Number | Date | Country | Kind |
---|---|---|---|
98-1544 | Jan 1998 | KR |
This application is a continuation-in-part of application No. 09/196,330 filed on Nov. 19, 1998, now abandoned the entire contents of which are hereby incorporated by reference.
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5502004 | Park | Mar 1996 | A |
5605724 | Hong et al. | Feb 1997 | A |
5637533 | Choi | Jun 1997 | A |
5665628 | Summerfelt | Sep 1997 | A |
5753945 | Chivukula et al. | May 1998 | A |
5892254 | Park et al. | Apr 1999 | A |
5985758 | Kim | Nov 1999 | A |
6051492 | Park et al. | Apr 2000 | A |
6177284 | Horii et al. | Jan 2001 | B1 |
Number | Date | Country |
---|---|---|
0722190 | Jul 1996 | EP |
7335759 | Dec 1995 | JP |
8139092 | May 1996 | JP |
Entry |
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E. Kolowa et al. “Sputtered Ta-Si-N Diffusion Barriers in Cu Metallizations for Si”, IEE Electron Device Letters, vol. 12. No. 6, Jun. 1991.* |
Stanley Wolf et al, “Silicon Processing for the VLSI Era”, vol. 1: Process Technology, pp. 175, 176, and 261. |
Stanley Wolf et al, “Silicon Processing for the VLSI Era”, vol. 2: Process Integration, pp. 121-125. |
McGraw-Hill, Inc., “VLSI Technology”, Second Edition, pp. 16, and 308-310. |
Number | Date | Country | |
---|---|---|---|
Parent | 09/196330 | Nov 1998 | US |
Child | 09/233040 | US |