May 2002 | EP |
1209123 | May 2002 | EP |
1225613 | Jul 2002 | EP |
2364933 | Feb 2002 | GB |
11011917 | Jan 1999 | JP |
WO-9502709 | Jan 1995 | WO |
WO-9638410 | Dec 1996 | WO |
WO-9641043 | Dec 1996 | WO |
WO-9709272 | Mar 1997 | WO |
WO-9722971 | Jun 1997 | WO |
WO-9731139 | Aug 1997 | WO |
WO-9743473 | Nov 1997 | WO |
WO-9826871 | Jun 1998 | WO |
WO-9839250 | Sep 1998 | WO |
WO-9839251 | Sep 1998 | WO |
WO-9842620 | Oct 1998 | WO |
WO-9844593 | Oct 1998 | WO |
WO-9848456 | Oct 1998 | WO |
WO-9906618 | Feb 1999 | WO |
WO-9947570 | Sep 1999 | WO |
WO-9948810 | Sep 1999 | WO |
WO-9958748 | Nov 1999 | WO |
WO-9965821 | Dec 1999 | WO |
WO-0008650 | Feb 2000 | WO |
WO-0009443 | Feb 2000 | WO |
WO-0017101 | Mar 2000 | WO |
WO-0019494 | Apr 2000 | WO |
WO-0044094 | Jul 2000 | WO |
WO-0048195 | Aug 2000 | WO |
WO-0063115 | Oct 2000 | WO |
WO-0073204 | Dec 2000 | WO |
WO 0103208 | Jan 2001 | WO |
WO-0118246 | Mar 2001 | WO |
WO-0123303 | Apr 2001 | WO |
WO 0144796 | Jun 2001 | WO |
WO-0219420 | Mar 2002 | WO |
WO-0237500 | May 2002 | WO |
WO-0238496 | May 2002 | WO |
WO-0242204 | May 2002 | WO |
WO-0248701 | Jun 2002 | WO |
WO-0248822 | Jun 2002 | WO |
WO-02054505 | Jul 2002 | WO |
WO-02059898 | Aug 2002 | WO |
WO-02060812 | Aug 2002 | WO |
WO-02060813 | Aug 2002 | WO |
WO 2004065657 | Aug 2004 | WO |
WO-2004065671 | Aug 2004 | WO |
Number | Date | Country | |
---|---|---|---|
20070018260 A1 | Jan 2007 | US |
Number | Date | Country | |
---|---|---|---|
60446786 | Feb 2003 | US | |
60446783 | Feb 2003 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 10776572 | Feb 2004 | US |
Child | 11158544 | US | |
Parent | 11158544 | US | |
Child | 11158544 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 10341005 | Jan 2003 | US |
Child | 11158544 | US | |
Parent | 10128118 | Jan 2003 | US |
Child | 10341005 | US | |
Parent | 10033323 | Dec 2001 | US |
Child | 10128118 | US | |
Parent | 09915093 | Jul 2001 | US |
Child | 10033323 | US |